EP1K10FC256-3N

The EP1K10FC256-3N is an ACEX-1K family field programmable gate array (FPGA) device providing programmable logic and embedded memory in a compact FineLine BGA package. Built for cost-efficient system-on-a-programmable-chip (SOPC) integration, the device combines logic array elements and embedded array blocks (EABs) to implement memory-intensive and specialized logic functions.

With 576 logic elements, approximately 12,288 bits of on-chip RAM and 136 user I/O pins, this device targets commercial applications that require moderate logic density, embedded memory, flexible I/O and in-circuit reconfigurability.

Key Features

• Logic Capacity — 576 logic elements and device-level support for up to 56,000 system gates provide the resources to implement control, glue logic, and medium-complexity processing functions.
• Embedded Memory (EABs) — Approximately 12,288 bits of embedded RAM with dual-port capability and up to 16-bit width per EAB enable efficient implementation of FIFOs, buffers and small on-chip data stores.
• I/O and Voltage — 136 user I/O pins with MultiVolt I/O capability; device operates with an internal supply near 2.5 V and specified supply range of 2.375 V to 2.625 V for core supply.
• Packaging and Mounting — 256-pin FineBall Grid Array (256-FBGA, 17×17) package designed for surface-mount assembly to support compact, high-density PCB layouts.
• Configuration and Test — In-circuit reconfigurability (ICR) and built-in JTAG boundary-scan test (IEEE 1149.1) provide flexible configuration and board-level test options without consuming device logic.
• Clocking and Performance — Built-in low-skew clock distribution trees and options such as ClockLock and ClockBoost (series features) reduce clock delay and skew for synchronous designs.
• Interconnect and Arithmetic Support — FastTrack interconnect, dedicated carry chains and cascade chains support predictable routing delays and efficient implementation of arithmetic and high-fan-in logic.
• I/O Control Features — Per-pin tri-state enable, open-drain option, programmable output slew-rate control and clamp-to-VCCIO selection support flexible interfacing and signal integrity control.
• Compliance and Grade — Commercial grade device with operating temperature range 0 °C to 70 °C and RoHS compliance for environmental requirements.

Typical Applications

• Communications Equipment — Implement protocol glue logic, packet buffering and interface bridging using on-chip EABs and flexible I/O.
• Embedded Control — Replace multiple discrete logic components in control and sequencing tasks with a single programmable device to simplify BOM and layout.
• Prototyping and Field Upgradeable Systems — In-circuit reconfigurability and JTAG access enable rapid iteration and field updates for evolving designs.
• Peripheral and Interface Logic — Use the device’s MultiVolt I/O and per-pin I/O controls to interface with mixed-voltage peripherals and legacy devices.

Unique Advantages

• Balanced integration and memory: Embedded RAM and logic elements let you consolidate logic and small memory structures on a single device, reducing component count.
• Flexible I/O for mixed-voltage systems: MultiVolt I/O and per-pin options simplify board-level interfacing with 2.5 V, 3.3 V or 5.0 V domains (series capability).
• Compact, assembly-friendly package: The 256-FBGA (17×17) surface-mount package enables high-density PCB designs while retaining a large number of user I/O pins.
• Design and test support: Built-in JTAG boundary-scan simplifies board test; software tool support for standard HDL and megafunctions (series tools) accelerates development.
• Clock and routing optimizations: Low-skew clock distribution, dedicated carry/cascade chains and FastTrack interconnect improve timing predictability for synchronous and arithmetic functions.
• Compliance and manufacturability: RoHS compliance and 100% functional testing at production help meet environmental and quality requirements.

Why Choose EP1K10FC256-3N?

The EP1K10FC256-3N positions itself as a compact, commercially graded FPGA solution for designs that need moderate logic density, embedded RAM and flexible, mixed-voltage I/O in a small BGA footprint. Its combination of 576 logic elements, dual-port embedded array blocks and 136 user I/Os supports consolidation of interface, control and buffering functions into a single device.

This device is well suited for designers seeking a cost-efficient, reconfigurable building block with on-chip memory, robust clocking resources and board-level testability. The ACEX-1K family feature set and RoHS compliance provide a practical platform for commercial embedded and communications-focused products.

Request a quote or submit an inquiry for EP1K10FC256-3N to receive pricing, availability and lead-time information tailored to your project requirements.