EP1K100FI484-2

The EP1K100FI484-2 is an ACEX-1K family field programmable gate array (FPGA) device providing a cost-efficient programmable logic solution for system integration and high-density logic designs. This industrial‑grade, surface‑mount device combines 4,992 logic elements, 49,152 bits of embedded RAM, and up to 333 user I/O pins in a 484‑pin FineBall Grid Array package.

Designed for applications that require embedded memory, flexible I/O voltage support, and in-circuit reconfigurability, the EP1K100FI484-2 targets communications, system-on-a-programmable-chip (SOPC) integration, and industrial control designs where a balance of logic capacity and I/O count is required.

Key Features

• Logic Capacity — 4,992 logic elements delivering up to 257,000 maximum system gates for implementing complex logic functions.
• Embedded Memory — 49,152 total RAM bits (EABs with dual-port capability) for efficient on-chip storage and megafunction implementation.
• I/O and Voltage Flexibility — Up to 333 user I/O pins with MultiVolt I/O capability to interface with 2.5 V, 3.3 V, or 5.0 V devices.
• Package and Mounting — 484‑BBGA (supplier package 484‑FBGA, 23 × 23 mm) in a surface-mount form factor suitable for board-level integration.
• Power Supply — Operates with an internal 2.5 V supply and requires an external voltage supply in the range 2.375 V to 2.625 V.
• Temperature and Grade — Industrial grade operation with an operating temperature range of −40 °C to 85 °C.
• Configuration and Test — In-circuit reconfigurability (ICR) via external configuration devices, intelligent controller, or JTAG port, plus built-in JTAG boundary-scan test (IEEE 1149.1) without consuming device logic.
• Timing and Clocking — Built-in low-skew clock distribution trees with options such as ClockLock™ and ClockBoost™ for reduced clock delay and skew; up to six global clock signals supported.
• Dedicated Arithmetic and Logic Support — Dedicated carry chains and cascade chains for high-speed arithmetic and high‑fan‑in logic functions.
• Flexible Interconnect — FastTrack® continuous routing structure for predictable interconnect delays and tri-state emulation for internal bus implementations.

Typical Applications

• Communications Equipment — Implement protocol handling, data buffering and custom packet processing using the device's high logic density and embedded RAM.
• System Integration / SOPC — Consolidate functions and megafunctions into a single programmable device for compact system-on-a-programmable-chip designs.
• Industrial Control — Use the industrial temperature rating and flexible I/O voltage support for control logic, sensor interfacing, and real-time processing in industrial environments.
• High‑I/O Custom Interfaces — Leverage up to 333 I/O pins for boards requiring numerous external interfaces or mixed-voltage signaling.

Unique Advantages

• Balanced Logic and Memory — 4,992 logic elements paired with 49,152 bits of embedded RAM provide on-chip resources for both control logic and data buffering.
• MultiVolt I/O Support — I/O pins that can drive or be driven by 2.5 V, 3.3 V, or 5.0 V devices simplify mixed-voltage designs and board-level integration.
• Industrial Temperature Range — Specified operation from −40 °C to 85 °C for deployment in industrial environments.
• In‑Circuit Reconfigurability and JTAG — Supports in-system configuration and standard boundary-scan testing without consuming additional logic resources.
• Predictable Routing and Fast Arithmetic — FastTrack interconnect and dedicated carry/cascade chains reduce implementation complexity for timing-critical arithmetic and high-fan-in functions.
• Pin‑compatible Package Options — FineLine BGA package family and package pin compatibility support design migration and board reuse within the ACEX‑1K family.

Why Choose EP1K100FI484-2?

The EP1K100FI484-2 is positioned as a high-density, industrial-grade programmable logic device that combines sizable logic resources, embedded RAM, and a large I/O complement in a 484‑pin FBGA package. Its MultiVolt I/O support, in-circuit reconfigurability, and built-in test features make it suitable for designs that require integration of multiple system functions and on-board configurability.

This device is appropriate for engineers and procurement teams designing communications, industrial control, and system-integration products who need a verifiable combination of logic capacity, on-chip memory, and flexible I/O in an industrial temperature-rated package. Package pin compatibility and software design support referenced in the device documentation help simplify design migration and toolchain integration.

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