EP1K100FC484-3N

IC FPGA 333 I/O 484FBGA
Part Description

ACEX-1K® Field Programmable Gate Array (FPGA) IC 333 49152 4992 484-BBGA

Quantity 457 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 70°C
Package / Case484-BBGANumber of I/O333Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs624Number of Logic Elements/Cells4992
Number of Gates257000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits49152

Overview of EP1K100FC484-3N – ACEX-1K® Field Programmable Gate Array (FPGA) IC 333 49152 4992 484-BBGA

The EP1K100FC484-3N is an ACEX 1K family programmable logic device that delivers a mid-density FPGA architecture optimized for system-on-a-programmable-chip (SOPC) integration and cost-efficient high-volume designs. It combines a dense logic fabric with embedded memory and a large I/O count to address communications and embedded system applications that require on-chip memory and flexible interfacing.

This device provides 4,992 logic elements, approximately 49,152 bits of embedded RAM, and up to 333 user I/O pins in a 484-ball BGA package, making it suitable for designs demanding integration of memory, logic and I/O in a single surface-mount component.

Key Features

  • Core Logic  4,992 logic elements (LEs) and a maximum of 257,000 system gates for implementing combinational and sequential logic functions.
  • Embedded Memory (EABs)  Family-available embedded array blocks (EABs) provide up to 49,152 total RAM bits; EABs support dual-port operation with up to 16-bit width per block for efficient on-chip buffering and megafunction implementation.
  • I/O Capacity & Flexibility  Up to 333 user I/O pins with MultiVolt I/O capability in the ACEX 1K family, allowing interfacing with different voltage domains (family-level feature).
  • Packaging & Mounting  484-ball Fine-pitch BGA package (484-BBGA / supplier package: 484-FBGA 23×23) with surface-mount mounting for compact board designs.
  • Power & Supply  Device supply operating range: 2.375 V to 2.625 V; the ACEX 1K family operates with a 2.5-V internal supply (family-level detail).
  • Reliability & Test  Built-in JTAG boundary-scan test (IEEE Std. 1149.1) for board-level test and in-system verification without consuming device logic.
  • Reconfiguration & Clocking  Supports in-circuit reconfigurability (ICR) via external configuration devices, intelligent controllers, or JTAG. Family options include ClockLock™ and ClockBoost™ for reduced clock delay and skew (family-level features).
  • Design Support  ACEX 1K family datasheet documents FastTrack® interconnect, dedicated carry and cascade chains to accelerate arithmetic and high-fan-in logic functions (family-level capabilities).
  • Commercial Grade Operating Range  Rated for commercial temperature operation from 0 °C to 70 °C.

Typical Applications

  • Communications Equipment  On-chip RAM and dense logic enable buffering, protocol processing, and glue-logic for network and communications modules.
  • SOPC and Embedded Systems  Combines logic, embedded memory, and high I/O count to consolidate functions in single-chip programmable systems.
  • PCI and Bus Interface Designs  ACEX 1K family includes features and speed-grade options that support PCI Local Bus implementations (family-level detail); suitable for designs requiring programmable bus logic.

Unique Advantages

  • High integration density: 4,992 logic elements and up to 257,000 system gates allow substantial logic consolidation to reduce board-level component count.
  • On-chip memory for buffering: Approximately 0.049 Mbits (49,152 bits) of embedded RAM across EABs supports dual-port buffering and megafunctions without sacrificing logic capacity.
  • Extensive I/O capability: Up to 333 user I/O pins in a single 484-ball BGA package enable broad peripheral and bus connectivity.
  • Test and reconfiguration support: JTAG boundary-scan and in-circuit reconfigurability simplify board test, firmware updates, and field programmability.
  • Package and form-factor: 484-ball FineLine BGA (surface-mount) provides a compact footprint for space-constrained boards while retaining high pin count.
  • Design acceleration features: Dedicated carry and cascade chains plus FastTrack® interconnect improve implementation efficiency for arithmetic and high-fan-in logic (family-level features).

Why Choose EP1K100FC484-3N?

The EP1K100FC484-3N places a balanced mix of logic density, embedded memory, and high I/O capability into a compact 484-ball BGA package, making it well suited for embedded and communications designs that require on-chip buffering and flexible interfacing. Its commercial-grade thermal range and surface-mount package accommodate standard PCB assembly flows.

Designed as part of the ACEX 1K family, the device benefits from family-level capabilities such as MultiVolt I/O, JTAG testability, in-circuit reconfigurability, and architecture features that accelerate common logic functions—providing a practical platform for developers targeting integrated, cost-efficient programmable logic solutions.

Request a quote or submit an inquiry to get pricing and availability for EP1K100FC484-3N and start integrating this ACEX 1K device into your next design.

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