EP1K100FI256-2

The EP1K100FI256-2 is an industrial-grade ACEX-1K family FPGA in a 256-pin fine-pitch BGA package designed for cost-efficient, system-level programmable logic integration. The device combines a logic array and multiple embedded array blocks (EABs) to deliver up to 4,992 logic elements and approximately 49,152 bits of embedded memory for applications requiring on-chip RAM and flexible I/O.

Typical use cases include SOPC integration, high-performance communications sub-systems, and embedded control where a compact, surface-mount FPGA with a broad I/O voltage interoperability and extended temperature range is required.

Key Features

• Logic Capacity — 4,992 logic elements (LEs) and up to 257,000 system gates provide a balance of combinational and sequential logic resources for mid-density designs.
• Embedded Memory — Approximately 49,152 bits of on-chip RAM distributed across embedded array blocks to support dual-port memory and efficient megafunction implementation.
• I/O and Voltage Support — 186 user I/O pins with MultiVolt capability documented by the ACEX-1K family; device operates with a supply range of 2.375 V to 2.625 V and an internal 2.5-V supply option noted in family documentation.
• Package & Mounting — Surface mount 256-FBGA (17 × 17) package (256‑BGA), suitable for compact board designs requiring a fine-line ball grid array.
• Temperature & Grade — Industrial grade operation with an operating temperature range of −40 °C to 85 °C for deployment in temperature-demanding environments.
• Configuration & Testability — Family features include in-circuit reconfigurability and built-in JTAG boundary-scan (IEEE 1149.1) for programming and test without consuming device logic.
• Clocking & Performance Options — Family-level ClockLock™ and ClockBoost™ options and low-skew clock distribution trees for reduced clock delay and controlled clocking architectures.
• I/O Control & Reliability — Per-pin features from the family documentation include individual tri-state enables, open-drain option, programmable slew-rate control, clamp-to-VCCIO selection, and I/O pull-ups during configuration.
• Compliance & Environmental — RoHS compliant and fully tested at the device level as described in the ACEX-1K family data.

Typical Applications

• Communications Sub-systems — Implement protocol processing, buffering and I/O translation for mid-density communications endpoints using the device’s embedded RAM and logic resources.
• System-on-a-Programmable-Chip (SOPC) — Integrate custom logic, memory and peripheral glue logic into a single FPGA to reduce BOM and board area for embedded controllers and IP cores.
• Industrial Control — Use the industrial temperature grading and flexible I/O for machine control, sensor aggregation, and real-time interface bridging.
• Peripheral and Bus Interface Logic — Implement bus bridging, protocol adaptation and timing-critical glue logic leveraging the device’s dedicated carry and cascade chains documented for arithmetic and high‑fan‑in functions.

Unique Advantages

• Balanced Logic and Memory — 4,992 logic elements combined with approximately 49,152 bits of embedded RAM supports designs that need both substantial logic and on‑chip storage without external memory.
• Flexible I/O and Voltage Interoperability — MultiVolt family capabilities and programmable I/O features allow interfacing with a range of 2.5-V, 3.3-V, and 5.0-V systems as described in the family documentation.
• Compact, Surface-Mount Packaging — 256‑FBGA (17×17) package enables high-density PCB layouts while providing a reliable BGA mounting solution.
• Industrial Temperature Rating — −40 °C to 85 °C operating range supports deployment in industrial environments where extended temperature operation is required.
• Built-In Test and Reconfiguration — JTAG boundary-scan and in-circuit reconfigurability simplify production test and field updates without consuming logic resources.

Why Choose EP1K100FI256-2?

The EP1K100FI256-2 delivers a pragmatic combination of mid-range logic capacity, embedded RAM, and robust I/O features in a compact 256‑FBGA package. Its industrial temperature rating and surface-mount form factor make it well suited for space-constrained boards and environments that require reliable operation across a wide temperature range.

Engineers selecting this device will benefit from family-level architectural features—such as embedded array blocks, dedicated arithmetic chains, and flexible clocking options—alongside standard testability and reconfiguration mechanisms to streamline development, reduce BOM, and support long-term product maintenance.

Request a quote or submit your requirements to our sales team to discuss availability and lead time for EP1K100FI256-2.