EP20K1000CB652C9

The EP20K1000CB652C9 is an APEX-20KC programmable logic device delivering a high-density FPGA architecture with integrated embedded memory and flexible I/O. Built on a copper-metal 0.15‑µm process with a MultiCore architecture, the device targets system integration tasks that require substantial logic capacity, on-chip RAM, and robust clock and I/O management.

Key markets include high-performance embedded systems, memory-interface controllers, and complex glue-logic or prototyping applications where 38,400 logic elements, approximately 0.328 Mbits of embedded RAM, and 488 user I/O pins provide the required resources in a 652‑BGA surface-mount package.

Key Features

• Core & Architecture MultiCore architecture with lookup-table (LUT) logic and dedicated carry/cascade chains; up to 1,772,000 system gates for high-density designs.
• Logic Capacity 38,400 logic elements (LEs) providing the programmable fabric for register‑intensive and combinatorial logic implementations.
• Embedded Memory Approximately 0.328 Mbits (327,680 bits) of on-chip RAM and 160 embedded system blocks (ESBs) for FIFOs, dual-port RAM, and CAM-like functions without reducing available logic.
• Clock & Timing Flexible clock management with up to four phase-locked loops (PLLs), up to eight global clock signals, and features for clock phase/shift and clock multiplication/division to support complex timing domains.
• I/O & Interface Flexibility 488 user I/O pins with MultiVolt support (1.8 V, 2.5 V, 3.3 V) and advanced I/O features including LVDS channels, PCI‑compatible signaling for 3.3 V operation, programmable slew-rate control, individual tri-state enables, and direct connections to local interconnect for fast timing.
• Performance Process Fabricated on a 0.15‑µm all‑layer copper‑metal process for improved interconnect performance and reduced power relative to prior generations.
• Power & Supply Internal supply nominally 1.8 V (device supply range 1.71 V to 1.89 V); ESBs include programmable power-saving modes and copper interconnect reduces overall power consumption.
• Package & Thermal Surface-mount 652‑BGA package (45 × 45 mm footprint) and commercial operating temperature range of 0 °C to 85 °C.
• Standards & Interfaces Built-in support for high-speed external memories (DDR SDRAM, ZBT SRAM), LVDS channels, and PCI Local Bus operation at 3.3 V (as specified for supported modes).
• RoHS Compliant Device is fully RoHS compliant.

Typical Applications

• Memory Interface Controllers Implement DDR and ZBT memory controllers and associated timing logic using on-chip RAM and dedicated interconnect.
• High‑Speed Data I/O Support LVDS channels and PCI-compatible I/O for board-level data aggregation, protocol bridging, or front-end telemetry.
• Embedded System Integration Consolidate glue logic, peripheral interfacing, and custom control functions into a single FPGA with plentiful logic, RAM, and I/O.
• Prototyping and System Evaluation Use the device’s ample logic elements and ESBs for complex prototype designs and for validating system architectures prior to ASIC implementation.

Unique Advantages

• High-density programmable fabric: 38,400 logic elements and up to 1,772,000 system gates enable large-scale logic implementations without partitioning across multiple devices.
• Significant embedded memory resources: Approximately 0.328 Mbits of on-chip RAM and 160 ESBs let you build FIFOs, buffers and dual-port memories while preserving logic resources.
• Versatile I/O voltage support: MultiVolt I/O (1.8 V, 2.5 V, 3.3 V) and advanced I/O controls simplify interfacing with a wide range of legacy and modern peripherals.
• Comprehensive clock management: Up to four PLLs and multiple clock-management features provide flexible clocking arrangements for multi-domain systems.
• Manufacturing and environmental readiness: Surface-mount 652‑BGA package and RoHS compliance support modern PCB assembly and regulatory requirements.
• Commercial-grade operating range: Rated for 0 °C to 85 °C, suitable for standard commercial electronics and embedded applications.

Why Choose EP20K1000CB652C9?

The EP20K1000CB652C9 combines a high-density APEX-20KC architecture with substantial embedded memory and flexible I/O options to deliver a versatile FPGA platform for demanding embedded and interface-centric designs. Its MultiCore LUT-based fabric, copper interconnect process, and clock management resources make it a practical choice for designs that need both logic capacity and sophisticated timing control.

This device suits developers and system integrators building memory controllers, protocol bridges, or large-scale glue logic where consolidation, predictable timing, and MultiVolt I/O support reduce BOM complexity and speed time-to-market. Long-term value is supported through a mature architecture with extensive on-chip resources and RoHS compliance for modern manufacturing.

Request a quote or submit your pricing inquiry to learn availability and receive commercial terms for EP20K1000CB652C9.