EP20K1000EBI652-2X

The EP20K1000EBI652-2X is an APEX-20KE family FPGA offering a MultiCore architecture that integrates lookup-table (LUT) logic, product-term logic, and embedded memory for system-on-programmable-chip designs. With 38,400 logic elements and approximately 0.328 Mbits of embedded memory, this industrial-grade device targets high-density programmable logic use where flexible I/O and robust clock management are required.

Built for system integration and higher-temperature environments, the device combines extensive I/O capability with dedicated resources for memory and clock control to support demanding embedded and industrial applications.

Key Features

• Core Architecture MultiCore architecture integrating LUT logic, product-term logic, and embedded memory for flexible partitioning of register-intensive and combinatorial functions.
• Logic Resources 38,400 logic elements and 3,840 LABs/CLBs provide substantial programmable capacity for complex logic and state machines.
• Embedded Memory Total on-chip RAM of 327,680 bits (approximately 0.328 Mbits) to implement FIFOs, dual-port RAM, and CAM-like structures without sacrificing logic resources.
• I/O Capacity and Standards 488 user I/O pins with MultiVolt I/O support and programmable output features; includes family-level support for DDR SDRAM, ZBT SRAM, LVDS, LVPECL, PCI (3.3 V), and a broad set of high-speed I/O standards.
• Clock Management Flexible clocking with up to four phase-locked loops (PLLs), built-in low-skew clock tree, up to eight global clocks, and features such as ClockLock, ClockBoost, and ClockShift for phase and frequency control.
• Performance Characteristics Family-level I/O performance examples include bidirectional I/O timing suited for up to 250 MHz operation and LVDS throughput up to 840 Mbits per channel.
• Power and Voltage Internal supply operation in the specified VCCINT range with device VCCINT supply between 1.71 V and 1.89 V and MultiVolt I/O interface support for common I/O voltage levels.
• Package and Mounting 652-ball BBGA package (652-BGA, 45 × 45 mm) designed for surface-mount assembly to maximize board-level density.
• Industrial Temperature Grade Rated for operation from −40 °C to 100 °C, suitable for industrial environments requiring extended temperature range.
• Compliance RoHS-compliant manufacturing status.

Typical Applications

• Embedded Systems Use the device to integrate custom logic, memory buffers, and interface bridges for compact, programmable embedded controllers.
• High-Speed Memory Interfaces Implement DDR SDRAM and ZBT SRAM controllers and interface logic using the on-chip memory and high-performance I/O.
• Industrial Automation Leverage the industrial temperature rating and extensive I/O to implement motor control, sensor aggregation, and deterministic machine-control logic.
• Communications and Networking Use LVDS and other high-speed I/O standards with the device’s clock-management features to implement data-path and protocol logic for communication equipment.

Unique Advantages

• High integration density: 38,400 logic elements and 327,680 bits of embedded RAM reduce external component count and consolidate system functions on-chip.
• Flexible I/O and protocol support: 488 I/O pins with MultiVolt support and family-level compatibility with PCI, LVDS, and other standards simplify system-level interfacing.
• Robust clocking features: Multiple PLLs and advanced clock-shifting and locking capabilities enable precise timing control for complex synchronous designs.
• Industrial-grade temperature range: Operation from −40 °C to 100 °C supports designs deployed in harsher environments.
• Compact, high-density package: 652-BBGA surface-mount package provides a dense footprint for board-level integration.
• Regulatory and environmental alignment: RoHS compliance assists with regulatory requirements and greener manufacturing objectives.

Why Choose EP20K1000EBI652-2X?

The EP20K1000EBI652-2X delivers a balance of programmable logic density, embedded memory, and flexible I/O in an APEX-20KE architecture tailored for system-on-programmable-chip designs. Its combination of 38,400 logic elements, substantial on-chip RAM, and comprehensive clock and I/O capabilities makes it well suited to embedded, communications, and industrial applications that require consolidation of logic and memory functions.

Designed for industrial environments and surface-mount assembly, this device supports sustained operation across a wide temperature range while providing the integration and interfacing options needed for scalable, long-lived designs.

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