EP20K1000CF33C8N
| Part Description |
APEX-20KC® Field Programmable Gate Array (FPGA) IC 708 327680 38400 1020-BBGA |
|---|---|
| Quantity | 847 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 14 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1020-FBGA (33x33) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1020-BBGA | Number of I/O | 708 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3840 | Number of Logic Elements/Cells | 38400 | ||
| Number of Gates | 1772000 | ECCN | PENDING ECCN | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 327680 |
Overview of EP20K1000CF33C8N – APEX-20KC® Field Programmable Gate Array (FPGA) IC 708 327680 38400 1020-BBGA
The EP20K1000CF33C8N is an APEX-20KC series programmable logic device delivering high-density logic, embedded memory, and extensive I/O in a compact BGA package. Its MultiCore architecture integrates look-up table (LUT) logic and embedded system blocks (ESBs) to support register-intensive functions and on-chip memory implementations.
Designed for applications that require large logic capacity, significant embedded RAM, and flexible I/O, this device offers a balance of performance and low-power characteristics for commercial-temperature systems.
Key Features
- High-density logic — 38,400 logic elements (LEs) and approximately 1,772,000 system gates enable complex logic integration on a single device.
- Embedded memory — Approximately 0.328 Mbits (327,680 bits) of on-chip RAM and 160 ESBs for FIFOs, dual-port RAM and other memory functions without reducing available logic.
- Extensive I/O — 708 user I/O pins support high-pin-count designs and complex external interfacing.
- Clock management — Up to four phase-locked loops (PLLs) and support for multiple global clocks provide flexible clocking and timing control.
- MultiVolt I/O support — I/O interfaces support multiple voltages for system-level interoperability with 1.8 V, 2.5 V and 3.3 V signaling (MultiVolt I/O documented in device datasheet).
- Low-power internal supply — Internal supply centered around 1.8 V (product data lists allowable 1.71 V to 1.89 V), with copper interconnects to reduce power consumption.
- Advanced interconnect and arithmetic support — Dedicated carry and cascade chains plus hierarchical interconnects for predictable timing and efficient implementation of adders, counters and high-fan-in logic.
- Package and mounting — 1020-BBGA package (supplier device package: 1020-FBGA, 33×33) in a surface-mount form factor suitable for compact board designs.
- Commercial temperature grade — Rated for 0 °C to 85 °C operating temperature.
- RoHS compliant — Conforms to RoHS requirements for lead-free assembly.
Typical Applications
- High-density embedded logic — Implement complex state machines, protocol engines and custom datapaths using 38,400 logic elements and dedicated carry/cascade chains.
- Memory controllers and buffering — Leverage approximately 0.328 Mbits of embedded RAM and 160 ESBs for FIFOs, dual-port RAM and other on-chip buffering.
- High-pin-count I/O systems — Use 708 user I/Os for multi-channel interfaces, parallel buses, and extensive peripheral connectivity.
- Clock-rich designs — Systems requiring multiple clock domains or clock multiplication/division can use the device’s up to four PLLs and global clock resources.
Unique Advantages
- High integration density: Consolidate large logic and memory requirements into a single FPGA to reduce BOM and board area.
- Flexible I/O voltage support: MultiVolt I/O capability eases integration with 1.8 V, 2.5 V and 3.3 V peripherals.
- Robust clocking options: Multiple PLLs and global clocks simplify complex timing architectures and multi-domain designs.
- Specialized interconnects: Dedicated carry and cascade chains accelerate arithmetic and high-fan-in logic while improving timing predictability.
- Compact BGA packaging: 1020-BBGA (33×33 supplier package) provides a space-efficient solution for dense PCBs.
- Commercial temperature and RoHS compliance: Ready for commercial deployments with standard environmental and regulatory considerations addressed.
Why Choose EP20K1000CF33C8N?
The EP20K1000CF33C8N is positioned for designs that require substantial on-chip logic and memory alongside broad I/O capability. With 38,400 logic elements, approximately 0.328 Mbits of embedded RAM, 708 I/Os and multiple PLLs, it provides the integration and timing flexibility needed for complex digital systems.
Backed by documented architecture features such as MultiCore LUT and ESB support and software flow references in the device datasheet, this device suits engineering teams aiming to consolidate functionality, simplify board-level design, and leverage established FPGA toolchains and megafunction libraries.
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