EP20K1000CB652C9ES

IC FPGA 488 I/O 652BGA
Part Description

APEX-20KC® Field Programmable Gate Array (FPGA) IC 488 327680 38400 652-BGA

Quantity 647 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package652-BGA (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case652-BGANumber of I/O488Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3840Number of Logic Elements/Cells38400
Number of Gates1772000ECCNOBSOLETEHTS Code0000.00.0000
QualificationN/ATotal RAM Bits327680

Overview of EP20K1000CB652C9ES – APEX-20KC Field Programmable Gate Array, 652-BGA

The EP20K1000CB652C9ES is an APEX-20KC series FPGA in a 652-BGA (45×45) package delivering high-density, reprogrammable logic and on-chip memory for commercial embedded systems. The device combines a MultiCore architecture with LUT-based logic and embedded system blocks (ESBs) to implement memory-intensive functions while preserving logic resources.

Designed for applications that require significant logic capacity and flexible I/O, this device provides 38,400 logic elements, approximately 0.33 Mbits of embedded RAM, and 488 user I/O pins in a surface-mount BGA package.

Key Features

  • Core Architecture  The MultiCore architecture with LUT logic supports register-intensive functions and high-density combinational logic.
  • Logic Density  38,400 logic elements and approximately 1,772,000 gates provide substantial programmable logic resources for complex designs.
  • On-chip Memory  Approximately 327,680 bits of embedded RAM (about 0.33 Mbits) and multiple ESBs for FIFO, dual-port RAM, and CAM implementations.
  • Clocking and PLLs  Flexible clock management with support for up to four phase-locked loops (PLLs), multiple global clocks, and programmable clock-shift and multiplication/division features (series-level capability).
  • I/O and Interfaces  488 user I/O pins with MultiVolt I/O support and advanced signaling options noted for the series, including differential and legacy interfaces (series-level capability).
  • Performance and Interconnect  Copper interconnect and a hierarchical FastTrack interconnect structure for predictable, low-delay routing; dedicated carry and cascade chains for arithmetic and high-fan-in logic.
  • Power and Voltage  Internal/core voltage around 1.8 V with a listed supply range of 1.71 V to 1.89 V; ESBs include programmable power-saving modes at the series level.
  • Package & Temperature  652-BGA (45×45) surface-mount package; commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Regulatory  RoHS compliant.

Typical Applications

  • High-speed memory interfaces  Implement DDR SDRAM and ZBT SRAM controllers using on-chip RAM and dedicated I/O support.
  • Bus bridging and peripheral interfaces  Support for PCI-class interfaces and flexible I/O makes the device suitable for custom bus logic and protocol bridging.
  • Data acquisition and LVDS links  Series-level support for multiple LVDS channels enables high-speed serial/parallel data capture and transmission.
  • Embedded system controllers  Use the combination of logic elements and ESBs to implement control, buffering, and specialized memory functions within embedded products.

Unique Advantages

  • High programmable capacity: 38,400 logic elements and roughly 1.77 million gates provide room for complex logic integration without external ASICs.
  • Significant embedded memory: Approximately 0.33 Mbits of on-chip RAM and multiple ESBs let you implement FIFOs and dual-port RAM while preserving logic resources.
  • Flexible clocking: Up to four PLLs and multiple global clocks enable precise timing control and clock domain management for high-performance designs.
  • Robust I/O options: 488 user I/O pins and series-level multi-voltage I/O support accommodate a wide range of external devices and memory interfaces.
  • Compact, surface-mount package: The 652-BGA (45×45) package provides a dense footprint for space-constrained boards while supporting high pin counts.
  • Compliance and manufacturability: RoHS compliance and standard commercial temperature grading ease integration into mainstream production lines.

Why Choose EP20K1000CB652C9ES?

The EP20K1000CB652C9ES positions itself as a high-density, commercially graded FPGA choice for teams needing a balance of logic capacity, on-chip memory, and flexible I/O in a compact BGA package. Its MultiCore architecture, dedicated arithmetic and cascade chains, and embedded system blocks support memory-centric and register-intensive designs while helping to keep system BOM complexity under control.

This device is well suited to engineers and procurement teams building mid- to high-complexity embedded systems that require scalable logic, on-chip buffering, and versatile interface support, backed by the APEX-20KC series feature set and RoHS compliance.

Request a quote or submit an inquiry for pricing and availability for the EP20K1000CB652C9ES to move your design forward.

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