EP1K100FC256-3

IC FPGA 186 I/O 256FBGA
Part Description

ACEX-1K® Field Programmable Gate Array (FPGA) IC 186 49152 4992 256-BGA

Quantity 977 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 70°C
Package / Case256-BGANumber of I/O186Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs624Number of Logic Elements/Cells4992
Number of Gates257000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits49152

Overview of EP1K100FC256-3 – ACEX-1K Field Programmable Gate Array (4,992 logic elements, 256‑BGA)

The EP1K100FC256-3 is an ACEX-1K family field programmable gate array (FPGA) provided in a 256‑FBGA (17×17) surface-mount package. It combines a logic array and embedded array blocks (EABs) to deliver on-chip memory and general logic resources for system-level integration.

Designed for commercial applications, this device targets system-on-a-programmable-chip (SOPC) integration and communications-oriented designs that require a balance of logic capacity, embedded RAM, and flexible I/O. Key electrical and environmental parameters include a supply range of 2.375 V to 2.625 V and an operating temperature range of 0 °C to 70 °C.

Key Features

  • Logic Capacity — 4,992 logic elements (LEs) and an internal equivalent of approximately 257,000 system gates, enabling medium-density programmable logic implementations.
  • Embedded Memory — 49,152 total RAM bits implemented across 12 embedded array blocks (EABs); EABs support dual-port operation and up to 16-bit width per block for efficient on-chip data storage and buffering.
  • I/O and System Voltage — 186 user I/O pins with MultiVolt I/O capability noted for the ACEX-1K family; device operates with a specified supply range of 2.375 V to 2.625 V and an internal 2.5‑V supply operation (per family datasheet).
  • Package and Mounting — 256‑pin FineLine BGA (256‑FBGA, 17×17) in a surface-mount package, suitable for compact board layouts.
  • Built-in Test and Configuration — JTAG boundary-scan test (IEEE 1149.1) and in-circuit reconfigurability via external configuration devices, intelligent controller, or JTAG port (family-level features).
  • Dedicated Arithmetic and Routing — Family architecture includes dedicated carry and cascade chains and FastTrack interconnect for predictable routing delays and efficient implementation of adders, counters, and high-fan-in logic (per ACEX-1K documentation).
  • Commercial Grade and Compliance — Commercial-grade device with RoHS compliance; specified operating range 0 °C to 70 °C.

Typical Applications

  • Communications Interfaces — Implement protocol bridging, packet buffering, or interface glue logic where on-chip RAM and moderate logic density streamline board-level complexity.
  • System Integration / SOPC — Integrate memory-mapped peripherals, custom logic blocks, and on-chip buffering to consolidate subsystems into a single programmable device.
  • Embedded Control and Glue Logic — Replace multiple discrete components with programmable logic for control sequencing, bus interfacing, and timing-critical glue functions.
  • Memory-Intensive Functions — Use the 12 EABs and dual-port capability for FIFOs, small on-chip data stores, and buffering in designs that require local RAM.

Unique Advantages

  • Balanced Integration: 4,992 logic elements combined with ~49kbits of embedded RAM reduce the need for external components and simplify board-level design.
  • Flexible I/O: Family-level MultiVolt I/O support and 186 user I/Os allow interfacing with a variety of voltage domains and peripheral devices.
  • Design Predictability: FastTrack interconnect and dedicated carry/cascade chains provide predictable routing and efficient implementation of arithmetic and high-fan-in logic.
  • In-system Reconfigurability: JTAG and in-circuit configuration options enable field updates and iterative development without hardware changes.
  • Compact Packaging: 256‑FBGA (17×17) surface-mount package supports high-density board layouts while keeping device count and BOM complexity low.

Why Choose EP1K100FC256-3?

The EP1K100FC256-3 delivers a practical mix of logic density, embedded memory, and flexible I/O in a compact 256‑FBGA package for commercial applications. Its 4,992 logic elements and 12 EABs provide on-chip resources suitable for medium-complexity logic, buffering, and system integration tasks.

Backed by the ACEX-1K family design features and supported development tools, this device is well suited for teams building communications interfaces, embedded controllers, and SOPC-style integrations that benefit from in-system configurability and predictable routing resources.

If you would like pricing, availability, or to submit a quote request for the EP1K100FC256-3, please request a quote or submit an inquiry with your quantity and delivery needs.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up