EP1K100FC484-1

The EP1K100FC484-1 is an ACEX-1K family programmable logic device from Intel designed for cost-efficient system-on-a-programmable-chip integration. It combines a logic array with embedded array blocks (EABs) to deliver programmable logic, embedded memory and flexible I/O for communications and embedded applications.

This device provides 4,992 logic elements, 49,152 bits of on-chip RAM, and up to 333 user I/O pins in a 484-ball BGA package, making it suitable for designs that require moderate logic density, substantial embedded memory, and a high pin count in a surface-mount BGA footprint.

Key Features

• Programmable Logic Core 4,992 logic elements (LEs) and architecture optimized for implementing general logic and arithmetic functions.
• Embedded Memory / EABs Approximately 0.049 Mbits (49,152 bits) of total RAM distributed across embedded array blocks; dual-port capability with up to 16-bit width per EAB for flexible memory architectures.
• I/O and Voltage Support Up to 333 user I/O pins with MultiVolt I/O capability to interface with 2.5 V, 3.3 V, or 5.0 V devices; clamp-to-VCCIO and programmable output slew-rate control available on a per-pin basis.
• Performance and Clocking Dedicated carry and cascade chains for arithmetic and high-fan-in logic, with multiple global clock and clear signals and built-in low-skew clock distribution trees.
• Packaging and Mounting 484-ball BGA (484-FBGA, 23×23) surface-mount package for compact board-level integration while providing a high I/O count.
• Power and Supply Operates with an internal 2.5 V supply; supply range listed as 2.375 V to 2.625 V.
• Configuration and Test In-circuit reconfigurability via external configuration devices, intelligent controllers, or JTAG; JTAG boundary-scan test compliant with IEEE Std. 1149.1-1990.
• Compliance and Environmental RoHS compliant; commercial-grade operating temperature range from 0 °C to 70 °C.

Typical Applications

• Communications Equipment Use the device's embedded memory and high I/O count for protocol implementation, packet processing, and interface bridging in communication systems.
• System-on-Module and SOPC Integration Combine logic, memory and I/O to implement megafunctions and compact system-level functions on a single device.
• Custom Peripherals and I/O Expansion Implement custom peripherals, glue logic, and bus interfaces where flexible I/O voltage support and many user pins are required.
• Memory and Buffering Functions Use dual-port EABs for small SRAM blocks, FIFOs, and buffering between clock domains or interfaces.

Unique Advantages

• Highly integrated logic and memory: 4,992 logic elements together with 49,152 bits of embedded RAM reduce external component count and simplify board designs.
• High I/O capacity in a compact BGA: 333 user I/Os in a 484-ball BGA package enable dense peripheral and bus connectivity without a large PCB footprint.
• Flexible voltage interfacing: MultiVolt I/O support allows direct interfacing to 2.5 V, 3.3 V, and 5.0 V devices, easing integration with mixed-voltage systems.
• Design-for-test and reconfiguration: IEEE 1149.1-compliant JTAG boundary-scan and in-circuit reconfigurability simplify programming, debug, and board-level test.
• Optimized for high-volume designs: Cost-optimized ACEX-1K architecture targets cost-sensitive applications that require predictable logic and memory resources.

Why Choose EP1K100FC484-1?

The EP1K100FC484-1 positions itself as a balanced solution for designers needing moderate programmable logic capacity with substantial embedded memory and a high I/O count in a compact BGA package. Its combination of 4,992 logic elements, 49,152 bits of RAM, and 333 I/O pins supports integration of custom logic, buffering and interface functions while minimizing external components.

This device is appropriate for teams developing communications equipment, embedded systems, and SOPC-based modules where predictable resources, flexible I/O voltage support, and on-board reconfigurability provide tangible design and BOM benefits. RoHS compliance and commercial-grade temperature support ease adoption in standard electronic product designs.

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