EP1K10TC100-1N

IC FPGA 66 I/O 100TQFP
Part Description

ACEX-1K® Field Programmable Gate Array (FPGA) IC 66 12288 576 100-TQFP

Quantity 277 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package100-TQFP (14x14)GradeCommercialOperating Temperature0°C – 70°C
Package / Case100-TQFPNumber of I/O66Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs72Number of Logic Elements/Cells576
Number of Gates56000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits12288

Overview of EP1K10TC100-1N – ACEX-1K® Field Programmable Gate Array (FPGA) IC 66 12288 576 100-TQFP

The EP1K10TC100-1N is a member of the ACEX‑1K programmable logic device family, providing a compact FPGA with embedded memory for low-cost system-on-a-programmable-chip (SOPC) integration. It combines 576 logic elements, approximately 56,000 gates, and 12,288 bits of on-chip RAM with a 100‑pin TQFP surface-mount package.

Targeted at commercial applications, this device offers in-circuit reconfigurability, a 2.375 V to 2.625 V supply range (operating with a 2.5 V internal supply), and 66 user I/O pins — making it suited for memory-intensive logic, interface bridging, and embedded control functions within the 0 °C to 70 °C operating range.

Key Features

  • Core Logic  576 logic elements and approximately 56,000 gates provide the fabric for custom logic, glue, and control functions.
  • Embedded Memory (EABs)  Three embedded array blocks (EABs) delivering a total of 12,288 RAM bits; EABs support dual-port operation with up to 16‑bit width per block for efficient on-chip storage and megafunction implementation.
  • I/O and Voltage Support  66 user I/O pins with MultiVolt I/O capability (family feature) to interface with a range of device voltages; device operates from a 2.375 V to 2.625 V supply and uses a 2.5 V internal core supply.
  • Configuration & Test  In-circuit reconfigurability and built-in JTAG boundary-scan test (IEEE 1149.1) enable field updates and board-level test without consuming user logic.
  • Clocking & Timing  Family-level features include low-skew clock distribution, ClockLock and ClockBoost options for reduced clock delay and skew, and dedicated carry/cascade chains for high-speed arithmetic and logic functions.
  • Package & Mounting  Surface-mount 100‑TQFP (14 × 14 mm) package for compact board integration and straightforward PCB routing.
  • Compliance & Environmental  RoHS‑compliant device, commercial grade with an operating temperature range of 0 °C to 70 °C.

Typical Applications

  • Communications Interfaces  Use embedded arrays and dual-port memory to implement protocol buffering, data alignment, and interface bridging in communications endpoints and edge devices.
  • Embedded Control and Glue Logic  Leverage the logic elements and I/O count for system glue, peripheral control, and finite-state-machine implementations in compact embedded systems.
  • On‑chip Memory Functions  Implement small frame buffers, FIFOs, and lookup tables using the 12,288 bits of embedded RAM and dual-port capability for concurrent access patterns.
  • Prototyping and Low‑cost Production  The 100‑TQFP package and commercial-grade specification make the device suitable for rapid development boards and cost-sensitive production runs.

Unique Advantages

  • Highly integrated FPGA  Combines logic, embedded RAM, and I/O in a single 100‑TQFP package to reduce BOM and board area.
  • On‑chip dual-port memory  EABs with dual-port capability simplify designs requiring concurrent read/write access and shared memory between functional blocks.
  • Flexible I/O interfacing  MultiVolt I/O family features enable interfacing with different voltage domains, easing integration with mixed-voltage peripherals.
  • Field reconfigurable  In‑circuit reconfigurability and JTAG support streamline post‑assembly updates and in-field fixes without redesigning hardware.
  • Compact SMT package  100‑TQFP (14×14) provides a balance of density and accessibility for debug and prototyping while supporting surface-mount assembly.
  • Regulatory and environmental alignment  RoHS compliance supports environmentally conscious product designs and supply chain requirements.

Why Choose EP1K10TC100-1N?

The EP1K10TC100-1N is positioned for engineers who need a compact, commercially graded FPGA that combines logic capacity, embedded memory, and flexible I/O in a space-efficient 100‑TQFP package. With 576 logic elements, 12,288 bits of on‑chip RAM, and in‑circuit reconfigurability, it supports a wide range of memory‑centric and control applications where board-level integration and reprogrammability matter.

Choose this device when you need predictable, verifiable FPGA capability for commercial-temperature environments, a reduced BOM through on-chip resources, and the ability to update functionality in the field while maintaining RoHS compliance.

Request a quote or submit an inquiry to our sales team to check availability, pricing, and lead-time for EP1K10TC100-1N.

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