EP1K100FC484-2NGZ

IC FPGA 333 I/O 484FBGA
Part Description

ACEX-1K® Field Programmable Gate Array (FPGA) IC 333 49152 4992 484-BBGA

Quantity 568 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 70°C
Package / Case484-BBGANumber of I/O333Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs624Number of Logic Elements/Cells4992
Number of Gates257000ECCNOBSOLETEHTS Code0000.00.0000
QualificationN/ATotal RAM Bits49152

Overview of EP1K100FC484-2NGZ – ACEX-1K® FPGA, 4,992 logic elements, 49,152 RAM bits, 333 I/Os, 484-BBGA

The EP1K100FC484-2NGZ is an ACEX-1K family field programmable gate array (FPGA) optimized for system-on-a-programmable-chip integration. It combines a dense logic array with embedded array blocks (EABs) to implement memory-rich megafunctions and general-purpose logic for communications, embedded control and high-volume applications.

Designed for commercial-grade deployments, the device provides a combination of on-chip memory, a high I/O count and programmable I/O voltage support that streamlines integration of logic, memory and interface functions on a single surface-mount 484-BBGA package.

Key Features

  • Core Logic  4,992 logic elements delivering up to 257,000 maximum system gates for compact implementation of combinational and sequential functions.
  • Embedded Memory (EABs)  Up to 49,152 total RAM bits (4,096 bits per EAB) and dual-port capability with up to 16-bit width per EAB to support memory-intensive functions and efficient megafunction implementation.
  • I/O and Interfaces  333 user I/O pins with MultiVolt I/O capability (drive or be driven by 2.5 V, 3.3 V, or 5.0 V devices), enabling flexible interfacing to mixed-voltage systems.
  • Configuration and Test  Built-in JTAG boundary-scan (IEEE 1149.1) for in-system test and configuration; supports in-circuit reconfigurability via external configuration devices or JTAG port.
  • Clocking and Performance  Dedicated low-skew clock distribution trees, ClockLock and ClockBoost options, dedicated carry and cascade chains for arithmetic and high-fan-in logic—features that improve timing predictability for complex designs.
  • Package and Mounting  Surface-mount 484-BBGA package (supplier package: 484-FBGA, 23×23) suitable for compact board designs while providing high pin density.
  • Power and Supply  Operates with a 2.5 V internal supply and specified supply range of 2.375 V to 2.625 V for core power.
  • Commercial Grade & Compliance  Commercial operating grade with RoHS compliance; specified operating temperature range 0 °C to 70 °C.

Typical Applications

  • Communications Equipment  Implement packet processing, protocol bridging or custom interface logic using the device’s high I/O count and embedded RAM.
  • Embedded Control and SoPC  Integrate control engines, state machines and on-chip memory for compact system-on-programmable-chip solutions.
  • Memory-Intensive Functions  Use dual-port EABs and the available 49,152 RAM bits for FIFOs, buffering and lookup tables in data-path designs.
  • PCI and Bus Interface Designs  Employ family-level PCI Local Bus Specification support (for applicable device grades and configurations) to implement bus interface logic and local peripheral control.

Unique Advantages

  • High integration density: Combine nearly 5,000 logic elements and substantial on-chip RAM to reduce external components and board footprint.
  • Flexible voltage interfacing: MultiVolt I/O support enables direct interfacing to 2.5 V, 3.3 V or 5.0 V peripherals, simplifying mixed-voltage system design.
  • Deterministic clocking: Built-in low-skew clock trees and clock-management options help achieve predictable timing for synchronous designs.
  • On-board test and reconfiguration: JTAG boundary-scan and in-circuit reconfigurability streamline production test and field updates without consuming core logic.
  • Compact, high-density packaging: 484-BBGA surface-mount package provides high pin count in a compact footprint for space-constrained PCBs.
  • Regulatory and environmental readiness: RoHS compliant to meet current environmental requirements for commercial electronic products.

Why Choose EP1K100FC484-2NGZ?

The EP1K100FC484-2NGZ positions itself as a commercial-grade FPGA that balances logic density, embedded memory capacity and a high I/O count to address a wide range of communications and embedded system designs. Its MultiVolt I/O, deterministic clocking features and on-chip EAB resources help compress systems and reduce bill-of-materials costs.

This device is suited for engineers seeking a compact, reconfigurable platform with significant on-chip RAM and flexible interfacing options, backed by established ACEX-1K family architecture and tooling support referenced in the product datasheet.

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