EP1K100FI256-2N

The EP1K100FI256-2N is an Intel ACEX-1K series programmable logic device tailored for industrial embedded designs. It combines a dedicated logic array with embedded memory blocks to enable system-on-a-programmable-chip (SOPC) integration for communications, protocol processing, and custom logic functions.

Designed for surface-mount implementation in a 256-ball FBGA (17 × 17) package, this device delivers 4,992 logic elements, 49,152 bits of on-chip RAM, and 186 user I/O pins while operating over a 2.375 V to 2.625 V supply and an industrial temperature range of −40 °C to 85 °C.

Key Features

• Core Logic: 4,992 logic elements and up to 257,000 maximum system gates provide programmable resources for combinational and sequential logic implementation.
• Embedded Memory: 49,152 bits of embedded RAM (organized in EABs at the series level) support efficient on-chip storage and dual-port configurations for buffer and packet processing.
• I/O and Voltage: 186 user I/O pins with MultiVolt I/O capability at the series level allow interfacing with 2.5 V, 3.3 V, or 5.0 V devices; supply operation specified between 2.375 V and 2.625 V.
• Clocking and Timing: Built-in low-skew clock distribution trees plus ClockLock and ClockBoost options at the series level reduce clock delay and skew for timing-critical designs.
• Configuration and Test: In-circuit reconfigurability (ICR) via external configuration devices or JTAG boundary-scan (IEEE 1149.1) enables field updates and board-level test without consuming device logic.
• Dedicated Arithmetic Support: Dedicated carry and cascade chains at the series level accelerate adders, counters, and high‑fan‑in logic functions for faster arithmetic implementations.
• Flexible Interconnect: FastTrack® continuous routing structure provides predictable routing delays and supports efficient place-and-route for complex designs.
• Package & Reliability: Surface-mount 256-FBGA (17×17) package, RoHS-compliant, and specified for industrial operating temperatures (−40 °C to 85 °C).

Typical Applications

• Communications Equipment: Protocol processing, packet buffering and custom interface logic where embedded RAM and dense logic are required.
• System Integration / SOPC: Consolidating glue logic, peripherals, and memory functions into a single programmable device for board-level integration.
• Interface Bridging: Implementing custom bridges, level translation logic, and peripheral interfaces using flexible I/O and programmable logic.

Unique Advantages

• High integration density: 4,992 logic elements and 49,152 bits of embedded RAM reduce external component count and simplify PCB design.
• Industrial temperature capability: Specified operation from −40 °C to 85 °C supports deployments in industrial environments.
• Flexible I/O and voltage support: MultiVolt I/O at the series level enables straightforward interfacing with multiple logic families and legacy peripherals.
• Field reconfigurability: In-circuit reconfigurability and JTAG boundary-scan enable firmware updates and board-level test without additional logic overhead.
• Performance-oriented routing and arithmetic: FastTrack interconnect and dedicated carry/cascade chains speed arithmetic and high-fan-in logic functions for latency-sensitive tasks.
• Compact, industry-standard package: 256‑ball FBGA (17×17) supports high I/O density in a compact surface-mount footprint.

Why Choose EP1K100FI256-2N?

The EP1K100FI256-2N brings ACEX-1K series programmability and embedded memory to industrial applications that require a balance of integration, reconfigurability, and predictable timing. Its combination of 4,992 logic elements, 49,152 bits of on-chip RAM, and 186 I/O pins makes it well suited for communications interfaces, SOPC consolidation, and custom control logic where board-level simplification and field updates matter.

Supported by series-level features such as low-skew clock distribution, in-circuit reconfigurability, and dedicated arithmetic chains, this device is a practical choice for engineers seeking a verified programmable building block with industrial temperature range and a compact FBGA package.

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