EP20K1000EBC652-1

IC FPGA 488 I/O 652BGA
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 488 327680 38400 652-BGA

Quantity 365 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package652-BGA (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case652-BGANumber of I/O488Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3840Number of Logic Elements/Cells38400
Number of Gates1772000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits327680

Overview of EP20K1000EBC652-1 – APEX-20KE® Field Programmable Gate Array (FPGA) IC, 652-BGA

The EP20K1000EBC652-1 is an APEX-20KE® series FPGA from Intel, delivering a high-density programmable logic fabric in a 652-BGA (45 × 45 mm) package. It combines a MultiCore architecture with look-up table (LUT) logic and embedded system blocks to integrate logic, memory, and I/O for complex system designs.

With 38,400 logic elements, approximately 0.328 Mbits of embedded memory, and 488 user I/Os, this commercial-grade device targets applications that require substantial on-chip logic capacity, flexible high-speed I/O, and compact package integration while operating within a 0 °C to 85 °C range.

Key Features

  • Core & architecture  MultiCore architecture combining LUT logic and product-term logic to implement register-intensive and combinatorial functions.
  • Logic capacity  38,400 logic elements and approximately 1,772,000 system gates of programmable logic for high-density integration.
  • Embedded memory  Approximately 0.328 Mbits of on-chip RAM provided by embedded system blocks (ESBs) suitable for FIFOs, dual-port RAM and CAM implementations.
  • I/O and standards support  488 user I/Os with MultiVolt I/O interface support and advanced I/O capabilities described in the APEX 20K family documentation (LVDS, PCI, and other high-speed interface support at series level).
  • Clock management  Series-level clock resources include multiple PLLs, a built-in low-skew clock tree and features such as ClockLock, ClockBoost and programmable phase/delay shifting for deterministic timing.
  • Power and supply  Internal supply optimized for low-power operation with a specified supply range of 1.71 V to 1.89 V; ESBs offer programmable power-saving modes at the family level.
  • Package & thermal  652-ball BGA (45 × 45 mm) surface-mount package; commercial operating temperature range of 0 °C to 85 °C.
  • Compliance  RoHS compliant.

Typical Applications

  • High-speed memory interfaces  Implement DDR SDRAM and ZBT SRAM interfaces using the device’s embedded memory and series-level external memory support.
  • PCI and bus bridging  Use in PCI-compliant 3.3 V systems for protocol bridging, bus interfacing and host-controller functions as described by the APEX 20K family features.
  • Custom logic and control  Deploy as a dense logic engine for protocol processing, control-state machines and mixed-signal digital control where a large number of logic elements and I/Os are needed.
  • High-speed serial and differential I/O  Leverage family-level LVDS and other high-speed I/O support for channelized data movement and communication subsystems.

Unique Advantages

  • Highly integrated logic and memory:  38,400 logic elements combined with embedded system blocks reduce external component count and simplify board-level design.
  • Wide I/O flexibility:  488 user I/Os and MultiVolt I/O interface support enable direct interfacing with diverse voltage domains and peripherals.
  • Robust clocking options:  Multiple PLLs and programmable clock features support complex clock domain management and timing optimization.
  • Compact, high-density packaging:  652-BGA (45 × 45 mm) package provides a high pin-count solution for space-constrained, high-functionality systems.
  • Commercial-grade reliability and compliance:  Designed for commercial temperature operation (0 °C to 85 °C) and RoHS compliance for environmental regulation adherence.

Why Choose EP20K1000EBC652-1?

The EP20K1000EBC652-1 positions itself as a high-density, commercially graded FPGA option within the APEX-20KE family, offering a balance of substantial logic capacity, embedded memory and extensive I/O in a single 652-BGA package. Its MultiCore architecture and series-level clock and I/O features make it suitable for designs that require integrated memory functions, complex protocol handling, and flexible interfacing.

Designers seeking a documented, RoHS-compliant FPGA with significant on-chip resources and commercial-temperature operation will find this device appropriate for scalable system designs that prioritize integration and compact board-level implementation.

Request a quote or submit an inquiry to receive pricing and availability information for EP20K1000EBC652-1.

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