EP20K1000CF33C9N

The EP20K1000CF33C9N is an APEX-20KC® Field Programmable Gate Array (FPGA) designed for commercial applications that require high-density programmable logic and flexible I/O. Built on the APEX 20KC architecture with MultiCore™ LUT logic and embedded system blocks (ESBs), this device targets designs needing substantial on-chip memory, abundant I/O, and integrated clock management.

Key use cases include high-speed memory interfacing, complex logic functions with heavy register use, and I/O-rich embedded systems. The device combines 38,400 logic elements, approximately 0.33 Mbits of embedded memory, and 708 user I/O pins in a 1020-BBGA package.

Key Features

• Core Logic — 38,400 logic elements and a maximum of 1,772,000 system gates provide high-density programmable logic for register-intensive and complex combinational functions.
• Embedded Memory — Approximately 0.33 Mbits (327,680 bits) of on-chip RAM organized in ESBs, usable without reducing available logic resources.
• I/O Capacity — 708 user I/O pins support a wide range of external interfaces and high pin-count applications.
• Clock and Timing — Device architecture supports up to four phase-locked loops (PLLs) and multiple global clocks for flexible clock management and low-skew distribution.
• High-performance Interconnect — Multi-level FastTrack® interconnect and dedicated carry and cascade chains optimize arithmetic and high-fan-in operations.
• Low-power Design — Operates from an internal supply range centered at 1.8 V with a specified supply range of 1.71 V to 1.89 V and copper interconnect to reduce power consumption.
• Package and Mounting — Surface-mount 1020-BBGA package (supplier device package: 1020-FBGA 33×33) for high I/O density in a compact footprint.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operating temperature for commercial applications.
• Standards and I/O Flexibility — Architecture supports MultiVolt I/O for 1.8 V, 2.5 V, and 3.3 V interfaces and advanced signaling standards via programmable I/O features.
• Mounting and Form Factor — Surface mount package optimized for board-level integration in space-constrained designs.

Typical Applications

• Memory Interface Controllers — Implement DDR/SDRAM and other high-speed memory interfaces using the device’s abundant RAM bits, ESBs, and flexible I/O.
• High-density Logic and Control — Use the 38,400 logic elements for register-heavy designs, state machines, and complex control logic where embedded memory and logic density reduce system BOM.
• Bus and Peripheral Bridging — Support for PCI/parallel bus operation and MultiVolt I/O makes the device suitable for bridging and interface control in embedded systems.
• High-speed Serial and Differential I/O — LVDS and other advanced I/O standards enable high-throughput links and data capture interfaces leveraging the device’s dedicated I/O resources.

Unique Advantages

• High Logic and Memory Density: 38,400 logic elements paired with 327,680 RAM bits enable large designs to be implemented on a single device, reducing board-level component count.
• Flexible Clocking: Up to four PLLs and multiple global clocks allow precise clock domain management for complex synchronous designs.
• Extensive I/O Capability: 708 user I/Os and MultiVolt support simplify interfacing to a wide range of external devices and bus standards.
• Optimized Interconnect: FastTrack® interconnect with dedicated carry and cascade chains accelerates arithmetic and high-fan-in logic, improving timing predictability.
• Commercial-grade Thermal Range: Specified operation from 0 °C to 85 °C for deployment in standard commercial environments.
• Compact, High-pin-count Package: 1020-BBGA (33×33 FBGA) delivers high I/O density in a compact surface-mount form factor suitable for modern PCBs.

Why Choose EP20K1000CF33C9N?

The EP20K1000CF33C9N positions itself as a high-density, I/O-rich FPGA solution for commercial embedded designs that require significant on-chip RAM and sophisticated clock management. Its MultiCore architecture, large logic element count, and dedicated interconnect features support register-intensive logic and complex arithmetic while keeping integration and BOM benefits in focus.

This device is well suited to engineers designing memory interfaces, bus bridges, and I/O-heavy controllers who need a balanced combination of logic capacity, embedded memory, and flexible I/O standards in a 1020-BBGA package backed by the APEX 20KC architecture.

Request a quote or submit an RFQ to obtain pricing, availability, and ordering information for EP20K1000CF33C9N. Our team can provide lead-time details and help evaluate the device for your next design.