EP1K10QC208-1

The EP1K10QC208-1 is an ACEX-1K family programmable logic device (PLD) tailored for cost-efficient system-on-a-programmable-chip (SOPC) integration. It combines a logic array with embedded array blocks (EABs) to implement both general logic and efficient memory or megafunctions within a single surface-mount package.

Designed for commercial applications and high-volume systems, this device provides a balance of moderate logic capacity, embedded memory, and flexible I/O for glue logic, protocol bridging, and communications interface tasks while supporting in-circuit reconfigurability and standard development-tool flows.

Key Features

• Logic Capacity  576 logic elements (LEs) corresponding to approximately 56,000 equivalent gates for implementing combinational and sequential logic.
• Embedded Memory  Total on-chip RAM of 12,288 bits provided through embedded array blocks (EABs) — series architecture supports dual-port capability for efficient memory megafunctions.
• I/O and Connectivity  120 user I/O pins in a 208-BFQFP package with MultiVolt I/O capability in the ACEX-1K family and I/O performance up to 250 MHz (series specification).
• Package and Mounting  208-BFQFP (208-PQFP, 28×28) surface-mount package, suitable for dense board layouts and automated assembly.
• Power and Voltage  Device supply range 2.375 V to 2.625 V and operates with a 2.5-V internal supply, enabling integration into low-voltage designs.
• Configuration and Test  In-circuit reconfigurability (ICR) via external configuration devices or JTAG port; built-in JTAG boundary-scan test (BST) compliant with IEEE Std. 1149.1-1990 and available without consuming device logic.
• Interconnect and Arithmetic Support  FastTrack® continuous routing structure, dedicated carry and cascade chains for high-speed arithmetic and high-fan-in logic functions (series architecture).
• Operating Range and Compliance  Commercial grade with operating temperature 0 °C to 70 °C and RoHS compliance.

Typical Applications

• SOPC and Embedded Logic  Implement on-chip megafunctions and glue logic where moderate logic density and embedded memory simplify board-level designs.
• Communications Interfaces  Bridge and adapt between standard interfaces in communications equipment, leveraging flexible I/O and embedded memory for protocol buffering.
• Custom Peripherals and Control  Implement application-specific interfaces, control logic, and user I/O handling for industrial and commercial equipment.

Unique Advantages

• Balanced Logic and Memory:  576 logic elements with 12,288 bits of embedded RAM deliver a practical combination of resources for mid-density designs, reducing the need for external components.
• Flexible I/O:  120 user I/O pins in a compact 208-BFQFP package provide convenient board-level connectivity and MultiVolt capability (series feature) for mixed-voltage systems.
• In-Circuit Reconfigurability:  Support for ICR and JTAG boundary-scan enables field updates and manufacturing test without consuming core logic.
• Efficient Routing and Arithmetic Support:  Dedicated carry and cascade chains plus the FastTrack interconnect structure help achieve predictable routing and efficient implementation of adders, counters, and high-fan-in functions.
• Commercial and RoHS-Compliant:  Commercial-grade operating range (0 °C to 70 °C) and RoHS compliance simplify compliance and procurement for mainstream applications.

Why Choose EP1K10QC208-1?

The EP1K10QC208-1 offers a practical, cost-efficient FPGA option within the ACEX-1K family for designers who need moderate logic capacity, embedded RAM, and flexible I/O in a compact surface-mount package. Its combination of 576 logic elements, 12,288 bits of on-chip RAM, and 120 user I/Os makes it well suited for SOPC integration, interface adaptation, and mid-density digital designs.

Backed by the ACEX-1K family features such as in-circuit reconfigurability, JTAG boundary-scan, and tool support indicated in the series datasheet, this device provides a dependable platform for commercial applications that require reprogrammability, compact packaging, and predictable implementation characteristics.

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