EP20K1000CF33C7

IC FPGA 708 I/O 1020FBGA
Part Description

APEX-20KC® Field Programmable Gate Array (FPGA) IC 708 327680 38400 1020-BBGA

Quantity 380 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1020-FBGA (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1020-BBGANumber of I/O708Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3840Number of Logic Elements/Cells38400
Number of Gates1772000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits327680

Overview of EP20K1000CF33C7 – APEX-20KC FPGA · 38,400 logic elements · 327,680 RAM bits · 708 I/O · 1020-BBGA

The EP20K1000CF33C7 is an APEX-20KC series field programmable gate array (FPGA) IC offering a high-density, low-power programmable logic solution. It integrates a MultiCore architecture with look-up table (LUT) logic and embedded memory blocks to address designs requiring significant logic capacity and on-chip RAM.

Targeted at applications that demand flexible system integration, this commercial-grade device delivers up to 1,772,000 system gates, approximately 0.328 Mbits of embedded memory, and 708 user I/O pins in a 1020-BBGA (33×33) package while operating over a 1.71–1.89 V internal supply and a 0 °C to 85 °C temperature range.

Key Features

  • Core Architecture — MultiCore architecture combining LUT-based logic and embedded memory for register-intensive and memory-intensive functions.
  • Logic Capacity — 38,400 logic elements (LEs) and a maximum of 1,772,000 system gates provide high-density programmable logic resources.
  • Embedded Memory — Approximately 0.328 Mbits (327,680 bits) of on-chip RAM and multiple embedded system blocks (ESBs) usable for FIFO, dual-port RAM, and CAM implementations.
  • I/O and Package — 708 user I/O pins in a 1020-BBGA (33×33) package, supporting a wide range of external interfaces and high pin count designs.
  • Power and Supply — Internal supply operating in the 1.71 V to 1.89 V range; copper interconnect and low-power design techniques to reduce power consumption.
  • Clock Management — Flexible clocking with up to four PLLs, built-in low-skew clock tree, and multiple global clock signals for synchronized system timing.
  • High-Speed I/O Features — Support for advanced I/O standards and high-speed memory interfaces; LVDS channels and direct I/O-to-local-interconnect paths for improved timing.
  • Operating Range & Compliance — Commercial grade device rated for 0 °C to 85 °C and RoHS compliant.
  • Software Ecosystem — Supported by Altera Quartus II development software and Altera MegaCore® functions for synthesis, place-and-route, and optimized megafunctions.

Typical Applications

  • System Integration & Glue Logic — Implement complex glue logic and bus bridging with abundant logic elements and a high I/O count for board-level interfacing.
  • Memory Interface Control — Support for DDR SDRAM and ZBT SRAM interfaces enables on-board memory controllers and buffering using embedded system blocks.
  • High-Speed Serial and Differential I/O — LVDS-capable channels and programmable I/O features make the device suitable for high-speed data links and sensor interfaces.
  • Custom Processing and Acceleration — Use the device’s large LUT fabric and embedded RAM for custom datapaths, FIFOs, and on-chip acceleration of compute kernels.

Unique Advantages

  • High Logic Density: 38,400 LEs and up to 1,772,000 system gates enable integration of complex logic and state machines on a single device, reducing system BOM.
  • Substantial On-Chip Memory: Approximately 0.328 Mbits of embedded RAM and ESBs support deep FIFOs, dual-port RAM, and CAM functions without sacrificing logic capacity.
  • Flexible Clocking: Up to four PLLs and an integrated low-skew clock tree simplify multi-clock-domain designs and timing management.
  • Wide I/O Capability: 708 user I/O pins and MultiVolt I/O support provide interface flexibility for 1.8 V, 2.5 V, and 3.3 V signaling environments (as supported by the APEX 20KC series).
  • Low-Power Copper Interconnect: Copper interconnect and device-level power features reduce power consumption for dense designs.
  • Established Tool Support: Quartus II and Altera MegaCore functions provide a mature development flow, easing synthesis, place-and-route, and IP integration.

Why Choose EP20K1000CF33C7?

The EP20K1000CF33C7 positions itself as a high-density, commercially graded FPGA within the APEX-20KC family, combining substantial logic capacity, embedded memory, and a large I/O complement in a 1020-BBGA package. Its MultiCore architecture, clock management features, and low-power copper interconnect make it suited to designs that require integration of complex logic, memory buffering, and high-speed interfaces.

This device is appropriate for engineering teams and designers seeking a configurable, well-supported FPGA platform for mid-to-high complexity applications where performance, integration, and established development tooling are key considerations.

Request a quote or contact our sales team to discuss pricing, availability, and how EP20K1000CF33C7 can be integrated into your next design.

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