EP1K100QI208-2N

IC FPGA 147 I/O 208QFP
Part Description

ACEX-1K® Field Programmable Gate Array (FPGA) IC 147 49152 4992 208-BFQFP

Quantity 727 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case208-BFQFPNumber of I/O147Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs624Number of Logic Elements/Cells4992
Number of Gates257000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits49152

Overview of EP1K100QI208-2N – ACEX-1K® Field Programmable Gate Array (FPGA) IC 147 49152 4992 208-BFQFP

The EP1K100QI208-2N is an ACEX-1K family field programmable gate array (FPGA) in a 208-pin BFQFP package, designed for mid-density programmable logic integration. It combines a logic array with embedded array blocks (EABs) to implement memory-intensive megafunctions and general-purpose logic on a single surface-mount device.

Typical use cases include system-on-a-programmable-chip (SOPC) integration, communications and industrial systems that require reconfigurable logic, embedded RAM, and flexible I/O. The device provides a balance of logic density, on-chip memory, and industrial temperature operation for reliable deployment.

Key Features

  • Logic Capacity — 4,992 logic elements (LEs) and approximately 257,000 maximum system gates provide mid-range programmable logic resources for glue logic, control, and custom datapaths.
  • Embedded Memory (EABs) — Up to 12 embedded array blocks (EABs) with a total of 49,152 RAM bits (4,096 bits per EAB) and dual-port capability for implementing efficient on-chip buffers, FIFOs, and memory-based megafunctions.
  • I/O Flexibility — 147 user I/O pins in the 208-BFQFP package support mixed-signal interfacing and external device connections in compact board designs.
  • Dedicated Arithmetic and Logic Chains — Built-in carry and cascade chains accelerate adders, counters, comparators, and high-fan-in logic without consuming excess general routing resources.
  • Configuration and Test — JTAG boundary-scan (IEEE 1149.1) and in-circuit reconfigurability support device programming, debug, and manufacturing test workflows.
  • Package & Mounting — 208-BFQFP (supplier device package 208-PQFP, 28×28) surface-mount package suitable for compact PCB layouts.
  • Power and Supply — Device internal supply range specified at 2.375 V to 2.625 V; designed to operate with a 2.5 V internal supply architecture.
  • Industrial Temperature Range — Rated for operation from −40 °C to 85 °C for deployment in industrial environments.
  • Compliance & Environmental — RoHS-compliant design for regulatory and manufacturing requirements.

Typical Applications

  • System-on-a-Programmable-Chip (SOPC) — Integrate memory blocks and custom logic into a single FPGA to reduce board-level component count and simplify system architecture.
  • Communications Equipment — Implement protocol handling, buffering, and specialized logic using the device's embedded RAM and dedicated arithmetic chains.
  • PCI and Bus Interface Prototyping — Use the device for prototyping and interfacing bus logic and peripheral controllers where reconfigurable logic and embedded memory are needed.
  • Industrial Control — Deploy in control and automation systems that require industrial temperature operation and a reconfigurable logic platform.

Unique Advantages

  • Highly integrated mid-density FPGA: 4,992 logic elements with 49,152 bits of embedded RAM deliver a compact combination of logic and memory for space-constrained designs.
  • Memory-efficient EAB architecture: Twelve EABs with dual-port capability enable efficient implementation of FIFOs, lookup tables, and memory-backed megafunctions without sacrificing logic capacity.
  • Flexible I/O in a compact package: 147 user I/O pins in a 208-BFQFP surface-mount package make it suitable for dense board layouts while maintaining connectivity options.
  • Design-for-test and reconfiguration: JTAG boundary-scan and in-circuit reconfigurability simplify manufacturing test, in-field updates, and iterative development.
  • Industrial readiness: Rated for −40 °C to 85 °C and RoHS-compliant, supporting deployment in industrial environments with regulatory compliance.
  • Deterministic arithmetic support: Dedicated carry and cascade chains reduce resource usage and improve performance for arithmetic and high-fan-in functions.

Why Choose EP1K100QI208-2N?

The EP1K100QI208-2N provides a balanced FPGA solution for engineers who need mid-range logic density, substantial on-chip memory, and industrial temperature operation in a compact surface-mount package. Its combination of 4,992 logic elements, 49,152 RAM bits across embedded array blocks, and 147 user I/Os makes it well suited to SOPC integration, communications logic, and industrial control applications.

Backed by ACEX-1K family features such as dedicated arithmetic chains, JTAG testability, and in-circuit reconfigurability, this Intel-manufactured device supports iterative development and field updates while helping reduce board-level component count and complexity.

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