EP20K1000CF672C9

IC FPGA 508 I/O 672FBGA
Part Description

APEX-20KC® Field Programmable Gate Array (FPGA) IC 508 327680 38400 672-BBGA

Quantity 218 Available (as of May 26, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGANumber of I/O508Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3840Number of Logic Elements/Cells38400
Number of Gates1772000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits327680

Overview of EP20K1000CF672C9 – APEX-20KC Field Programmable Gate Array (FPGA), 38,400 logic elements

The EP20K1000CF672C9 is an APEX-20KC series FPGA IC offering a high-density, MultiCore architecture with embedded memory and programmable logic. It provides 38,400 logic elements, approximately 0.328 Mbits of on-chip RAM, and 508 user I/O pins in a 672-ball BGA package for compact, surface-mount system designs.

Designed for commercial applications, the device emphasizes integration and flexible I/O and clock management, making it suitable for platforms that require complex glue logic, memory interfacing, and multi-clock systems while operating within a 0 °C to 85 °C range.

Key Features

  • Core Architecture — MultiCore architecture combining LUT-based logic and embedded system blocks for implementing register-intensive and memory functions.
  • Logic Density — 38,400 logic elements supporting up to 1,772,000 gates of implementation capacity for complex digital designs.
  • On‑Chip Memory — Approximately 0.328 Mbits of RAM available for FIFO, dual-port RAM or CAM implementations without reducing available logic.
  • I/O and Interfaces — 508 user I/O pins with MultiVolt I/O support for 1.8 V, 2.5 V, and 3.3 V interfaces to accommodate mixed-voltage systems.
  • Clock Management — Flexible clock circuitry including up to four phase-locked loops (PLLs), multiple global clocks, and programmable phase/delay features for multi-clock designs.
  • Low‑Power Operation — Nominal internal supply around 1.8 V (specified 1.71–1.89 V) with copper interconnects and power-saving options in embedded system blocks.
  • Advanced Interconnect — Hierarchical FastTrack interconnect and dedicated carry/cascade chains for predictable timing and efficient arithmetic/logic implementations.
  • Package & Mounting — 672-ball BGA surface-mount package (supplier package: 672-FBGA, 27×27) suitable for compact board layouts; commercial grade with 0 °C to 85 °C operating range.
  • Standards & Compliance — RoHS-compliant commercial device.

Typical Applications

  • Memory Interface Controllers — Implement DDR SDRAM and ZBT SRAM controllers using the device’s embedded memory and high-speed I/O support.
  • PCI/Peripheral Logic — Use the MultiVolt I/O and programmable clock features for PCI and other high-speed peripheral interfaces at 1.8/2.5/3.3 V signaling levels.
  • High‑Speed Serial and Parallel I/O — Leverage the large I/O count and dedicated interconnect resources for wide parallel buses or multiple LVDS channels in data acquisition and transport.
  • Custom Control and Glue Logic — Replace multiple discrete components with integrated programmable logic and on-chip memory to simplify board design and reduce BOM.

Unique Advantages

  • High integration density: 38,400 logic elements and approximately 0.328 Mbits of RAM reduce the need for external logic and memory components.
  • Flexible multi‑voltage I/O: Support for 1.8 V, 2.5 V, and 3.3 V interfaces simplifies integration with mixed-voltage subsystems.
  • Robust clocking: Up to four PLLs and multiple global clocks enable complex timing domains and precise phase/ frequency control.
  • Predictable timing and arithmetic efficiency: Dedicated carry and cascade chains plus hierarchical interconnect provide efficient, fast implementation of adders, counters, and high-fan-in logic.
  • Compact surface‑mount package: 672-ball BGA (27×27) format allows dense board integration while maintaining a high I/O count.
  • Commercial-grade, RoHS-compliant: Suited for mainstream commercial applications with established environmental compliance.

Why Choose EP20K1000CF672C9?

The EP20K1000CF672C9 positions itself as a high-density, commercially graded FPGA option for designers requiring substantial logic capacity, embedded memory, and versatile I/O in a compact BGA package. Its 38,400 logic elements, approximately 0.328 Mbits of RAM, and flexible clock architecture make it well suited to complex glue logic, memory interface, and multi-clock system designs.

With a nominal internal supply around 1.8 V, MultiVolt I/O support, four PLLs, and RoHS compliance, this device offers a balance of integration, configurability, and practical operating conditions for commercial electronic products, supported by the APEX-20KC family feature set and development tools.

If you would like pricing, availability, or technical evaluation support for EP20K1000CF672C9, request a quote or submit an inquiry to our sales team to start the process.

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