EP20K100BC356-1

The EP20K100BC356-1 is an APEX-20K® field programmable gate array (FPGA) IC from Altera designed for programmable digital logic applications. It combines 4,160 logic elements with on-chip RAM and a high I/O count in a 356-ball BGA package for compact surface-mount system designs.

Key Features

• Programmable Logic 4,160 logic elements provide the core resources for implementing custom digital functions and control logic.
• Total Gates Approximately 263,000 gates for supporting moderate-complexity logic implementations.
• Embedded Memory Total on-chip RAM: 53,248 bits (approximately 53 kbits) to store buffering, state, and small data structures.
• I/O Capacity 252 user I/O pins to support a wide range of external interfaces and peripheral connectivity.
• Power Core voltage supply range of 1.71 V to 1.89 V to match system power rails and domain requirements.
• Package & Mounting 356-LBGA (356-ball BGA, 35 × 35 mm) surface-mount package for a compact footprint and soldered board attachment.
• Temperature & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C for standard ambient-environment applications.
• RoHS Compliance The device is RoHS compliant for lead-free manufacturing processes.

Typical Applications

• Programmable Control Logic Implement custom state machines and control functions where a compact FPGA with moderate logic density is required.
• Interface Bridging Use the device’s 252 I/O pins to adapt, buffer, or translate signals between system peripherals and processors.
• Embedded Prototyping Deploy as a development platform for validating digital designs that require reconfigurable logic and on-chip RAM.

Unique Advantages

• Balanced Logic Density: 4,160 logic elements and ~263,000 gates enable a balance between capability and board-level cost for mid-range designs.
• Ample I/O Count: 252 I/O pins reduce the need for external multiplexing and simplify connectivity to multiple peripherals.
• Compact BGA Package: The 356-LBGA (35 × 35 mm) package provides a space-efficient footprint for surface-mount assemblies.
• On-Chip RAM: 53,248 bits of embedded memory supports local buffering and small data storage without external RAM.
• Commercial Temperature Rating: Rated 0 °C to 85 °C for deployments in standard commercial environments.
• RoHS Compliant: Meets lead-free manufacturing requirements for modern assembly processes.

Why Choose EP20K100BC356-1?

The EP20K100BC356-1 positions itself as a practical, mid-density FPGA option that integrates 4,160 logic elements, on-chip RAM, and a high I/O count in a compact 356-ball BGA package. Its power and thermal specifications make it suitable for commercial embedded systems that need reconfigurable logic without extensive external components.

This device is a fit for engineering teams and integrators designing compact, surface-mount boards that require moderate programmable logic capacity, local embedded memory, and substantial I/O. Choosing this part delivers predictable, specification-driven capability for scalable prototyping and production use in standard commercial environments.

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