EP1K100FC484-3

IC FPGA 333 I/O 484FBGA
Part Description

ACEX-1K® Field Programmable Gate Array (FPGA) IC 333 49152 4992 484-BBGA

Quantity 1,435 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 70°C
Package / Case484-BBGANumber of I/O333Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs624Number of Logic Elements/Cells4992
Number of Gates257000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits49152

Overview of EP1K100FC484-3 – ACEX-1K® Field Programmable Gate Array (FPGA) IC 333 49152 4992 484-BBGA

The EP1K100FC484-3 is an ACEX-1K family Field Programmable Gate Array (FPGA) optimized for system-on-a-programmable-chip integration and cost-sensitive embedded designs. It combines a logic array, dedicated embedded array blocks (EABs) and flexible I/O to address communications, SOPC integration and general-purpose logic tasks.

Key value comes from an integrated memory-rich architecture—providing approximately 49,152 bits of on-chip RAM and roughly 4,992 logic elements—together with up to 333 user I/O pins in a 484-ball BGA package for compact, surface-mount system designs.

Key Features

  • Core Logic  Approximately 4,992 logic elements (LEs) and a maximum system gate count of 257,000, enabling medium-density programmable logic implementations.
  • Embedded Memory (EAB)  Total RAM: 49,152 bits implemented across 12 EABs (4,096 bits per EAB), including dual-port capability and up to 16-bit width per EAB for efficient on-chip storage and data buffering.
  • I/O and Interface Flexibility  Up to 333 user I/O pins with MultiVolt I/O options (drive/receive 2.5-V, 3.3-V, or 5.0-V devices as described in the family datasheet) and individual pin options such as tri-state enable and open-drain configurations.
  • Clocking and Dedicated Chains  Low-skew, built-in clock distribution with up to six global clock signals and dedicated carry and cascade chains for high-speed arithmetic and high-fan-in logic implementation.
  • Configuration and Test  Supports in-circuit reconfigurability (ICR) and JTAG boundary-scan per IEEE 1149.1 for device programming and board-level testability without consuming user logic.
  • Package & Mounting  Surface-mount 484-BBGA package (supplier device package listed as 484-FBGA 23×23) for high-density board layouts.
  • Power & Supply  Specified operating supply range of 2.375 V to 2.625 V (internal recommended 2.5 V operation noted in family documentation).
  • Commercial Temperature Grade  Rated for commercial operation from 0 °C to 70 °C; RoHS compliant.

Typical Applications

  • Communications Equipment  Use as programmable logic for protocol handling, packet processing and interface bridging where memory-rich blocks and high I/O counts are required.
  • System-on-a-Programmable-Chip (SOPC) Integration  Embed controllers, peripherals and custom logic into a single device to reduce BOM and board area for medium-density embedded systems.
  • Custom Logic and Glue  Implement glue logic, state machines and data-path functions that require dedicated carry/cascade resources and multiple global clocks.
  • PCI-Compatible Interfaces  Family-level documentation indicates compliance with PCI Local Bus Specification Revision 2.2 for 3.3-V operation at 33 MHz or 66 MHz, enabling use in PCI-interface designs (see device family datasheet for compatibility details).

Unique Advantages

  • Balanced Logic and Memory  Large on-chip RAM (49,152 bits) combined with nearly 5k logic elements simplifies designs that need embedded data storage alongside combinational and sequential logic.
  • High I/O Density  Up to 333 user I/O pins in a 484-BBGA footprint supports complex board-level connectivity without external multiplexing.
  • Flexible I/O Standards  MultiVolt I/O capability (as described in family documentation) enables direct interfacing to a range of legacy and modern voltage domains.
  • Built-in Test and Reconfiguration  JTAG boundary-scan and in-circuit reconfigurability streamline manufacturing test and field updates without consuming user logic resources.
  • Dedicated Arithmetic and Routing Resources  Carry and cascade chains plus FastTrack interconnect options simplify implementation of fast adders, counters and wide combinational functions.

Why Choose EP1K100FC484-3?

The EP1K100FC484-3 positions itself as a memory-rich, medium-density FPGA for commercial embedded designs that require a blend of on-chip RAM, nearly 5k logic elements and a high I/O count in a compact BGA package. Its combination of dedicated arithmetic chains, robust clocking options and in-circuit reconfigurability makes it suitable for communications, SOPC and custom logic applications where integration and board-level space savings matter.

Designed for commercial temperature ranges and RoHS-compliant manufacturing, this device is appropriate for engineers seeking a cost-efficient, reprogrammable platform supported by the ACEX-1K family documentation and development toolchain references.

If you would like pricing, availability, or to request a quote for EP1K100FC484-3, submit an inquiry or quote request and our team will respond with the next steps and lead-time information.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up