EP20K1000EBC652-2X
| Part Description |
APEX-20KE® Field Programmable Gate Array (FPGA) IC 488 327680 38400 652-BGA |
|---|---|
| Quantity | 992 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 652-BGA (45x45) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 652-BGA | Number of I/O | 488 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3840 | Number of Logic Elements/Cells | 38400 | ||
| Number of Gates | 1772000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 327680 |
Overview of EP20K1000EBC652-2X – APEX-20KE® Field Programmable Gate Array (FPGA) IC 488 327680 38400 652-BGA
The EP20K1000EBC652-2X is a member of the APEX-20KE programmable logic family, delivering high-density FPGA capability in a 652-BGA package. It integrates MultiCore architecture elements—look-up table (LUT) logic, product-term logic, and embedded system blocks (ESBs)—to support complex logic and embedded memory functions for system-level integration.
Targeted at commercial applications, this device offers a balance of logic resources, embedded memory, and I/O density for designs that require on-chip buffering, high-speed interfaces, and flexible clocking within a 0 °C to 85 °C operating range.
Key Features
- Logic Density — Provides 38,400 logic elements, enabling substantial programmable logic capacity for mid-to-high complexity designs.
- Embedded Memory — Includes 327,680 total RAM bits (approximately 0.33 Mbits) implemented in ESBs for FIFOs, dual-port RAM, and CAM functions.
- System-Level Architecture — MultiCore architecture integrates LUT logic and product-term logic with ESBs to support register-intensive and combinatorial-intensive functions.
- I/O and Connectivity — 488 user I/O pins with MultiVolt I/O support (series-level support for 1.8 V, 2.5 V, 3.3 V, and 5.0 V signaling) for flexible interfacing with external devices and memory.
- Clock Management — Series-level clock features include multiple PLLs, a low-skew clock tree, and programmable clock phase/delay options to manage complex timing requirements.
- Performance Scale — Device-level count of approximately 1,772,000 system gates provides the raw capacity needed for data-path and control logic integration.
- Package and Assembly — Surface-mount 652-BGA package (652-BGA, 45×45) for high pin-count designs in a compact board footprint.
- Power and Temperature — Internal supply range 1.71 V to 1.89 V and commercial operating temperature from 0 °C to 85 °C. RoHS compliant.
Typical Applications
- System Integration and SOPC — Implement embedded system blocks and LUT-based logic to consolidate multiple functions onto a single FPGA.
- Memory Interfaces and Buffers — Use ESBs for FIFO buffering, dual-port RAM, and CAM implementations to support external memory subsystems and high-throughput paths.
- High-Speed I/O Designs — Leverage the device’s MultiVolt I/O and dense pin count for interfacing to a variety of peripherals and fast data links.
- Complex Control and Data-Path Logic — Deploy the device’s logic elements and gate capacity for control engines, protocol handling, and datapath processing in commercial equipment.
Unique Advantages
- Integrated Memory and Logic: ESBs combined with LUT and product-term logic reduce the need for external memory components for many buffering and lookup functions.
- High I/O Density: 488 user I/O pins provide flexible routing and interface options, enabling multi-interface board designs without excessive external multiplexing.
- Flexible Clocking: Series-provided PLLs and clock-management features enable precise timing control for mixed-frequency and high-performance designs.
- Compact, High-Pin Package: The 652-BGA package allows a high number of I/Os and resources in a compact surface-mount footprint suitable for dense PCBs.
- Commercial Temperature and RoHS Compliance: Rated for 0 °C to 85 °C operation and RoHS compliant to meet standard commercial manufacturing requirements.
Why Choose EP20K1000EBC652-2X?
The EP20K1000EBC652-2X positions itself as a capable, commercially graded FPGA option within the APEX-20KE family, offering 38,400 logic elements, approximately 0.33 Mbits of embedded memory, and a high I/O count in a 652-BGA package. Its MultiCore architecture and ESB resources make it suitable for designs that need tight integration of logic and on-chip memory.
This part suits teams building commercial embedded systems, memory-intensive buffering solutions, or multi-interface logic systems that value a balance of integration, I/O flexibility, and scalable logic capacity backed by the APEX-20K family features.
Request a quote or submit an inquiry to get pricing, availability, and technical support for EP20K1000EBC652-2X. Our team can provide delivery lead times and ordering assistance.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018