EP1K10FC256-3

IC FPGA 136 I/O 256FBGA
Part Description

ACEX-1K® Field Programmable Gate Array (FPGA) IC 136 12288 576 256-BGA

Quantity 244 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 70°C
Package / Case256-BGANumber of I/O136Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs72Number of Logic Elements/Cells576
Number of Gates56000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits12288

Overview of EP1K10FC256-3 – ACEX-1K® Field Programmable Gate Array (FPGA), 576 logic elements, 12,288-bit embedded RAM, 136 I/O, 256-BGA

The EP1K10FC256-3 is an ACEX-1K® FPGA family device delivering reconfigurable logic and embedded memory in a compact 256-FBGA (17×17) package. Built for commercial applications, this device combines 576 logic elements with approximately 12,288 bits of on-chip RAM and 136 user I/Os to enable system-on-programmable-chip integration, memory-mapped functions, and general-purpose logic processing.

Designed for cost-efficient, low-power implementations, the device supports in-circuit reconfigurability and JTAG boundary-scan for board-level test and configuration. Its electrical and package specifications make it suitable for a range of commercial communications and embedded control applications.

Key Features

  • Core Logic  576 logic elements (LEs) provide combinational and sequential resources for implementing custom logic, state machines, and peripheral glue logic.
  • Embedded Memory  Approximately 12,288 bits of on-chip RAM for data buffering, small FIFOs, and lookup tables.
  • I/O Density  136 user I/O pins support interfacing to external devices and peripherals in a compact BGA footprint.
  • Package & Mounting  256-FBGA (17×17) package in a surface-mount form factor for PCB designs with a small board area budget.
  • Power Supply  Specified supply range of 2.375 V to 2.625 V with an internal 2.5-V core supply as documented for the ACEX-1K family.
  • Temperature & Grade  Commercial grade operation from 0 °C to 70 °C.
  • Configuration & Test  In-circuit reconfigurability and JTAG boundary-scan (IEEE 1149.1) support for configuration, programming, and board-level test.
  • Flexible I/O & System Features  ACEX-1K family features cited in the datasheet include MultiVolt I/O options, individual tri-state control, open-drain options, and programmable slew-rate control to tailor I/O behavior.
  • Interconnect & Arithmetic Support  Series architecture includes dedicated carry and cascade chains and FastTrack interconnect to support arithmetic functions and predictable routing.
  • RoHS Compliant  Device is RoHS compliant for lead-free manufacturing workflows.

Typical Applications

  • Communications Equipment  Use the device for glue logic, protocol bridging, and small packet buffering where compact FPGA resources and reconfigurability are needed.
  • Embedded Control  Implement control state machines, peripheral interfaces, and timing-critical logic in consumer and commercial embedded systems.
  • System Integration / SOPC  Integrate memory-mapped functions and custom logic to reduce board-level component count in system-on-a-programmable-chip designs.
  • Board-Level Test & In-System Updates  Leverage JTAG boundary-scan and in-circuit reconfigurability for diagnostics, firmware updates, and manufacturing test flows.

Unique Advantages

  • Compact, reconfigurable platform: 576 logic elements and embedded RAM allow implementation of moderate-complexity functions in a single 256-FBGA device, reducing BOM and PCB area.
  • Flexible I/O options: 136 I/Os and MultiVolt I/O capabilities let you interface with a variety of peripheral voltage domains without adding level-shifting components.
  • Board-level testability: IEEE 1149.1 JTAG boundary-scan support enables streamlined production testing and in-system programming.
  • Predictable arithmetic and routing support: Dedicated carry and cascade chains with FastTrack interconnect simplify implementation of adders, counters, and other high-fan-in logic.
  • Commercial-grade reliability: Specified operating range of 0 °C to 70 °C and RoHS compliance align with commercial production and regulatory expectations.
  • Toolchain and ecosystem support: ACEX-1K family design support (as documented) enables integration with common FPGA development flows for synthesis, place-and-route, and simulation.

Why Choose EP1K10FC256-3?

The EP1K10FC256-3 delivers a balanced mix of reconfigurable logic, embedded RAM, and I/O density in a compact 256-FBGA package suited for commercial communications and embedded designs. Its on-chip resources and configuration features make it a practical choice when board space, flexibility, and in-system update capability are priorities.

For designers seeking a cost-efficient, RoHS-compliant FPGA with JTAG testability, MultiVolt I/O support, and predictable interconnect/arithmetical resources, the EP1K10FC256-3 provides a field-programmable building block that integrates with existing FPGA development toolchains and production test flows.

Request a quote or submit an inquiry to receive pricing, lead-time, and availability for the EP1K10FC256-3 and to discuss volume or technical requirements.

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