EP1K10QC208-3

IC FPGA 120 I/O 208QFP
Part Description

ACEX-1K® Field Programmable Gate Array (FPGA) IC 120 12288 576 208-BFQFP

Quantity 594 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 70°C
Package / Case208-BFQFPNumber of I/O120Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs72Number of Logic Elements/Cells576
Number of Gates56000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits12288

Overview of EP1K10QC208-3 – ACEX-1K FPGA, 576 logic elements, 12,288-bit embedded RAM, 120 I/Os

The EP1K10QC208-3 is an ACEX-1K field programmable gate array (FPGA) from Intel designed for moderate-density, cost-efficient system integration. It combines a logic array with embedded array blocks (EABs) to support megafunctions such as dual-port memory and specialized logic, enabling system-on-a-programmable-chip (SOPC) architectures for communications, embedded control, and peripheral interfacing.

Built for commercial applications, the device provides in-circuit reconfigurability, MultiVolt I/O flexibility, and a 208-pin BFQFP surface-mount package, making it suitable for compact board-level designs that require reprogrammable logic and on-chip memory.

Key Features

  • Logic Capacity — 576 logic elements (LEs) and approximately 56,000 gates for medium-density logic integration.
  • Embedded Memory — 12,288 total RAM bits implemented across embedded array blocks (EABs) to support dual-port memory and storage of intermediate data and state.
  • I/O and Voltage — 120 user I/O pins with MultiVolt I/O capability described by the ACEX-1K family; device uses a 2.5 V internal supply and requires an external voltage supply of 2.375 V to 2.625 V.
  • Package & Mounting — Surface-mount 208-BFQFP package (supplier device package: 208-PQFP, 28×28 mm) for compact PCB implementations.
  • Reconfigurability & Test — In-circuit reconfigurability via external configuration devices, intelligent controllers, or the JTAG port; built-in JTAG boundary-scan (IEEE Std. 1149.1-1990) for board-level testing.
  • Clocking & Timing — Built-in low-skew clock distribution with ClockLock and ClockBoost options, support for up to six global clock signals and four global clear signals to simplify synchronous design.
  • Interconnect & Arithmetic Support — FastTrack continuous routing architecture, dedicated carry and cascade chains for efficient implementation of adders, counters, comparators, and high-fan-in logic.
  • Operating Range & Grade — Commercial grade with an operating temperature range of 0 °C to 70 °C.
  • Standards & Performance — Family-level support for PCI Local Bus operation at 3.3 V (per the ACEX-1K datasheet) and low power consumption characteristics described for the product family.
  • RoHS Compliance — Device is RoHS compliant.

Typical Applications

  • Communications Equipment — Packet processing, protocol bridging, and custom timing/logic functions that leverage on-chip memory and reconfigurable logic.
  • Embedded Systems — SOPC integration where dual-port EABs and dedicated arithmetic chains accelerate storage and control functions on a single device.
  • Peripheral Interfaces and PCI-based Designs — Board-level interface logic for systems requiring 3.3 V PCI Local Bus compatibility at standard bus frequencies (as supported at the family level).
  • Custom Logic and Glue Logic — Compact, surface-mount FPGA for implementing application-specific control, signal conditioning, or glue logic between subsystems.

Unique Advantages

  • Moderate-density integration: 576 logic elements and 12,288 bits of embedded RAM provide a balanced mix of logic and memory for mid-range designs without excessive BOM complexity.
  • On-chip dual-port memory: Embedded array blocks support dual-port operation enabling efficient shared-memory architectures and pipeline buffering.
  • Flexible I/O and supply: 120 user I/Os combined with a 2.5 V internal supply and MultiVolt I/O capabilities (family-level) simplify board-level interfacing with a range of device voltages.
  • Reconfigurability and testability: In-circuit reconfiguration plus integrated JTAG boundary-scan support reduce development and test cycle time for iterative designs and production testing.
  • Clock and arithmetic support: Low-skew clock trees, ClockLock/ClockBoost options, and dedicated carry/cascade chains help implement high-performance synchronous logic and arithmetic functions.
  • Compact package: 208-pin BFQFP surface-mount package enables integration into space-constrained PCBs while exposing 120 I/Os for system connectivity.

Why Choose EP1K10QC208-3?

The EP1K10QC208-3 delivers a practical combination of reprogrammable logic, embedded memory, and flexible I/O in a compact 208-BFQFP package, making it well suited for commercial embedded and communications designs that need in-field configurability and on-chip storage. Its family-level features—such as JTAG boundary-scan, FastTrack interconnect, dedicated carry/cascade chains, and clock distribution options—support predictable timing and efficient implementation of common logic and memory-intensive functions.

Designers targeting moderate-density FPGA implementations will find this device appropriate for reducing external component count while retaining the ability to iterate and update designs via in-circuit reconfiguration. Development and implementation are supported by the ACEX-1K product family toolset and design flows described in the device documentation.

Request a quote or submit a parts inquiry to begin procurement of the EP1K10QC208-3 for your next project.

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