EP20K1000CF33C9ES
| Part Description |
APEX-20KC® Field Programmable Gate Array (FPGA) IC 708 327680 38400 1020-BBGA |
|---|---|
| Quantity | 56 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1020-FBGA (33x33) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1020-BBGA | Number of I/O | 708 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3840 | Number of Logic Elements/Cells | 38400 | ||
| Number of Gates | 1772000 | ECCN | OBSOLETE | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 327680 |
Overview of EP20K1000CF33C9ES – APEX-20KC Field Programmable Gate Array (FPGA) IC 708 327680 38400 1020-BBGA
The EP20K1000CF33C9ES is an APEX-20KC series programmable logic device from Intel. It combines a MultiCore architecture with look-up table (LUT) logic and embedded memory blocks to deliver a high-density, configurable FPGA suitable for a wide range of digital designs.
Designed for applications that require substantial on-chip logic, embedded RAM and flexible I/O, this device targets system designers working on memory interfaces, high‑speed I/O, and complex control or signal-processing functions while offering commercial temperature grading and RoHS compliance.
Key Features
- Core Logic Up to 38,400 logic elements enabling complex logic implementations and system-level integration.
- Gate Density Approximately 1,772,000 system gates for high-density designs.
- Embedded Memory Approximately 0.328 Mbits of on-chip RAM (327,680 bits) that can be used without reducing available logic resources.
- I/O Capability 708 user I/O pins for broad connectivity to peripherals and external devices; MultiVolt I/O support is provided for common interface voltages.
- Clocking and Timing Up to four phase-locked loops (PLLs) and up to eight global clock signals for flexible clock management (series feature).
- Process and Interconnect Series-level copper interconnect and a hierarchical FastTrack interconnect structure to support predictable routing and timing.
- Package and Mounting 1020-BBGA package (supplier package 1020-FBGA 33×33) in a surface-mount form factor suitable for PCB assembly.
- Power and Supply Specified voltage supply range of 1.71 V to 1.89 V; built for low-power operation through copper interconnect and architectural power features (series-level).
- Operating Range and Compliance Commercial grade operation from 0 °C to 85 °C and RoHS‑compliant.
Typical Applications
- Memory Interface and Bridging Implement high-density controller logic for DDR and other high-speed memory interfaces using embedded RAM and flexible I/O.
- Networking and Communications Use the device’s high I/O count and clocking resources to implement protocol handling, packet buffering, and interface bridging.
- Embedded System Control Deploy in control and monitoring systems that require substantial on-chip logic alongside embedded RAM for FIFOs and buffering.
- Prototyping and Custom Logic Suitable for hardware prototyping where configurable logic resources and a large I/O budget are required to validate system architectures.
Unique Advantages
- High logic capacity: 38,400 logic elements and ~1.77M gates provide the headroom for complex, integrated designs.
- Significant on‑chip RAM: Approximately 0.328 Mbits of embedded memory supports local buffering and efficient data movement without external RAM for some functions.
- Flexible I/O resources: 708 user I/Os and MultiVolt I/O support enable a wide range of interface options and system connectivity.
- Comprehensive clock management: Multiple PLLs and global clocks give designers granular control over timing domains and clock distribution.
- Commercial temperature and RoHS compliance: Commercial-grade operation from 0 °C to 85 °C with RoHS compliance for environmental and assembly considerations.
Why Choose EP20K1000CF33C9ES?
The EP20K1000CF33C9ES positions itself as a high-density, feature-rich FPGA option within the APEX-20KC family. Its combination of tens of thousands of logic elements, substantial embedded RAM, broad I/O availability, and robust clocking resources makes it well suited for system designers implementing memory interfaces, communications logic, and complex control functions in commercial-temperature applications.
Choosing this device provides a balance of integration and flexibility: designers can consolidate logic and buffering on-chip to simplify board-level designs while leveraging series-level architectural features for predictable timing and power characteristics.
Request a quote or submit a quote request to receive pricing and availability information for EP20K1000CF33C9ES. Our team can provide lead-time details and support for your procurement and design planning needs.

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