EP1K10FI256-2

The EP1K10FI256-2 is an ACEX-1K programmable logic device offering 576 logic elements, 12,288 bits of embedded RAM and up to 136 user I/O pins in a 256-ball fine-pitch BGA surface-mount package. It implements an enhanced embedded array (EAB) and a general logic array to support megafunctions, dual-port memory use and flexible system integration.

Designed and specified for industrial applications, the device operates over a −40°C to 85°C temperature range, runs with a 2.5‑V internal supply and supports a device voltage supply range of 2.375 V to 2.625 V. The EP1K10FI256-2 is RoHS compliant and targeted at compact, cost‑sensitive system-on-programmable-chip and communications-oriented designs.

Key Features

• Logic and Capacity — 576 logic elements and a device gate count of 56,000 provide compact programmable logic for small-to-mid complexity designs.
• Embedded Memory (EAB) — Total on-chip RAM of 12,288 bits with embedded array blocks that support dual-port operation and up to 16‑bit width per EAB for efficient local buffering and megafunction implementation.
• I/O Flexibility — Up to 136 user I/O pins with MultiVolt I/O capability (can drive or be driven by 2.5‑V, 3.3‑V, or 5.0‑V devices) to simplify interfacing with mixed-voltage systems.
• Power and Supply — Operates with a 2.5‑V internal supply; device voltage supply range is 2.375–2.625 V for core operation.
• Package and Mounting — 256‑FBGA (17 × 17) fine-pitch BGA, surface-mount package for high-density board layouts.
• Industrial Temperature Grade — Specified for operation from −40°C to 85°C for use in industrial environments.
• In-Circuit Reconfigurability & Test — Supports in-circuit reconfigurability via external configuration devices or JTAG; includes JTAG boundary-scan (IEEE 1149.1) for board-level test without consuming device logic.
• Interconnect and Arithmetic Support — FastTrack interconnect structure with dedicated carry and cascade chains to implement fast adders, counters and high‑fan‑in logic efficiently; multiple global clock and clear signals supported for system timing.
• Compliance and Environment — RoHS compliant, with I/O pull-ups before and during configuration to assist safe hot-plug or insertion scenarios.

Typical Applications

• System-on-Programmable-Chip (SOPC) — Integrate memory, specialized logic and glue functions into a single programmable device for compact SOPC implementations.
• Communications and Networking — Implement protocol glue logic, buffering and control functions for cost-sensitive communications equipment leveraging embedded RAM and flexible I/O.
• Industrial Control and Automation — Use the industrial temperature rating and flexible I/O to implement sensor interfacing, motion control logic and machine control subsystems.
• Embedded Memory-Intensive Functions — Apply EAB dual-port memory blocks for small local FIFOs, tables or state storage in real-time applications.

Unique Advantages

• Compact, integrated logic and RAM: 576 logic elements combined with 12,288 bits of embedded RAM reduce external memory and glue logic requirements.
• Flexible voltage interfacing: MultiVolt I/O support simplifies mixed-voltage board designs by allowing 2.5 V, 3.3 V or 5.0 V signaling at the I/O pins.
• Industrial temperature support: −40°C to 85°C rating enables deployment in a wide range of industrial environments.
• Testability and reconfiguration: Built-in JTAG boundary-scan and in-circuit reconfigurability streamline board bring-up, field updates and manufacturing test.
• High-density package: 256-FBGA (17×17) surface-mount package supports compact PCB layouts while providing substantial I/O capability.
• Efficient arithmetic and routing: Dedicated carry and cascade chains with FastTrack interconnect help implement arithmetic and high-fan-in logic functions with lower routing overhead.

Why Choose EP1K10FI256-2?

The EP1K10FI256-2 positions itself as a compact, industrial-grade programmable logic device that balances logic capacity, embedded memory and flexible I/O in a fine-pitch BGA package. It is well suited to designers needing a cost‑efficient programmable solution for SOPC integration, communications logic, and industrial control where operating temperature range and in-field reconfigurability matter.

As part of the ACEX-1K family, the device is documented with software design support and automatic place-and-route tools, and it offers on-chip features—such as dual-port EABs, dedicated arithmetic chains and boundary-scan—that help reduce external components and accelerate development.

If you would like pricing information or to request a quote for EP1K10FI256-2, submit a quote request or contact your procurement team to initiate a formal quote.