EP1K10FC256-1N

The EP1K10FC256-1N is a member of the ACEX 1K family of programmable logic devices, offering a compact, cost-efficient FPGA architecture for system-on-a-programmable-chip (SOPC) integration. It combines a logic array with embedded array blocks (EABs) to deliver on-chip RAM and dedicated arithmetic/cascade resources suitable for communications, embedded control, and high-volume digital designs.

This device provides 576 logic elements, 12,288 bits of embedded RAM, up to 136 user I/O pins in a 256-ball BGA footprint, and operates from a 2.375 V to 2.625 V supply within a commercial 0 °C to 70 °C range. RoHS-compliant and surface-mount packaged, it targets designs that require a balance of integration, I/O density, and predictable routing.

Key Features

• Logic Capacity — 576 logic elements (72 LABs/CLBs) supporting approximately 56,000 system gates for mid-density digital designs.
• Embedded Memory — 12,288 bits of total on-chip RAM across embedded array blocks (EABs), enabling dual-port megafunctions and localized data buffering.
• I/O and Packaging — Up to 136 user I/O pins in a 256‑BGA (256‑FBGA 17×17) package; surface-mount mounting for compact board layouts.
• Power and Supply — Operates with internal 2.5‑V supply and supports an external voltage supply range of 2.375 V to 2.625 V, facilitating low-voltage system integration.
• Clocking and Timing — Built-in low-skew clock distribution trees with options such as ClockLock™ and ClockBoost™ to reduce clock delay and skew.
• Flexible Interconnect and Arithmetic — FastTrack® continuous routing, dedicated carry and cascade chains for efficient adders, counters, and high‑fan‑in functions.
• Configuration and Test — In-circuit reconfigurability via external configuration devices or JTAG; JTAG boundary-scan compliant with IEEE Std. 1149.1-1990.
• Standards and I/O Features — MultiVolt™ I/O capability described for the family and programmable per-pin options including tri-state control, open-drain, slew-rate control, and clamp to VCCIO.
• Compliance and Grade — Commercial grade device with operating temperature range of 0 °C to 70 °C and RoHS compliance.

Typical Applications

• Communications Equipment — Implement protocol logic, packet buffering, or glue logic for mid-density communications systems leveraging the device’s embedded RAM and I/O count.
• Embedded Control and SOPC — Integrate control functions, peripheral interfaces, and small on-chip memories into a single programmable device for compact embedded designs.
• PCI-Compatible Designs — Suited for designs that require compatibility with PCI Local Bus operation at 3.3‑V (per the ACEX 1K family specifications for 3.3‑V operation).
• High-Volume, Cost-Sensitive Products — Targeted for applications where cost-efficiency and predictable routing are important, such as consumer and communications modules.

Unique Advantages

• Balanced Integration: Combines logic elements and embedded RAM to reduce external memory and discrete glue logic, lowering BOM and board area.
• Predictable Timing: FastTrack® interconnect and low-skew clock trees simplify timing closure and help achieve consistent performance across designs.
• Dedicated Arithmetic Resources: Carry and cascade chains accelerate implementation of adders, counters, and high‑fan‑in logic without eating general routing resources.
• Flexible I/O Control: Per-pin tri-state enable, open-drain option, slew-rate control, and clamp selection provide adaptability to mixed-voltage system interfaces.
• Compact, Surface-Mount Package: 256‑BGA (17×17) packaging offers a small footprint with substantial I/O density for space-constrained boards.
• Compliance and Testability: JTAG boundary-scan support enables board-level test and in-system configuration without consuming user logic.

Why Choose EP1K10FC256-1N?

The EP1K10FC256-1N delivers a mid-density programmable solution that balances logic element count, embedded memory, and I/O capacity in a compact 256‑BGA package. Its family-level features—such as embedded array blocks, dedicated arithmetic chains, FastTrack routing, and low-skew clocking—help designers implement SOPC-style integration and communications-focused logic with predictable performance.

This commercial-grade device is suited for engineers building cost-sensitive, high-volume products or embedded systems that require moderate on-chip RAM, flexible I/O control, and JTAG-based test/configuration. Its RoHS compliance and surface-mount packaging support modern manufacturing and assembly processes while enabling integration into compact, reliable designs.

Request a quote or submit an inquiry for pricing and availability to begin integrating the EP1K10FC256-1N into your next design.