EP20K1000CF33C9ES

IC FPGA 708 I/O 1020FBGA
Part Description

APEX-20KC® Field Programmable Gate Array (FPGA) IC 708 327680 38400 1020-BBGA

Quantity 56 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1020-FBGA (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1020-BBGANumber of I/O708Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3840Number of Logic Elements/Cells38400
Number of Gates1772000ECCNOBSOLETEHTS Code0000.00.0000
QualificationN/ATotal RAM Bits327680

Overview of EP20K1000CF33C9ES – APEX-20KC Field Programmable Gate Array (FPGA) IC 708 327680 38400 1020-BBGA

The EP20K1000CF33C9ES is an APEX-20KC series programmable logic device from Intel. It combines a MultiCore architecture with look-up table (LUT) logic and embedded memory blocks to deliver a high-density, configurable FPGA suitable for a wide range of digital designs.

Designed for applications that require substantial on-chip logic, embedded RAM and flexible I/O, this device targets system designers working on memory interfaces, high‑speed I/O, and complex control or signal-processing functions while offering commercial temperature grading and RoHS compliance.

Key Features

  • Core Logic  Up to 38,400 logic elements enabling complex logic implementations and system-level integration.
  • Gate Density  Approximately 1,772,000 system gates for high-density designs.
  • Embedded Memory  Approximately 0.328 Mbits of on-chip RAM (327,680 bits) that can be used without reducing available logic resources.
  • I/O Capability  708 user I/O pins for broad connectivity to peripherals and external devices; MultiVolt I/O support is provided for common interface voltages.
  • Clocking and Timing  Up to four phase-locked loops (PLLs) and up to eight global clock signals for flexible clock management (series feature).
  • Process and Interconnect  Series-level copper interconnect and a hierarchical FastTrack interconnect structure to support predictable routing and timing.
  • Package and Mounting  1020-BBGA package (supplier package 1020-FBGA 33×33) in a surface-mount form factor suitable for PCB assembly.
  • Power and Supply  Specified voltage supply range of 1.71 V to 1.89 V; built for low-power operation through copper interconnect and architectural power features (series-level).
  • Operating Range and Compliance  Commercial grade operation from 0 °C to 85 °C and RoHS‑compliant.

Typical Applications

  • Memory Interface and Bridging  Implement high-density controller logic for DDR and other high-speed memory interfaces using embedded RAM and flexible I/O.
  • Networking and Communications  Use the device’s high I/O count and clocking resources to implement protocol handling, packet buffering, and interface bridging.
  • Embedded System Control  Deploy in control and monitoring systems that require substantial on-chip logic alongside embedded RAM for FIFOs and buffering.
  • Prototyping and Custom Logic  Suitable for hardware prototyping where configurable logic resources and a large I/O budget are required to validate system architectures.

Unique Advantages

  • High logic capacity: 38,400 logic elements and ~1.77M gates provide the headroom for complex, integrated designs.
  • Significant on‑chip RAM: Approximately 0.328 Mbits of embedded memory supports local buffering and efficient data movement without external RAM for some functions.
  • Flexible I/O resources: 708 user I/Os and MultiVolt I/O support enable a wide range of interface options and system connectivity.
  • Comprehensive clock management: Multiple PLLs and global clocks give designers granular control over timing domains and clock distribution.
  • Commercial temperature and RoHS compliance: Commercial-grade operation from 0 °C to 85 °C with RoHS compliance for environmental and assembly considerations.

Why Choose EP20K1000CF33C9ES?

The EP20K1000CF33C9ES positions itself as a high-density, feature-rich FPGA option within the APEX-20KC family. Its combination of tens of thousands of logic elements, substantial embedded RAM, broad I/O availability, and robust clocking resources makes it well suited for system designers implementing memory interfaces, communications logic, and complex control functions in commercial-temperature applications.

Choosing this device provides a balance of integration and flexibility: designers can consolidate logic and buffering on-chip to simplify board-level designs while leveraging series-level architectural features for predictable timing and power characteristics.

Request a quote or submit a quote request to receive pricing and availability information for EP20K1000CF33C9ES. Our team can provide lead-time details and support for your procurement and design planning needs.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up