EP1K100QC208-2NGZ

The EP1K100QC208-2NGZ is an ACEX-1K series programmable logic device (PLD) in a 208-pin BFQFP package designed for commercial applications. It provides a flexible FPGA-class architecture with 4,992 logic elements and approximately 49,152 bits of embedded RAM to support system-on-a-programmable-chip (SOPC) integration and high-density logic and memory functions.

Key value propositions include on-chip memory density, flexible I/O capabilities, and series-level system features such as in-circuit reconfigurability and clock management options that support communications and embedded control designs.

Key Features

• Core Logic  4,992 logic elements providing the device’s primary programmable fabric for general logic and arithmetic functions.
• Embedded Memory  Approximately 49,152 bits of on-chip RAM arranged in embedded array blocks (EABs) for efficient implementation of dual-port memories and megafunctions.
• I/O Capacity  Up to 147 user I/O pins to interface with external devices; I/O supports bidirectional operation and user-selectable clamp options.
• Performance-Oriented System Features  Series-level features include FastTrack interconnect, dedicated carry and cascade chains, and options such as ClockLock and ClockBoost for reduced clock delay and skew.
• Reconfigurability & Test  In-circuit reconfigurability (ICR) via external configuration devices or the JTAG port and built-in boundary-scan (IEEE Std. 1149.1) for testability without consuming device logic.
• Power & Voltage  Operates with a 2.5-V internal supply; specified external supply range of 2.375 V to 2.625 V.
• Package & Mounting  208-pin BFQFP (supplier package: 208-PQFP, 28×28) in a surface-mount form factor suitable for compact PCB designs.
• Commercial Grade & Temperature  Commercial grade device with an operating temperature range of 0 °C to 70 °C and RoHS compliance.
• Functional Capacity  Device-level maximum system gates of 257,000 (series figure) for mapping larger logic functions across the ACEX-1K architecture.

Typical Applications

• Communications Equipment  Use the on-chip RAM and dense logic fabric for protocol bridging, packet processing, and other communications subsystems where integration and predictable timing matter.
• System-on-a-Programmable-Chip (SOPC)  Integrate multiple functions (memory buffers, control logic, custom interfaces) into a single device to reduce board-level component count.
• Peripheral Bus Interfaces  Series-level PCI Local Bus support (3.3-V operation at 33/66 MHz) and flexible I/O make the device suitable for custom peripheral and interface logic.
• Embedded Control & Glue Logic  Ideal for control, glue logic, and finite-state machines that benefit from reconfigurability and dedicated carry/cascade resources.

Unique Advantages

• Highly integrated logic and memory: 4,992 logic elements paired with approximately 49,152 bits of embedded RAM enable consolidation of logic and data storage on a single device, reducing BOM and board area.
• Flexible I/O and voltage support: 147 user I/O pins with series features for MultiVolt operation and user-selectable pin options simplify interfacing with a range of external devices.
• In-circuit reconfigurability and testability: JTAG-based configuration and boundary-scan support allow field updates and board-level test without consuming core logic resources.
• Clocking and interconnect optimizations: Built-in low-skew clock trees, ClockLock/ClockBoost options, and FastTrack interconnect help manage timing and routing for complex designs.
• Compact surface-mount package: 208-BFQFP (208-PQFP, 28×28) provides a high-pin-count, space-efficient mounting option for dense PCB layouts.
• Regulatory and quality baseline: RoHS compliance and 100% functional testing at the series level support environmental and manufacturing quality requirements.

Why Choose EP1K100QC208-2NGZ?

The EP1K100QC208-2NGZ offers a practical balance of logic density, embedded RAM, and flexible I/O in a commercial-grade, surface-mount package. It is positioned for designs that require on-chip memory and moderate logic capacity for communications, SOPC integration, and embedded control applications.

Engineers and procurement teams will find value in the device’s combination of reconfigurability, built-in test features, and package options that simplify board design while supporting system-level functions and performance tuning through series clock and interconnect features.

Request a quote or submit an inquiry for pricing and availability to evaluate EP1K100QC208-2NGZ for your next design.