EP1K10QC208-3N

IC FPGA 120 I/O 208QFP
Part Description

ACEX-1K® Field Programmable Gate Array (FPGA) IC 120 12288 576 208-BFQFP

Quantity 267 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 70°C
Package / Case208-BFQFPNumber of I/O120Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs72Number of Logic Elements/Cells576
Number of Gates56000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits12288

Overview of EP1K10QC208-3N – ACEX-1K FPGA, 120 I/Os, 576 Logic Elements, 208-PQFP

The EP1K10QC208-3N is an ACEX-1K series Field Programmable Gate Array (FPGA) in a 208-pin PQFP package designed for commercial-temperature systems. It combines a programmable logic array with embedded memory blocks to deliver a compact, reconfigurable solution for moderate-density logic, embedded memory functions, and system-level integration.

Typical use cases include custom logic and glue-logic, protocol bridging and communications interfaces, and system-on-a-programmable-chip (SOPC) integration where a balance of I/O count, on-chip RAM, and logic capacity is required.

Key Features

  • Core Logic — 576 logic elements providing programmable logic capacity suitable for moderate-density designs; device architecture supports fast arithmetic and cascade functions via dedicated carry and cascade chains.
  • Embedded Memory — Total of 12,288 bits of on-chip RAM distributed across embedded array blocks (EABs); dual-port capability and up to 16-bit width per EAB for flexible memory configurations.
  • Logic Capacity — Supports up to 56,000 maximum system gates (series data), enabling implementation of larger functions when combined with embedded arrays.
  • I/O and Voltage Flexibility — 120 user I/O pins and MultiVolt I/O support that can interface with 2.5 V, 3.3 V, or 5.0 V devices (series feature); individual pin options include programmable slew-rate control and open-drain/clamp options.
  • Configuration and Test — In-circuit reconfigurability via external configuration devices and JTAG boundary-scan test (IEEE 1149.1) for board-level test and development.
  • Power — Operates with an internal 2.5-V supply; device supply range specified at 2.375 V to 2.625 V to match system power rails.
  • Package & Mounting — 208-pin PQFP (28 × 28 mm) surface-mount package (208-BFQFP/PQFP) for conventional PCB assembly and compact board footprint.
  • Commercial Temperature & Compliance — Rated for commercial operation from 0 °C to 70 °C and RoHS compliant.

Typical Applications

  • Communications Interfaces — Implement protocol conversion, buffering, and timing logic using the combination of logic elements and embedded dual-port RAM.
  • System Glue Logic — Replace discrete glue components with a single programmable device to reduce BOM and simplify board routing for mid-volume products.
  • Embedded Memory Functions — Use the device’s embedded arrays for small on-chip FIFOs, look-up tables, and packet buffering in data-path designs.
  • Custom Control & I/O — 120 programmable I/Os and MultiVolt capability make the device suitable for mixed-voltage interfacing and control functions on commercial systems.

Unique Advantages

  • Flexible I/O Interfacing: MultiVolt I/O support and 120 user pins enable direct interfacing to a variety of 2.5 V, 3.3 V, and 5.0 V peripherals without additional level shifters.
  • On-chip Dual-Port Memory: 12,288 bits of embedded RAM across EABs simplify the implementation of FIFOs and small data buffers, reducing external memory requirements.
  • Reconfigurability and Testability: In-circuit reconfigurability and IEEE 1149.1 JTAG boundary-scan support accelerate development and improve board-level test coverage.
  • Compact Surface-Mount Package: 208-pin PQFP (28 × 28 mm) offers a compact footprint for space-constrained PCBs while supporting standard surface-mount assembly processes.
  • Commercial-Grade Qualification: Rated for 0 °C to 70 °C operation and RoHS compliant, suitable for mainstream commercial applications.

Why Choose EP1K10QC208-3N?

The EP1K10QC208-3N positions itself as a practical, mid-density FPGA choice for designers who need a blend of programmable logic, embedded RAM, and flexible I/O in a compact PQFP package. Its 576 logic elements, 12,288 bits of on-chip RAM, and support for multi-voltage I/O make it well suited to system glue logic, embedded buffering, and communications interface tasks in commercial systems.

With in-circuit reconfigurability, JTAG boundary-scan support, and a defined supply and temperature envelope, this device offers predictable integration into existing commercial designs and provides a clear upgrade path within the ACEX-1K family.

Request a quote or submit a product inquiry to receive pricing, availability, and ordering assistance for EP1K10QC208-3N.

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