EP20K1000CF33C9

The EP20K1000CF33C9 is an APEX-20KC family FPGA delivering a high-density, multi-function programmable-logic solution. Built on a copper-metal fabrication process with a MultiCore architecture and embedded system blocks (ESBs), it targets applications that require large on-chip logic capacity, embedded RAM and flexible high-speed I/O.

This device is suited for designs that need extensive logic resources, substantial embedded memory, and a broad set of I/O options while operating at commercial temperature ranges and a 1.71–1.89 V internal supply.

Key Features

• Core Logic  Up to 38,400 logic elements providing substantial capacity for complex logic and state-machine implementations.
• On-chip Memory  Approximately 0.31 Mbits of embedded RAM (327,680 bits) available without reducing logic capacity; ESBs support FIFOs, dual-port RAM and CAM functions.
• Gate Capacity  Maximum system gates up to 1,772,000 for large, gate-dense designs.
• I/O Density & Flexibility  708 user I/O pins with MultiVolt I/O support for 1.8 V, 2.5 V and 3.3 V interfaces and programmable I/O features described in the family datasheet.
• Clock Management  Up to four phase-locked loops (PLLs) and multiple global clock signals for flexible clocking and low-skew distribution.
• Power & Supply  Designed for low-power operation with an internal supply in the 1.71 V to 1.89 V range and copper interconnects to reduce power consumption.
• Advanced Interconnect  Four-level hierarchical FastTrack interconnect, dedicated carry and cascade chains for efficient implementation of arithmetic and high-fan-in logic.
• Package & Mounting  Surface-mount 1020-BBGA package (supplier package 1020-FBGA, 33×33 mm) for high-pin-count board designs.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation.
• RoHS Compliant  Meets RoHS environmental requirements.

Typical Applications

• High-speed memory interfaces  Use the device’s embedded RAM and I/O support to implement DDR SDRAM and ZBT SRAM interface logic described in the family datasheet.
• High-density programmable logic  Large logic-capacity designs such as protocol bridges, packet processing or custom datapath implementations take advantage of 38,400 logic elements and dedicated arithmetic chains.
• Multi-clock systems  Designs requiring multiple clock domains and low-skew distribution benefit from up to four PLLs and the device’s clock-management features.
• High-pin-count boards  Applications that need many I/O signals can leverage the 708 user I/O pins and the 1020-BBGA package for dense board-level routing.

Unique Advantages

• High logic and memory integration: Combine 38,400 logic elements with approximately 0.31 Mbits of embedded RAM to reduce external memory and discrete logic needs.
• Flexible I/O standards: MultiVolt I/O support and a large I/O count enable straightforward interfacing to 1.8 V, 2.5 V and 3.3 V subsystems.
• Robust clocking options: Up to four PLLs and multiple global clocks simplify complex timing and clock-domain architectures.
• Optimized interconnect and arithmetic: Dedicated carry and cascade chains plus a hierarchical interconnect structure improve implementation efficiency for arithmetic and high-fan-in logic.
• Commercial-grade reliability: Designed for 0 °C to 85 °C operation with RoHS compliance for standard commercial applications.

Why Choose EP20K1000CF33C9?

The EP20K1000CF33C9 positions itself as a high-density FPGA option within the APEX-20KC family that balances extensive logic capacity, embedded memory and a broad feature set for clocking and I/O. Its architecture and on-chip resources make it appropriate for designers building complex logic, memory interface controllers and multi-clock systems where integration and predictable interconnect behavior matter.

For teams looking for a commercially-rated, RoHS-compliant FPGA with a large I/O count and package options that support high-pin-count layouts, this device provides the scalability and architectural features described in the manufacturer’s APEX-20KC documentation.

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