EP20K1000CF672C8
| Part Description |
APEX-20KC® Field Programmable Gate Array (FPGA) IC 508 327680 38400 672-BBGA |
|---|---|
| Quantity | 128 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA | Number of I/O | 508 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3840 | Number of Logic Elements/Cells | 38400 | ||
| Number of Gates | 1772000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 327680 |
Overview of EP20K1000CF672C8 – APEX-20KC Field Programmable Gate Array (FPGA) IC, 38,400 logic elements, 327,680 RAM bits, 508 I/O, 672-BBGA
The EP20K1000CF672C8 is an APEX-20KC family FPGA optimized for high-density, memory-centric programmable logic. It combines a MultiCore architecture with look-up table (LUT) logic and embedded system blocks to implement register‑intensive functions and on‑chip memory structures such as FIFOs, dual‑port RAM, and CAMs.
Designed for commercial-grade applications, this device delivers a balance of integration, I/O flexibility and clocking resources for system designs that require large logic capacity, abundant I/O, and embedded RAM.
Key Features
- Core Logic 38,400 logic elements providing up to 1,772,000 system gates for complex combinational and sequential logic implementations.
- Embedded Memory Approximately 0.328 Mbits of on‑chip RAM (327,680 bits) implemented as embedded system blocks for FIFOs, dual‑port RAM and CAM functions.
- I/O Capacity 508 user I/O pins to support wide parallel interfaces and multi‑channel connectivity.
- Clocking and Timing Flexible clock management with up to four PLLs and support for multiple global clock networks to manage low‑skew distribution and clock multiplication/division.
- Process and Performance Manufactured on a 0.15‑µm copper‑metal process delivering improved interconnect performance and lower power relative to prior generations.
- Power and Voltage Internal supply range of 1.71 V to 1.89 V (typical internal VCCINT ≈ 1.8 V); MultiVolt I/O support in the APEX‑20KC architecture for common I/O standards and signaling levels.
- Package and Mounting 672‑BBGA package (supplier device package listed as 672‑FBGA, 27 × 27 mm) intended for surface‑mount PCB assembly.
- Commercial Grade & Temperature Commercial operating temperature range 0 °C to 85 °C and RoHS compliant.
Typical Applications
- Memory‑centric logic Implement on‑chip FIFOs, dual‑port RAM and CAMs for buffering, packet processing and lookup tables using the device's embedded memory resources.
- High‑I/O interfaces Support wide parallel buses and multiple high‑speed interfaces with 508 user I/Os and MultiVolt I/O capabilities.
- Clocked signal processing Deploy complex, register‑intensive datapaths that require multiple clock domains and PLL‑based clock management.
Unique Advantages
- Highly integrated logic and memory: Combines 38,400 logic elements with approximately 0.328 Mbits of embedded RAM to reduce external memory dependence and simplify board design.
- Extensive I/O capacity: 508 I/O pins provide the pin count needed for wide buses, parallel interfaces and complex system interconnects.
- Flexible clocking: Up to four PLLs and multiple global clocks enable precise timing control for multi‑domain designs and clock multiplication/division requirements.
- Manufacturing technology: 0.15‑µm copper‑metal fabrication improves interconnect speed and reduces power consumption compared to previous-generation devices.
- Commercial readiness: RoHS compliant and specified for 0 °C to 85 °C operation to meet standard commercial application requirements.
Why Choose EP20K1000CF672C8?
The EP20K1000CF672C8 positions itself as a high‑density APEX‑20KC FPGA option for designs that require substantial on‑chip logic and embedded memory alongside significant I/O capability. Its MultiCore architecture and embedded system blocks make it suitable for register‑heavy implementations and memory‑oriented functions without sacrificing I/O flexibility or clocking control.
For commercial systems where integration, predictable timing and moderate operating temperature range are priorities, this device delivers a solid combination of capacity, embedded RAM and clock management, backed by the APEX‑20KC architecture and RoHS compliance.
Request a quote or submit an RFQ today to check pricing and availability for EP20K1000CF672C8.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018