EP1K10TC100-3N

IC FPGA 66 I/O 100TQFP
Part Description

ACEX-1K® Field Programmable Gate Array (FPGA) IC 66 12288 576 100-TQFP

Quantity 1,904 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package100-TQFP (14x14)GradeCommercialOperating Temperature0°C – 70°C
Package / Case100-TQFPNumber of I/O66Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs72Number of Logic Elements/Cells576
Number of Gates56000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits12288

Overview of EP1K10TC100-3N – ACEX-1K® Field Programmable Gate Array (FPGA) IC 66 12288 576 100-TQFP

The EP1K10TC100-3N is an ACEX-1K family programmable logic device designed for cost-sensitive commercial applications that require flexible, reconfigurable logic and embedded memory. As a member of the ACEX 1K series, it combines a logic array with embedded array blocks (EABs) to enable system-on-a-programmable-chip (SOPC) integration and efficient implementation of memory-intensive megafunctions.

With 576 logic elements, 12,288 total RAM bits, and up to 66 user I/O pins in a 100-TQFP (14×14) surface-mount package, this device targets compact commercial designs where integration, flexible I/O, and in-circuit reconfigurability are important.

Key Features

  • Logic Capacity  Provides 576 logic elements and a device gate count of 56,000 for implementing combinational and sequential logic functions in compact designs.
  • Embedded Memory  Total on-chip RAM of 12,288 bits supports data buffering and small embedded memory requirements for megafunctions and dual-port memory usage.
  • I/O and Voltage Support  Up to 66 user I/O pins with MultiVolt I/O capability in the ACEX 1K family, enabling interaction with a range of peripheral voltage levels. Device internal supply operates at 2.5 V with a supply range of 2.375 V to 2.625 V.
  • Package and Mounting  Supplied in a 100-TQFP (14×14) surface-mount package suitable for standard PCB assembly processes.
  • Commercial Temperature Grade  Rated for operation from 0 °C to 70 °C, appropriate for commercial applications and environments.
  • In-Circuit Reconfigurability and Test  ACEX family devices include JTAG boundary-scan test circuitry and support in-circuit reconfigurability via external configuration devices or the JTAG port.
  • Low-Power and Clock Features  Family features include low power consumption and built-in clock distribution options (ClockLock and ClockBoost in the series) to support predictable timing in synchronous designs.
  • RoHS Compliant  Device is RoHS compliant, supporting lead-free assembly requirements.

Typical Applications

  • Communications Interfaces  Protocol bridging, interface glue logic, and control functions in commercial communications equipment where reconfigurable logic and on-chip memory improve design flexibility.
  • SOPC and Embedded Control  Integration of custom logic, control state machines, and small embedded functions in system-on-chip style designs to reduce component count.
  • Memory Buffering and Data Path Logic  Embedded RAM and dual-port array capabilities support buffering, FIFOs, and small memory structures for data flow management.
  • General-Purpose Commercial Electronics  User interfaces, peripheral control, and custom glue logic in commercial-grade consumer and industrial automation products operating within the specified temperature range.

Unique Advantages

  • Compact, reconfigurable logic: 576 logic elements deliver a flexible logic resource for implementing control, glue, and custom functions without adding discrete ASICs or CPLDs.
  • Embedded memory for megafunctions: 12,288 bits of on-chip RAM enable efficient implementation of memory-dependent functions and support dual-port memory architectures.
  • Flexible I/O voltage handling: MultiVolt family I/O capabilities allow interfacing with a variety of peripheral voltage levels, simplifying mixed-voltage board designs.
  • In-circuit reconfigurability and standard test: JTAG boundary-scan and ICR support streamline development, programming, and board-level test flows.
  • Standard surface-mount package: 100-TQFP (14×14) packaging supports compact PCB layouts and common assembly processes.
  • Regulatory and assembly-friendly: RoHS compliance supports lead-free manufacturing requirements for contemporary production environments.

Why Choose EP1K10TC100-3N?

The EP1K10TC100-3N is positioned for designers who need a commercial-grade, reconfigurable logic device with integrated memory and flexible I/O in a compact 100-TQFP package. Its combination of 576 logic elements, 12,288 bits of embedded RAM, and up to 66 I/O pins provides a balanced resource set for SOPC integration, interface logic, and memory-buffered datapaths.

For teams focused on reducing BOM complexity while preserving design flexibility, this ACEX-1K device offers in-circuit reconfigurability, JTAG test support, and industry-standard packaging—delivering a pragmatic platform for rapid development and production in commercial electronic products.

Request a quote or submit an inquiry to receive pricing, availability, and technical assistance for EP1K10TC100-3N.

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