EP1K10QC208-1N
| Part Description |
ACEX-1K® Field Programmable Gate Array (FPGA) IC 120 12288 576 208-BFQFP |
|---|---|
| Quantity | 525 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 120 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 72 | Number of Logic Elements/Cells | 576 | ||
| Number of Gates | 56000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 12288 |
Overview of EP1K10QC208-1N – ACEX-1K® Field Programmable Gate Array (FPGA) IC 120 12288 576 208-BFQFP
The EP1K10QC208-1N is an ACEX-1K family field programmable gate array (FPGA) designed for cost-sensitive system-on-a-programmable-chip (SOPC) integration. It combines a programmable logic array with embedded memory blocks and flexible I/O to support communications, embedded control, and general-purpose logic functions.
Built to deliver integration and predictable routing, this device targets high-volume, performance-driven designs where on-chip memory, reconfigurability, and multi-voltage I/O support are required.
Key Features
- Logic Capacity — 576 logic elements and approximately 56,000 gates provide on-chip programmable logic for control, glue logic, and custom datapaths.
- Embedded Memory (EABs) — Total of 12,288 RAM bits across 3 embedded array blocks (EABs) with dual-port capability and up to 16-bit width per EAB for efficient implementation of FIFOs, buffers, and small SRAM functions.
- I/O — 120 user I/O pins with MultiVolt I/O capability to interface with 2.5‑V, 3.3‑V, or 5.0‑V devices; individual tri-state and open-drain options and programmable slew-rate control.
- Voltage and Power — Device operates with an internal 2.5‑V supply and a specified voltage supply range of 2.375 V to 2.625 V.
- Package — 208‑BFQFP package; supplier device package listed as 208‑PQFP (28×28) for straightforward board-level integration.
- Temperature Grade — Commercial grade operation over 0 °C to 70 °C.
- System and Test Support — Built-in JTAG boundary-scan test (IEEE Std. 1149.1) for board-level testing without consuming additional logic; supports in-circuit reconfigurability via external configuration devices or JTAG.
- Clocking and Performance Options — Low-skew clock distribution, up to six global clock signals and four global clear signals, and ClockLock/ClockBoost options to optimize clock delay and skew.
- Interconnect and Arithmetic Support — Dedicated carry and cascade chains for efficient arithmetic and high-fan-in logic, plus FastTrack continuous routing for predictable interconnect delays.
- Standards and Bus Support — Devices in the -1 speed grade are noted as compliant with PCI Local Bus Specification Revision 2.2 for specified operating conditions.
- RoHS Compliance — Device is RoHS compliant.
Typical Applications
- Communications Interfaces — Implement protocol bridging, data buffering, and timing-critical logic for communication systems using on-chip memory and flexible I/O.
- SOPC Integration — Combine custom logic, small embedded memories, and peripheral interfaces into a single programmable device for compact system designs.
- PCI and Bus Logic — Implement bus-interface glue logic and custom PCI-related functions where PCI Local Bus Specification support is required.
- Embedded Control and Instrumentation — Use logic elements and EAB memory to implement control state machines, data capture, and preprocessing in embedded applications.
Unique Advantages
- Balanced Logic and Memory: 576 logic elements paired with 12,288 bits of embedded RAM enable mixed logic-and-memory designs without external SRAM for many use cases.
- Flexible I/O Voltage Support: MultiVolt I/O capability allows direct interfacing to 2.5‑V, 3.3‑V, or 5.0‑V systems, reducing level-shifting requirements.
- Built-in Testability: IEEE 1149.1 JTAG boundary-scan facilitates board-level test and in-system reconfiguration while preserving core logic resources.
- predictable routing and dedicated arithmetic chains: FastTrack routing and dedicated carry/cascade chains simplify implementation of fast adders, counters, and high-fan-in logic.
- Commercial-Grade Reliability: Specified operating range of 0 °C to 70 °C and RoHS compliance make the device suitable for mainstream commercial applications.
- Design Flow Support: Supported by vendor development tools and place-and-route systems to streamline design implementation and migration across ACEX 1K family members.
Why Choose EP1K10QC208-1N?
The EP1K10QC208-1N delivers a balanced mix of programmable logic, embedded memory, and flexible I/O in a compact 208‑pin package, making it well suited for cost-sensitive, high-volume designs that require on-chip memory and reconfigurability. Its combination of dedicated arithmetic chains, predictable routing, and clock management options helps designers implement timing-critical functions with fewer external components.
This device is a practical choice for development teams and OEMs targeting communications interfaces, SOPC consolidation, and embedded control where vendor toolchain support, boundary-scan testability, and multi-voltage interfacing simplify integration and reduce overall system BOM.
Request a quote or submit an inquiry to receive pricing and availability for the EP1K10QC208-1N.

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