EP1K100QC208-2N

The EP1K100QC208-2N is a programmable logic device from the ACEX-1K family designed for system-on-a-programmable-chip (SOPC) integration and cost-efficient, high-volume applications. It combines a high-density logic array with embedded memory and flexible I/O to implement megafunctions, specialized logic, and dual-port memory structures.

This device provides a balanced mix of logic resources and on-chip RAM—4,992 logic elements and 49,152 total RAM bits—along with 147 user I/O pins in a 208-BFQFP surface-mount package. It operates from a 2.375 V to 2.625 V supply and is specified for commercial temperature operation (0 °C to 70 °C). The part is RoHS compliant.

Key Features

• Core Logic  4,992 logic elements and a listed gate capacity of 257,000 (maximum system gates) provide substantial on-chip logic for gate- and LUT-based designs.
• Embedded Memory (EABs)  49,152 total RAM bits across embedded array blocks with dual-port capability and up to 16-bit width per EAB for efficient memory and megafunction implementations.
• I/O Flexibility  147 user I/O pins with MultiVolt I/O support (family-level capability to interface with 2.5 V, 3.3 V, or 5.0 V devices) and programmable pin options including individual tri-state enables, open-drain, programmable slew-rate, and clamp-to-VCCIO.
• Configuration & Test  In-circuit reconfigurability and built-in JTAG boundary-scan test circuitry (IEEE 1149.1) for board-level test and configuration without consuming device logic.
• Power & Supply  Operates with an internal 2.5 V supply and a device supply range of 2.375 V to 2.625 V, enabling integration with standard 2.5 V system rails.
• Package & Mounting  Surface-mount 208-BFQFP package (supplier device package: 208-PQFP, 28 × 28 mm) for board-level assembly and compact footprint.
• Commercial Temperature Grade  Specified for 0 °C to 70 °C operation and RoHS compliant for regulatory and environmental alignment.

Typical Applications

• Communications Equipment  Implement protocol logic, packet processing, and interface bridging using the device’s dense logic and on-chip RAM for latency-sensitive blocks.
• System-on-a-Programmable-Chip (SOPC)  Integrate multiple functions—memory, control logic, and peripheral interfaces—into a single device to reduce component count and board complexity.
• Memory-Intensive Logic  Use embedded array blocks for dual-port RAM, FIFOs, and specialized memory functions that benefit from the device’s EAB architecture and dual-port capability.
• High-Volume Consumer and Industrial Designs  Leverage the ACEX-1K family’s cost-optimized architecture for applications requiring high-density logic and predictable production economics.

Unique Advantages

• Highly Integrated Logic and Memory: Combines 4,992 logic elements with 49,152 bits of embedded RAM to implement complex state machines and memory-backed functions on a single chip.
• Flexible I/O Options: 147 user I/Os with MultiVolt signaling and programmable pin features simplify interfacing to a wide range of peripherals and voltage domains.
• In-Circuit Reconfigurability and JTAG Test: Built-in JTAG and support for in-system configuration streamline debugging, production test, and firmware updates without additional logic consumption.
• Production-Friendly Packaging: 208-BFQFP surface-mount package supports standard assembly flows and a compact PCB footprint.
• RoHS Compliant: Meets RoHS requirements for environmentally responsible design and manufacturing.

Why Choose EP1K100QC208-2N?

The EP1K100QC208-2N offers a practical balance of logic density, embedded memory, and I/O flexibility in a compact 208-pin surface-mount package. It is well suited for designers targeting SOPC integration, memory-backed logic, and cost-sensitive, high-volume communications applications where predictable configurability and board-level testability are important.

With support for in-circuit reconfiguration, JTAG boundary-scan, and family-level I/O flexibility, this device provides a reliable platform for mid-density FPGA-based designs that require on-chip RAM and configurable interfaces while operating within commercial temperature ranges.

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