EP20K1000EFC672-2X

The EP20K1000EFC672-2X is an Intel APEX-20KE® family FPGA in a 672-ball BGA package designed for commercial-grade embedded and system applications. It combines a MultiCore™ architecture with lookup-table logic and embedded system blocks to deliver high-density programmable logic, substantial on-chip RAM, and extensive I/O capability.

Typical use cases include high-density control logic, memory-intensive functions, and systems requiring large I/O counts for peripheral and memory interfaces. The device balances integration and power efficiency with a 1.71 V–1.89 V internal supply range and an operating temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity — 38,400 logic elements (LEs) and approximately 1,772,000 gates provide the density needed for complex programmable logic and glue-logic implementations.
• Embedded Memory — Approximately 0.328 Mbits of on-chip RAM (327,680 total RAM bits) suitable for FIFOs, dual-port RAM and other memory-centric functions.
• Extensive I/O — 508 user I/O pins to support broad peripheral connectivity, high-pin-count interfaces, and multiple external memory channels.
• Advanced Package — 672-ball BGA package (supplier package listed as 672-FBGA, 27×27) optimized for high-density board integration and reliable surface-mount assembly.
• Clock and Timing Resources — Series-level clock-management features including multiple PLLs, low-skew clock tree and programmable phase/delay control (as defined by the APEX 20K family).
• Power — Internal supply range of 1.71 V to 1.89 V supporting low-voltage designs and power-conscious system architectures.
• Commercial Grade — Rated for 0 °C to 85 °C operation for standard commercial applications.
• Environmental Compliance — RoHS compliant to support modern assembly and environmental requirements.

Typical Applications

• Embedded control and signal processing — Use the device’s 38,400 logic elements and on-chip RAM for control algorithms, protocol engines, and data buffering in embedded systems.
• Memory interface and bridging — Large I/O count and embedded RAM enable interface logic for external memories and bridging between different bus standards.
• High-density system glue logic — Replace multi-chip glue with a single FPGA to consolidate glue logic, address decoding, and peripheral aggregation.
• Network and telecom subsystem functions — Implement packet handling, buffering, and custom I/O handling using abundant logic and RAM resources.

Unique Advantages

• High integration density: 38,400 logic elements and approximately 0.328 Mbits of embedded memory reduce external component count and simplify PCB layouts.
• Large I/O capacity: 508 I/Os let you implement wide memory buses, multiple peripherals, and extensive signal routing without external expanders.
• Commercial-grade thermal profile: Rated 0 °C to 85 °C to match common commercial product requirements while supporting reliable surface-mount deployment.
• Package suited for dense boards: 672-ball BGA (27×27) provides a compact, manufacturable footprint for space-constrained designs.
• RoHS compliance: Meets lead-free assembly requirements for modern manufacturing processes.

Why Choose EP20K1000EFC672-2X?

The EP20K1000EFC672-2X positions itself as a high-density, commercially rated FPGA for designs that require significant logic resources, embedded memory, and a large number of I/O signals in a compact BGA package. Its APEX-20KE family architecture provides the building blocks for memory-intensive and I/O-rich functions while maintaining a low-voltage internal supply profile.

This device is well suited to engineers and teams consolidating discrete logic and memory functions into a single programmable device for mid- to high-complexity commercial systems, offering scalability within the APEX 20K family and compatibility with series-level clock and I/O features.

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