EP20K1000EFC33-1
| Part Description |
APEX-20KE® Field Programmable Gate Array (FPGA) IC 708 1020-BBGA |
|---|---|
| Quantity | 621 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Altera |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1020-FBGA (33x33) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1020-BBGA | Number of I/O | 708 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3840 | Number of Logic Elements/Cells | 38400 | ||
| Number of Gates | 1772000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 327680 |
Overview of EP20K1000EFC33-1 – APEX-20KE® Field Programmable Gate Array (FPGA) IC 708 1020-BBGA
The EP20K1000EFC33-1 is an APEX-20KE® field programmable gate array (FPGA) from Altera in a 1020-BBGA package. It provides a combination of high logic capacity, substantial on-chip memory, and a large I/O count in a surface-mount, commercial-grade device suitable for a wide range of board-level digital designs.
Key Features
- Core Logic 38,400 logic elements delivering broad combinational and sequential logic capacity for complex FPGA implementations.
- Gate Equivalent Approximately 1,772,000 gates for measuring design scale and integration potential.
- Embedded Memory Approximately 0.33 Mbits (327,680 bits) of on-chip RAM for buffering, FIFOs, and small data storage needs.
- I/O Density 708 user I/O pins to support high-pin-count interfaces and multi-channel signaling on a single device.
- Power Supported core supply voltage from 1.71 V to 1.89 V to match standard low-voltage FPGA power rails.
- Package & Mounting 1020-BBGA package (supplier device package: 1020-FBGA, 33×33) in a surface-mount form factor for compact board integration.
- Temperature Grade Commercial operating range from 0 °C to 85 °C for typical commercial and enterprise applications.
- Environmental Compliance RoHS-compliant construction to meet common environmental standards.
Typical Applications
- High-density I/O designs Systems that require a large number of external connections can leverage the device’s 708 I/O pins for parallel interfaces and multi-channel I/O routing.
- Logic-intensive implementations Designs demanding tens of thousands of logic elements can use the 38,400 logic elements and ~1.77M-gate capacity for complex control and processing tasks.
- On-chip buffering and data handling Applications needing embedded RAM for small data storage, FIFOs, or temporary buffering can utilize the approximately 0.33 Mbits of on-chip memory.
Unique Advantages
- High integration density: 38,400 logic elements and ~1.77M gates allow consolidation of multiple functions into a single FPGA, reducing external components.
- Large I/O complement: 708 I/O pins support complex interfacing needs without additional I/O expanders, simplifying board-level design.
- Compact BBGA packaging: The 1020-BBGA (33×33) surface-mount package enables high-density PCB layouts while maintaining robust signal routing options.
- Low-voltage core operation: Narrow core voltage range (1.71–1.89 V) for straightforward power-supply design and stable power delivery.
- RoHS compliant: Environmentally compliant manufacturing supports regulatory requirements for many commercial products.
- Commercial temperature range: Rated for 0 °C to 85 °C operation to match typical commercial and enterprise deployment environments.
Why Choose EP20K1000EFC33-1?
The EP20K1000EFC33-1 positions itself as a high-capacity, commercially graded FPGA that combines substantial logic resources, a large I/O count, and on-chip memory in a compact 1020-BBGA surface-mount package. It is suited to designers who need to integrate complex digital functions and high-density I/O within standard commercial operating conditions.
With its combination of logic density, memory, and I/O scalability, this APEX-20KE device provides a balanced platform for board-level digital systems where integration, package density, and RoHS compliance are key selection criteria.
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