EP20K1000EBC652-1
| Part Description |
APEX-20KE® Field Programmable Gate Array (FPGA) IC 488 327680 38400 652-BGA |
|---|---|
| Quantity | 365 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 652-BGA (45x45) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 652-BGA | Number of I/O | 488 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3840 | Number of Logic Elements/Cells | 38400 | ||
| Number of Gates | 1772000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 327680 |
Overview of EP20K1000EBC652-1 – APEX-20KE® Field Programmable Gate Array (FPGA) IC, 652-BGA
The EP20K1000EBC652-1 is an APEX-20KE® series FPGA from Intel, delivering a high-density programmable logic fabric in a 652-BGA (45 × 45 mm) package. It combines a MultiCore architecture with look-up table (LUT) logic and embedded system blocks to integrate logic, memory, and I/O for complex system designs.
With 38,400 logic elements, approximately 0.328 Mbits of embedded memory, and 488 user I/Os, this commercial-grade device targets applications that require substantial on-chip logic capacity, flexible high-speed I/O, and compact package integration while operating within a 0 °C to 85 °C range.
Key Features
- Core & architecture MultiCore architecture combining LUT logic and product-term logic to implement register-intensive and combinatorial functions.
- Logic capacity 38,400 logic elements and approximately 1,772,000 system gates of programmable logic for high-density integration.
- Embedded memory Approximately 0.328 Mbits of on-chip RAM provided by embedded system blocks (ESBs) suitable for FIFOs, dual-port RAM and CAM implementations.
- I/O and standards support 488 user I/Os with MultiVolt I/O interface support and advanced I/O capabilities described in the APEX 20K family documentation (LVDS, PCI, and other high-speed interface support at series level).
- Clock management Series-level clock resources include multiple PLLs, a built-in low-skew clock tree and features such as ClockLock, ClockBoost and programmable phase/delay shifting for deterministic timing.
- Power and supply Internal supply optimized for low-power operation with a specified supply range of 1.71 V to 1.89 V; ESBs offer programmable power-saving modes at the family level.
- Package & thermal 652-ball BGA (45 × 45 mm) surface-mount package; commercial operating temperature range of 0 °C to 85 °C.
- Compliance RoHS compliant.
Typical Applications
- High-speed memory interfaces Implement DDR SDRAM and ZBT SRAM interfaces using the device’s embedded memory and series-level external memory support.
- PCI and bus bridging Use in PCI-compliant 3.3 V systems for protocol bridging, bus interfacing and host-controller functions as described by the APEX 20K family features.
- Custom logic and control Deploy as a dense logic engine for protocol processing, control-state machines and mixed-signal digital control where a large number of logic elements and I/Os are needed.
- High-speed serial and differential I/O Leverage family-level LVDS and other high-speed I/O support for channelized data movement and communication subsystems.
Unique Advantages
- Highly integrated logic and memory: 38,400 logic elements combined with embedded system blocks reduce external component count and simplify board-level design.
- Wide I/O flexibility: 488 user I/Os and MultiVolt I/O interface support enable direct interfacing with diverse voltage domains and peripherals.
- Robust clocking options: Multiple PLLs and programmable clock features support complex clock domain management and timing optimization.
- Compact, high-density packaging: 652-BGA (45 × 45 mm) package provides a high pin-count solution for space-constrained, high-functionality systems.
- Commercial-grade reliability and compliance: Designed for commercial temperature operation (0 °C to 85 °C) and RoHS compliance for environmental regulation adherence.
Why Choose EP20K1000EBC652-1?
The EP20K1000EBC652-1 positions itself as a high-density, commercially graded FPGA option within the APEX-20KE family, offering a balance of substantial logic capacity, embedded memory and extensive I/O in a single 652-BGA package. Its MultiCore architecture and series-level clock and I/O features make it suitable for designs that require integrated memory functions, complex protocol handling, and flexible interfacing.
Designers seeking a documented, RoHS-compliant FPGA with significant on-chip resources and commercial-temperature operation will find this device appropriate for scalable system designs that prioritize integration and compact board-level implementation.
Request a quote or submit an inquiry to receive pricing and availability information for EP20K1000EBC652-1.

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