EP1K100FC256-3
| Part Description |
ACEX-1K® Field Programmable Gate Array (FPGA) IC 186 49152 4992 256-BGA |
|---|---|
| Quantity | 977 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 186 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 624 | Number of Logic Elements/Cells | 4992 | ||
| Number of Gates | 257000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 49152 |
Overview of EP1K100FC256-3 – ACEX-1K Field Programmable Gate Array (4,992 logic elements, 256‑BGA)
The EP1K100FC256-3 is an ACEX-1K family field programmable gate array (FPGA) provided in a 256‑FBGA (17×17) surface-mount package. It combines a logic array and embedded array blocks (EABs) to deliver on-chip memory and general logic resources for system-level integration.
Designed for commercial applications, this device targets system-on-a-programmable-chip (SOPC) integration and communications-oriented designs that require a balance of logic capacity, embedded RAM, and flexible I/O. Key electrical and environmental parameters include a supply range of 2.375 V to 2.625 V and an operating temperature range of 0 °C to 70 °C.
Key Features
- Logic Capacity — 4,992 logic elements (LEs) and an internal equivalent of approximately 257,000 system gates, enabling medium-density programmable logic implementations.
- Embedded Memory — 49,152 total RAM bits implemented across 12 embedded array blocks (EABs); EABs support dual-port operation and up to 16-bit width per block for efficient on-chip data storage and buffering.
- I/O and System Voltage — 186 user I/O pins with MultiVolt I/O capability noted for the ACEX-1K family; device operates with a specified supply range of 2.375 V to 2.625 V and an internal 2.5‑V supply operation (per family datasheet).
- Package and Mounting — 256‑pin FineLine BGA (256‑FBGA, 17×17) in a surface-mount package, suitable for compact board layouts.
- Built-in Test and Configuration — JTAG boundary-scan test (IEEE 1149.1) and in-circuit reconfigurability via external configuration devices, intelligent controller, or JTAG port (family-level features).
- Dedicated Arithmetic and Routing — Family architecture includes dedicated carry and cascade chains and FastTrack interconnect for predictable routing delays and efficient implementation of adders, counters, and high-fan-in logic (per ACEX-1K documentation).
- Commercial Grade and Compliance — Commercial-grade device with RoHS compliance; specified operating range 0 °C to 70 °C.
Typical Applications
- Communications Interfaces — Implement protocol bridging, packet buffering, or interface glue logic where on-chip RAM and moderate logic density streamline board-level complexity.
- System Integration / SOPC — Integrate memory-mapped peripherals, custom logic blocks, and on-chip buffering to consolidate subsystems into a single programmable device.
- Embedded Control and Glue Logic — Replace multiple discrete components with programmable logic for control sequencing, bus interfacing, and timing-critical glue functions.
- Memory-Intensive Functions — Use the 12 EABs and dual-port capability for FIFOs, small on-chip data stores, and buffering in designs that require local RAM.
Unique Advantages
- Balanced Integration: 4,992 logic elements combined with ~49kbits of embedded RAM reduce the need for external components and simplify board-level design.
- Flexible I/O: Family-level MultiVolt I/O support and 186 user I/Os allow interfacing with a variety of voltage domains and peripheral devices.
- Design Predictability: FastTrack interconnect and dedicated carry/cascade chains provide predictable routing and efficient implementation of arithmetic and high-fan-in logic.
- In-system Reconfigurability: JTAG and in-circuit configuration options enable field updates and iterative development without hardware changes.
- Compact Packaging: 256‑FBGA (17×17) surface-mount package supports high-density board layouts while keeping device count and BOM complexity low.
Why Choose EP1K100FC256-3?
The EP1K100FC256-3 delivers a practical mix of logic density, embedded memory, and flexible I/O in a compact 256‑FBGA package for commercial applications. Its 4,992 logic elements and 12 EABs provide on-chip resources suitable for medium-complexity logic, buffering, and system integration tasks.
Backed by the ACEX-1K family design features and supported development tools, this device is well suited for teams building communications interfaces, embedded controllers, and SOPC-style integrations that benefit from in-system configurability and predictable routing resources.
If you would like pricing, availability, or to submit a quote request for the EP1K100FC256-3, please request a quote or submit an inquiry with your quantity and delivery needs.

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