EP1K100FC484-2

The EP1K100FC484-2 is an ACEX-1K programmable logic device optimized for cost-sensitive system integration. It provides a balanced combination of logic capacity, embedded memory, and I/O density in a compact 484-ball BGA package for surface-mount assembly.

Built for applications that require on-chip memory, flexible I/O signaling, and reconfigurability, this device is suitable for system-on-a-programmable-chip (SOPC) integration, communications interfaces, and other designs that leverage embedded array blocks and a moderate logic fabric.

Key Features

• Logic Capacity — 4,992 logic elements (approximately 257,000 maximum system gates), delivering mid-range programmable logic density for glue logic, protocol handling, and custom peripherals.
• Embedded Memory — Approximately 49,152 bits of on-chip RAM across embedded array blocks (EABs) with dual-port capability and up to 16-bit width per EAB for efficient implementation of FIFOs, buffers, and megafunctions.
• I/O Density & Flexibility — Up to 333 user I/O pins with MultiVolt I/O support to interface with 2.5-V, 3.3-V, or 5.0-V devices, enabling mixed-voltage system designs and broad peripheral compatibility.
• Clocking & Performance Options — Built-in low-skew clock distribution trees, options such as ClockLock™ and ClockBoost™ for reduced clock delay/skew, and dedicated carry and cascade chains for efficient arithmetic and high-fan-in logic.
• Reconfiguration & Testability — In-circuit reconfigurability (ICR) via external configuration devices or the JTAG port, plus built-in JTAG boundary-scan test (BST) compliant with IEEE Std. 1149.1-1990 for board-level test and debug.
• Package & Mounting — 484-ball BGA (supplier package: 484-FBGA 23×23) in a surface-mount form factor, supporting compact board layouts and high I/O count in a small footprint.
• Power & Supply — Device core supply specified at 2.375 V to 2.625 V with on-chip 2.5-V internal supply operation and programmable output options for power-efficient designs.
• Compliance & Environmental — RoHS-compliant manufacturing and commercial operating grade with an operating temperature range of 0 °C to 70 °C.

Typical Applications

• Communications Equipment — Implement protocol interfaces, buffering, and packet processing using the device’s embedded RAM and logic fabric for high-performance communications subsystems.
• System-on-a-Programmable-Chip (SOPC) — Integrate custom peripherals, memory blocks, and control logic on a single device to reduce board-level complexity and BOM.
• Embedded Memory and Buffering — Use dual-port EABs for FIFOs, dual-ported memories, and other memory-intensive functions where on-chip RAM reduces external memory requirements.
• Mixed-Voltage I/O Interfaces — Connect 2.5-V, 3.3-V, or 5.0-V peripherals directly using MultiVolt I/O to simplify level translation and interface design.

Unique Advantages

• Highly Integrated Logic and Memory: Combines 4,992 logic elements with ~49 Kbits of embedded RAM to consolidate logic and memory functions on a single device.
• High I/O Count with Voltage Flexibility: 333 user I/Os and MultiVolt capability enable broad peripheral connectivity without additional level-shifting components.
• Reconfigurable and Test-Friendly: In-circuit reconfigurability and IEEE 1149.1-compliant JTAG support streamline development, production programming, and board-level test.
• Dedicated Arithmetic and Routing Resources: Carry and cascade chains plus FastTrack® interconnect support efficient implementation of adders, counters, and high-fan-in logic while keeping timing predictable.
• Compact, Surface-Mount Package: 484-ball BGA (23×23) provides a high-pin-count solution in a compact footprint for space-constrained designs.
• RoHS Compliant, Commercial Grade: Suitable for commercial-temperature applications operating from 0 °C to 70 °C with RoHS-compliant materials.

Why Choose EP1K100FC484-2?

The EP1K100FC484-2 delivers a practical balance of programmable logic, embedded memory, and I/O density for mid-range FPGA applications. With nearly 5,000 logic elements, ~49 Kbits of on-chip RAM, and 333 I/Os in a compact 484-BBGA package, it is well suited to designers building SOPC solutions, communications interfaces, and memory-heavy logic blocks who need a reconfigurable, testable, and RoHS-compliant device.

Its combination of MultiVolt I/O flexibility, dedicated arithmetic/cascade resources, and in-circuit reconfigurability makes it a dependable choice for reducing board-level complexity while maintaining the ability to iterate designs through programmable updates.

Request a quote or submit an RFQ to obtain pricing, availability, and lead-time information for the EP1K100FC484-2 through your preferred procurement channel.