EP20K1000CF33C8

The EP20K1000CF33C8 is an APEX-20KC programmable logic device implemented with a MultiCore architecture that integrates lookup-table (LUT) logic and embedded memory. This commercial-grade FPGA delivers 38,400 logic elements, 327,680 on-chip RAM bits (approximately 0.328 Mbits), and up to 708 user I/O pins for dense, system-level integration.

Manufactured using a 0.15-µm all-layer copper-metal fabrication process, the device targets applications that require a combination of high logic density, embedded memory, and flexible I/O in a 1020-BBGA surface-mount package, while operating over a 0 °C to 85 °C temperature range and a supply range of 1.71 V to 1.89 V.

Key Features

• Core & architecture  MultiCore architecture integrating LUT-based logic and embedded system blocks (ESBs) for memory functions; delivers up to 1,772,000 maximum system gates and 38,400 logic elements.
• Embedded memory  327,680 RAM bits available (approximately 0.328 Mbits) that can be used without reducing available logic; ESBs support FIFOs, dual-port RAM and CAM implementations.
• I/O density & standards  Up to 708 user I/O pins supporting MultiVolt I/O for 1.8 V, 2.5 V and 3.3 V interfaces; programmable clamp to VCCIO, individual tri-state control, and output slew-rate control are supported.
• Clock management  Support for up to four PLLs and up to eight global clock signals; features such as ClockLock, ClockBoost and ClockShift provide programmable clock phase, delay and multiplication/division functions.
• High-speed interfaces  Device-level support for high-speed external memories (including DDR SDRAM and ZBT SRAM) and signaling options such as LVDS channels for high-speed differential links.
• Process & power  Built on a 0.15-µm copper-metal process providing high performance with reduced power consumption; internal VCCINT nominally 1.8 V with documented VCC operating range of 1.71 V to 1.89 V.
• Package & mounting  Surface-mount 1020-BBGA package (supplier device package: 1020-FBGA, 33 × 33 mm) suitable for compact board-level integration.
• Commercial operating range  Rated for commercial temperature operation from 0 °C to 85 °C and RoHS compliant.
• Design tool support  Supported by Altera development tools and MegaCore functions for synthesis, place-and-route, and optimized megafunctions for APEX 20KC architecture.

Typical Applications

• High-performance memory controllers  Implement DDR SDRAM and ZBT SRAM interfaces using on-chip resources and ESBs for buffering and FIFOs.
• PCI/host interface logic  Design PCI-compliant interface logic and bridge functions leveraging MultiVolt I/O support and high I/O count.
• Data-acquisition and high-speed I/O  Use LVDS channels and abundant user I/O pins for multichannel high-speed data capture and aggregation.
• System integration and FPGA-based prototyping  Consolidate glue logic, custom accelerators, and memory-mapped peripherals within a single device to simplify board-level design.

Unique Advantages

• High logic density: 38,400 logic elements and up to 1,772,000 maximum system gates enable complex digital designs in a single device.
• Significant embedded memory: 327,680 RAM bits provide on-chip storage for FIFOs, buffers, and dual-port RAM without reducing logic capacity.
• Extensive I/O flexibility: 708 user I/O pins with MultiVolt support allow direct interfacing to a wide range of system peripherals and memory devices.
• Advanced clock features: Up to four PLLs and multiple clock-shifting and boosting functions give designers flexible clocking and timing control.
• Copper-process performance: 0.15-µm copper-metal fabrication improves interconnect performance and power characteristics for demanding designs.
• Compact package: 1020-BBGA (33 × 33) surface-mount package supports high-density board layouts while maintaining a large I/O count.

Why Choose EP20K1000CF33C8?

The EP20K1000CF33C8 APEX-20KC FPGA combines high logic capacity, substantial on-chip RAM, and a large user I/O complement in a compact 1020-BBGA package, making it well suited for system-level designs that require embedded memory and flexible interfacing. Its MultiCore architecture and copper-metal process deliver a balanced platform for designs that need both logic density and reliable clock management.

Designed for commercial applications operating from 0 °C to 85 °C and compliant with RoHS, this device fits projects that demand integration of memory controllers, high-speed I/O, and complex glue logic, with toolchain support for implementation and optimization.

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