EP20K1000CF33C8ES

IC FPGA 708 I/O 1020FBGA
Part Description

APEX-20KC® Field Programmable Gate Array (FPGA) IC 708 327680 38400 1020-BBGA

Quantity 703 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1020-FBGA (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1020-BBGANumber of I/O708Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3840Number of Logic Elements/Cells38400
Number of Gates1772000ECCNOBSOLETEHTS Code0000.00.0000
QualificationN/ATotal RAM Bits327680

Overview of EP20K1000CF33C8ES – APEX-20KC Field Programmable Gate Array, 38,400 LEs, 327,680-bit RAM, 708 I/O, 1020-BBGA

The EP20K1000CF33C8ES is an APEX-20KC series Field Programmable Gate Array (FPGA) IC designed for commercial-grade embedded and system applications. It implements a MultiCore architecture combining look-up table (LUT) logic and embedded system blocks (ESBs) to deliver flexible logic and on-chip memory for control, interface, and buffering functions.

With 38,400 logic elements, approximately 327,680 bits of embedded memory, and up to 708 user I/O pins in a 1020-BBGA (33×33) package, this device targets designs that require high I/O density, integrated memory, and configurable clock management while operating within a 0 °C to 85 °C commercial range.

Key Features

  • Core Architecture  MultiCore architecture that integrates LUT-based logic and embedded system blocks (ESBs) for register-intensive functions and memory implementation such as FIFOs and dual-port RAM.
  • Logic Density  38,400 logic elements with a maximum of 1,772,000 system gates, providing substantial programmable logic capacity for complex designs.
  • Embedded Memory  Approximately 0.33 Mbits (327,680 bits) of on-chip RAM available without reducing logic capacity, suitable for buffering and local storage.
  • I/O and Interface Support  Up to 708 user I/O pins with MultiVolt I/O support (1.8 V, 2.5 V, 3.3 V and 5.0 V via external resistor as noted in the series datasheet) and dedicated support for high-speed differential interfaces such as LVDS channels.
  • Clock Management  Up to four phase-locked loops (PLLs) with built-in low-skew clock tree and features for clock phase, delay shifting, and clock multiplication/division.
  • Process and Power  Manufactured on a 0.15 μm all-layer copper-metal process for improved interconnect performance and lower power; internal supply voltage centered at 1.8 V (specified supply range 1.71 V to 1.89 V in product data).
  • Package & Mounting  Surface-mount 1020-BBGA package (33×33) suitable for board-level integration where high I/O density is required.
  • Commercial Grade & Environmental  Commercial grade device with an operating range of 0 °C to 85 °C and RoHS compliance for environmental compatibility.

Typical Applications

  • Memory Interface Controllers  Use the integrated memory and interface architecture for DDR SDRAM and ZBT SRAM controller implementations and high-speed buffering.
  • System Interface and Bridging  Leverage MultiVolt I/O and PCI-compliant signaling capabilities for PCI/PCI-X/AGP bridging, bus interfacing, and protocol conversion.
  • High-speed Data I/O  Deploy LVDS channels and high-density I/O for multi-channel data acquisition, serialization/deserialization, and high-throughput communications links.
  • Embedded Control and Processing  Implement custom control logic, FIFOs, and dual-port RAM using ESBs and LUT logic for real-time packet or signal processing tasks.

Unique Advantages

  • Highly integrated logic and memory: Combines 38,400 logic elements with approximately 0.33 Mbits of embedded RAM to reduce external memory requirements and simplify board design.
  • High I/O density: Up to 708 user I/O pins in a 1020-BBGA package enables dense connectivity for multi-channel and multi-interface systems.
  • Flexible clocking: Up to four PLLs and dedicated clock features (phase/delay shifting, multiplication/division) enable precise timing control for complex, multi-domain designs.
  • Performance-focused process: 0.15 μm copper-metal fabrication delivers improved interconnect performance and reduced power compared to previous APEX generations (series-level detail).
  • Commercial-ready and RoHS compliant: Designed for 0 °C to 85 °C operation with RoHS compliance to meet common commercial and environmental requirements.
  • Surface-mount, board-friendly package: 1020-BBGA (33×33) package supports high-density PCB layouts and modern surface-mount assembly flows.

Why Choose EP20K1000CF33C8ES?

The EP20K1000CF33C8ES delivers a balance of programmable logic capacity, embedded memory, and broad I/O support in a single commercial-grade FPGA. Its MultiCore architecture and ESBs provide designers with flexible resources for implementing register-intensive functions, memory buffers, and interface logic without sacrificing available logic elements.

This device is well-suited for system designers who need high I/O count, integrated memory for buffering, and configurable clock management within standard commercial temperature and supply ranges. The combination of on-chip resources and package density helps reduce BOM complexity and supports scalable designs backed by the APEX-20KC series documentation and toolchain support.

Request a quote or submit an inquiry to receive pricing and availability information for EP20K1000CF33C8ES and to discuss how this FPGA can meet your design requirements.

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