EP1K10QC208-2N

IC FPGA 120 I/O 208QFP
Part Description

ACEX-1K® Field Programmable Gate Array (FPGA) IC 120 12288 576 208-BFQFP

Quantity 1,146 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 70°C
Package / Case208-BFQFPNumber of I/O120Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs72Number of Logic Elements/Cells576
Number of Gates56000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits12288

Overview of EP1K10QC208-2N – ACEX-1K® Field Programmable Gate Array (FPGA) IC 120 12288 576 208-BFQFP

The EP1K10QC208-2N is a member of the ACEX-1K programmable logic device family, providing a compact FPGA solution for commercial electronic designs. It integrates a logic array and embedded array blocks (EABs) to implement custom logic, dual-port memory functions and megafunctions within a single surface-mount device.

With 576 logic elements, approximately 12,288 bits of on-chip RAM, and 120 user I/O pins in a 208‑pin PQFP package, this device targets single-chip SOPC-style integration and medium-density control, interface and communication tasks where board-level integration and configurable logic are required.

Key Features

  • Logic Capacity — 576 logic elements and a device gate-equivalent of 56,000 provide medium-density programmable logic for custom functions and control logic.
  • Embedded Memory — Approximately 12,288 total RAM bits across embedded array blocks (EABs) with dual-port capability and up to 16-bit width per EAB for efficient on-chip storage and buffering.
  • I/O and Voltage — 120 user I/O pins in a 208‑pin PQFP (28 × 28) surface-mount package. Device operates with supply in the 2.375 V to 2.625 V range and an internal 2.5 V supply architecture.
  • Configuration and Test — In-circuit reconfigurability via external configuration devices and JTAG boundary-scan (IEEE 1149.1) support for programming and board-level testing without consuming device logic.
  • Clocking and Routing — Built-in low-skew clock distribution, multiple global clock and clear signals, and fast continuous interconnect for predictable timing and reduced clock skew.
  • Packaging & Commercial Grade — Supplied in a 208‑BFQFP package (208‑PQFP 28×28) with a commercial operating temperature range of 0 °C to 70 °C and RoHS compliance.

Typical Applications

  • System-on-a-Programmable-Chip (SOPC) integration — Consolidate glue logic, peripheral interfaces and custom sequencing into a single FPGA to reduce component count and PCB complexity.
  • Communications and Interface Logic — Implement protocol bridging, buffering and customized I/O handling using the device’s embedded RAM and 120 I/O pins.
  • Embedded Memory and Data Path Functions — Use dual-port EABs and dedicated carry/cascade chains for efficient on-chip data storage, FIFO buffers and arithmetic operations.
  • Prototyping and Low-to-Medium Density Designs — Rapidly iterate hardware designs and validate system functions using the device’s reconfigurability and JTAG programming support.

Unique Advantages

  • Compact, integrated logic and memory: Combines logic elements and embedded array blocks to implement control logic and on-chip storage without external memory for many mid-range designs.
  • Flexible I/O and voltage compatibility: I/O count and programmable characteristics support a variety of interfacing needs while operating with a 2.5 V internal supply and a 2.375–2.625 V device supply.
  • Board-level testability: Built-in JTAG boundary-scan enables in-system testing and programming without consuming user logic resources.
  • Predictable timing and clock distribution: Low-skew clock trees and dedicated routing resources simplify timing closure for synchronous designs.
  • RoHS-compliant commercial solution: Surface-mount 208‑PQFP packaging with commercial temperature rating addresses mainstream product and prototype requirements.

Why Choose EP1K10QC208-2N?

The EP1K10QC208-2N delivers a balanced mix of logic, embedded memory and I/O in a compact 208‑pin PQFP package for commercial designs that require on-board programmability and moderate integration. Its 576 logic elements, approximately 12,288 bits of on-chip RAM, and 120 I/O pins make it well suited to SOPC implementations, interface bridging, and mid-density control tasks.

Backed by ACEX-1K family design features such as in-circuit reconfigurability, JTAG boundary-scan and a predictable clock/interconnect architecture, this device provides a practical path to reduce BOM, simplify board routing and accelerate development for commercial electronic products.

Request a quote or submit a product inquiry to obtain pricing, availability and additional technical information for the EP1K10QC208-2N.

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