EP1K100FI484-2N

The EP1K100FI484-2N is a member of the Intel ACEX-1K programmable logic device family designed for system-on-a-programmable-chip (SOPC) integration. This surface-mount FPGA combines a high-density logic array and embedded memory to address communication, control, and embedded system designs that require reconfigurable logic, on-chip RAM, and flexible I/O.

As an industrial-grade device, it provides on-chip resources and system-level features geared toward low-power, high-volume applications, while supporting multi-voltage I/O and in-circuit reconfigurability for flexible integration into mixed-voltage systems.

Key Features

• Logic Capacity — 4,992 logic elements (LEs) and a maximum system gate count of 257,000 for implementing complex logic functions and state machines.
• Embedded Memory — 49,152 total RAM bits across embedded array blocks (EABs), with dual-port capability for efficient on-chip storage and data buffering.
• I/O and Voltage — Up to 333 user I/O pins with MultiVolt capability; I/O can interface with 2.5 V, 3.3 V, or 5.0 V devices. Device internal supply operates at 2.5 V and specified core supply range is 2.375 V to 2.625 V.
• Timing and Clock — Built-in low-skew clock distribution with options such as ClockLock and ClockBoost for reduced clock delay and skew, plus support for up to six global clock signals.
• Configuration and Test — In-circuit reconfigurability via external configuration devices or JTAG; built-in JTAG boundary-scan test (IEEE 1149.1) available without consuming device logic.
• Interconnect and Arithmetic Support — FastTrack continuous routing, dedicated carry and cascade chains for efficient arithmetic and high-fan-in logic implementations.
• Package and Temperature — 484-BBGA package (supplier device package: 484-FBGA, 23×23) in a surface-mount form factor; industrial operating temperature range of −40 °C to 85 °C.
• Compliance and Reliability — RoHS‑compliant and designed for 100% functional testing, with hot-socketing support and programmable I/O features such as individual tri-state control and programmable slew-rate.

Typical Applications

• Communications Equipment — Implement protocol bridging, packet buffering, and custom logic for high-performance communications systems using the device’s dense logic and embedded RAM.
• SOPC and Embedded Systems — Integrate control logic, state machines, and memory-mapped functions into a single reconfigurable device to reduce board-level components.
• Peripheral and Interface Controllers — Leverage MultiVolt I/O and flexible I/O features to interface with mixed-voltage peripherals and legacy devices.
• Industrial Control — Use the industrial temperature rating and reconfigurability for factory automation, sensor aggregation, and motor/control logic applications.

Unique Advantages

• Highly integrated logic and memory: 4,992 logic elements combined with 49,152 bits of embedded RAM reduce external component count and simplify board design.
• Flexible I/O for mixed-voltage systems: MultiVolt I/O support and programmable pin features allow direct interfacing with 2.5 V, 3.3 V, and 5.0 V devices.
• Design-for-test and reconfiguration: Built-in JTAG boundary-scan and in-circuit reconfigurability enable field updates and board-level testability without consuming logic resources.
• Deterministic routing and arithmetic support: FastTrack interconnect and dedicated carry/cascade chains provide predictable delays and efficient implementation of adders, counters, and wide logic functions.
• Industrial temperature range: Rated for operation from −40 °C to 85 °C to meet demanding environmental requirements.

Why Choose EP1K100FI484-2N?

EP1K100FI484-2N positions itself as a capable, industrial‑grade FPGA option within the ACEX‑1K family, offering a balance of logic density, embedded memory, and flexible I/O for embedded and communications-focused designs. The device’s combination of reconfigurability, on-chip RAM, and system-level features supports designers who need to consolidate functions and maintain field programmability.

This part is suited for teams targeting scalable SOPC solutions, high-volume communications products, or industrial control systems that require a reliable, RoHS‑compliant FPGA with defined supply and temperature ranges and a FineLine BGA package for compact board layouts.

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