EP20K1000EBC652-2X

IC FPGA 488 I/O 652BGA
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 488 327680 38400 652-BGA

Quantity 992 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package652-BGA (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case652-BGANumber of I/O488Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3840Number of Logic Elements/Cells38400
Number of Gates1772000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits327680

Overview of EP20K1000EBC652-2X – APEX-20KE® Field Programmable Gate Array (FPGA) IC 488 327680 38400 652-BGA

The EP20K1000EBC652-2X is a member of the APEX-20KE programmable logic family, delivering high-density FPGA capability in a 652-BGA package. It integrates MultiCore architecture elements—look-up table (LUT) logic, product-term logic, and embedded system blocks (ESBs)—to support complex logic and embedded memory functions for system-level integration.

Targeted at commercial applications, this device offers a balance of logic resources, embedded memory, and I/O density for designs that require on-chip buffering, high-speed interfaces, and flexible clocking within a 0 °C to 85 °C operating range.

Key Features

  • Logic Density — Provides 38,400 logic elements, enabling substantial programmable logic capacity for mid-to-high complexity designs.
  • Embedded Memory — Includes 327,680 total RAM bits (approximately 0.33 Mbits) implemented in ESBs for FIFOs, dual-port RAM, and CAM functions.
  • System-Level Architecture — MultiCore architecture integrates LUT logic and product-term logic with ESBs to support register-intensive and combinatorial-intensive functions.
  • I/O and Connectivity — 488 user I/O pins with MultiVolt I/O support (series-level support for 1.8 V, 2.5 V, 3.3 V, and 5.0 V signaling) for flexible interfacing with external devices and memory.
  • Clock Management — Series-level clock features include multiple PLLs, a low-skew clock tree, and programmable clock phase/delay options to manage complex timing requirements.
  • Performance Scale — Device-level count of approximately 1,772,000 system gates provides the raw capacity needed for data-path and control logic integration.
  • Package and Assembly — Surface-mount 652-BGA package (652-BGA, 45×45) for high pin-count designs in a compact board footprint.
  • Power and Temperature — Internal supply range 1.71 V to 1.89 V and commercial operating temperature from 0 °C to 85 °C. RoHS compliant.

Typical Applications

  • System Integration and SOPC — Implement embedded system blocks and LUT-based logic to consolidate multiple functions onto a single FPGA.
  • Memory Interfaces and Buffers — Use ESBs for FIFO buffering, dual-port RAM, and CAM implementations to support external memory subsystems and high-throughput paths.
  • High-Speed I/O Designs — Leverage the device’s MultiVolt I/O and dense pin count for interfacing to a variety of peripherals and fast data links.
  • Complex Control and Data-Path Logic — Deploy the device’s logic elements and gate capacity for control engines, protocol handling, and datapath processing in commercial equipment.

Unique Advantages

  • Integrated Memory and Logic: ESBs combined with LUT and product-term logic reduce the need for external memory components for many buffering and lookup functions.
  • High I/O Density: 488 user I/O pins provide flexible routing and interface options, enabling multi-interface board designs without excessive external multiplexing.
  • Flexible Clocking: Series-provided PLLs and clock-management features enable precise timing control for mixed-frequency and high-performance designs.
  • Compact, High-Pin Package: The 652-BGA package allows a high number of I/Os and resources in a compact surface-mount footprint suitable for dense PCBs.
  • Commercial Temperature and RoHS Compliance: Rated for 0 °C to 85 °C operation and RoHS compliant to meet standard commercial manufacturing requirements.

Why Choose EP20K1000EBC652-2X?

The EP20K1000EBC652-2X positions itself as a capable, commercially graded FPGA option within the APEX-20KE family, offering 38,400 logic elements, approximately 0.33 Mbits of embedded memory, and a high I/O count in a 652-BGA package. Its MultiCore architecture and ESB resources make it suitable for designs that need tight integration of logic and on-chip memory.

This part suits teams building commercial embedded systems, memory-intensive buffering solutions, or multi-interface logic systems that value a balance of integration, I/O flexibility, and scalable logic capacity backed by the APEX-20K family features.

Request a quote or submit an inquiry to get pricing, availability, and technical support for EP20K1000EBC652-2X. Our team can provide delivery lead times and ordering assistance.

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