EP1K100FC484-3
| Part Description |
ACEX-1K® Field Programmable Gate Array (FPGA) IC 333 49152 4992 484-BBGA |
|---|---|
| Quantity | 1,435 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 333 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 624 | Number of Logic Elements/Cells | 4992 | ||
| Number of Gates | 257000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 49152 |
Overview of EP1K100FC484-3 – ACEX-1K® Field Programmable Gate Array (FPGA) IC 333 49152 4992 484-BBGA
The EP1K100FC484-3 is an ACEX-1K family Field Programmable Gate Array (FPGA) optimized for system-on-a-programmable-chip integration and cost-sensitive embedded designs. It combines a logic array, dedicated embedded array blocks (EABs) and flexible I/O to address communications, SOPC integration and general-purpose logic tasks.
Key value comes from an integrated memory-rich architecture—providing approximately 49,152 bits of on-chip RAM and roughly 4,992 logic elements—together with up to 333 user I/O pins in a 484-ball BGA package for compact, surface-mount system designs.
Key Features
- Core Logic Approximately 4,992 logic elements (LEs) and a maximum system gate count of 257,000, enabling medium-density programmable logic implementations.
- Embedded Memory (EAB) Total RAM: 49,152 bits implemented across 12 EABs (4,096 bits per EAB), including dual-port capability and up to 16-bit width per EAB for efficient on-chip storage and data buffering.
- I/O and Interface Flexibility Up to 333 user I/O pins with MultiVolt I/O options (drive/receive 2.5-V, 3.3-V, or 5.0-V devices as described in the family datasheet) and individual pin options such as tri-state enable and open-drain configurations.
- Clocking and Dedicated Chains Low-skew, built-in clock distribution with up to six global clock signals and dedicated carry and cascade chains for high-speed arithmetic and high-fan-in logic implementation.
- Configuration and Test Supports in-circuit reconfigurability (ICR) and JTAG boundary-scan per IEEE 1149.1 for device programming and board-level testability without consuming user logic.
- Package & Mounting Surface-mount 484-BBGA package (supplier device package listed as 484-FBGA 23×23) for high-density board layouts.
- Power & Supply Specified operating supply range of 2.375 V to 2.625 V (internal recommended 2.5 V operation noted in family documentation).
- Commercial Temperature Grade Rated for commercial operation from 0 °C to 70 °C; RoHS compliant.
Typical Applications
- Communications Equipment Use as programmable logic for protocol handling, packet processing and interface bridging where memory-rich blocks and high I/O counts are required.
- System-on-a-Programmable-Chip (SOPC) Integration Embed controllers, peripherals and custom logic into a single device to reduce BOM and board area for medium-density embedded systems.
- Custom Logic and Glue Implement glue logic, state machines and data-path functions that require dedicated carry/cascade resources and multiple global clocks.
- PCI-Compatible Interfaces Family-level documentation indicates compliance with PCI Local Bus Specification Revision 2.2 for 3.3-V operation at 33 MHz or 66 MHz, enabling use in PCI-interface designs (see device family datasheet for compatibility details).
Unique Advantages
- Balanced Logic and Memory Large on-chip RAM (49,152 bits) combined with nearly 5k logic elements simplifies designs that need embedded data storage alongside combinational and sequential logic.
- High I/O Density Up to 333 user I/O pins in a 484-BBGA footprint supports complex board-level connectivity without external multiplexing.
- Flexible I/O Standards MultiVolt I/O capability (as described in family documentation) enables direct interfacing to a range of legacy and modern voltage domains.
- Built-in Test and Reconfiguration JTAG boundary-scan and in-circuit reconfigurability streamline manufacturing test and field updates without consuming user logic resources.
- Dedicated Arithmetic and Routing Resources Carry and cascade chains plus FastTrack interconnect options simplify implementation of fast adders, counters and wide combinational functions.
Why Choose EP1K100FC484-3?
The EP1K100FC484-3 positions itself as a memory-rich, medium-density FPGA for commercial embedded designs that require a blend of on-chip RAM, nearly 5k logic elements and a high I/O count in a compact BGA package. Its combination of dedicated arithmetic chains, robust clocking options and in-circuit reconfigurability makes it suitable for communications, SOPC and custom logic applications where integration and board-level space savings matter.
Designed for commercial temperature ranges and RoHS-compliant manufacturing, this device is appropriate for engineers seeking a cost-efficient, reprogrammable platform supported by the ACEX-1K family documentation and development toolchain references.
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