EP20K1000CF672C8

IC FPGA 508 I/O 672FBGA
Part Description

APEX-20KC® Field Programmable Gate Array (FPGA) IC 508 327680 38400 672-BBGA

Quantity 128 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGANumber of I/O508Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3840Number of Logic Elements/Cells38400
Number of Gates1772000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits327680

Overview of EP20K1000CF672C8 – APEX-20KC Field Programmable Gate Array (FPGA) IC, 38,400 logic elements, 327,680 RAM bits, 508 I/O, 672-BBGA

The EP20K1000CF672C8 is an APEX-20KC family FPGA optimized for high-density, memory-centric programmable logic. It combines a MultiCore architecture with look-up table (LUT) logic and embedded system blocks to implement register‑intensive functions and on‑chip memory structures such as FIFOs, dual‑port RAM, and CAMs.

Designed for commercial-grade applications, this device delivers a balance of integration, I/O flexibility and clocking resources for system designs that require large logic capacity, abundant I/O, and embedded RAM.

Key Features

  • Core Logic  38,400 logic elements providing up to 1,772,000 system gates for complex combinational and sequential logic implementations.
  • Embedded Memory  Approximately 0.328 Mbits of on‑chip RAM (327,680 bits) implemented as embedded system blocks for FIFOs, dual‑port RAM and CAM functions.
  • I/O Capacity  508 user I/O pins to support wide parallel interfaces and multi‑channel connectivity.
  • Clocking and Timing  Flexible clock management with up to four PLLs and support for multiple global clock networks to manage low‑skew distribution and clock multiplication/division.
  • Process and Performance  Manufactured on a 0.15‑µm copper‑metal process delivering improved interconnect performance and lower power relative to prior generations.
  • Power and Voltage  Internal supply range of 1.71 V to 1.89 V (typical internal VCCINT ≈ 1.8 V); MultiVolt I/O support in the APEX‑20KC architecture for common I/O standards and signaling levels.
  • Package and Mounting  672‑BBGA package (supplier device package listed as 672‑FBGA, 27 × 27 mm) intended for surface‑mount PCB assembly.
  • Commercial Grade & Temperature  Commercial operating temperature range 0 °C to 85 °C and RoHS compliant.

Typical Applications

  • Memory‑centric logic  Implement on‑chip FIFOs, dual‑port RAM and CAMs for buffering, packet processing and lookup tables using the device's embedded memory resources.
  • High‑I/O interfaces  Support wide parallel buses and multiple high‑speed interfaces with 508 user I/Os and MultiVolt I/O capabilities.
  • Clocked signal processing  Deploy complex, register‑intensive datapaths that require multiple clock domains and PLL‑based clock management.

Unique Advantages

  • Highly integrated logic and memory: Combines 38,400 logic elements with approximately 0.328 Mbits of embedded RAM to reduce external memory dependence and simplify board design.
  • Extensive I/O capacity: 508 I/O pins provide the pin count needed for wide buses, parallel interfaces and complex system interconnects.
  • Flexible clocking: Up to four PLLs and multiple global clocks enable precise timing control for multi‑domain designs and clock multiplication/division requirements.
  • Manufacturing technology: 0.15‑µm copper‑metal fabrication improves interconnect speed and reduces power consumption compared to previous-generation devices.
  • Commercial readiness: RoHS compliant and specified for 0 °C to 85 °C operation to meet standard commercial application requirements.

Why Choose EP20K1000CF672C8?

The EP20K1000CF672C8 positions itself as a high‑density APEX‑20KC FPGA option for designs that require substantial on‑chip logic and embedded memory alongside significant I/O capability. Its MultiCore architecture and embedded system blocks make it suitable for register‑heavy implementations and memory‑oriented functions without sacrificing I/O flexibility or clocking control.

For commercial systems where integration, predictable timing and moderate operating temperature range are priorities, this device delivers a solid combination of capacity, embedded RAM and clock management, backed by the APEX‑20KC architecture and RoHS compliance.

Request a quote or submit an RFQ today to check pricing and availability for EP20K1000CF672C8.

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