EP20K1000CB652C8N
| Part Description |
APEX-20KC® Field Programmable Gate Array (FPGA) IC 488 327680 38400 652-BGA |
|---|---|
| Quantity | 1,311 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 14 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 652-BGA (45x45) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 652-BGA | Number of I/O | 488 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3840 | Number of Logic Elements/Cells | 38400 | ||
| Number of Gates | 1772000 | ECCN | PENDING ECCN | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 327680 |
Overview of EP20K1000CB652C8N – APEX-20KC® Field Programmable Gate Array (FPGA) IC 488 327680 38400 652-BGA
The EP20K1000CB652C8N is an APEX-20KC series programmable logic device (PLD) in a 652-BGA (45×45) package. It combines a MultiCore architecture of look-up table (LUT) logic and embedded memory blocks to deliver a high-density, reconfigurable logic platform for commercial applications.
Targeted at designers who need on-chip memory, abundant I/O and clock-management resources, this device provides 38,400 logic elements, approximately 327,680 bits of embedded RAM, 488 user I/O pins and integrated PLLs for flexible clocking.
Key Features
- High-density logic — 38,400 logic elements (LEs) and up to 1,772,000 maximum system gates for integrating complex digital functions.
- Embedded memory — Approximately 327,680 bits of on-chip RAM that can be used without reducing available logic resources.
- Rich I/O — 488 user I/O pins with MultiVolt I/O support for 1.8 V, 2.5 V and 3.3 V interfaces and programmable output slew-rate and tri-state control.
- Clock management — Up to four phase-locked loops (PLLs) plus a built-in low-skew clock tree, supporting multiple global clocks and programmable clock features.
- Copper-process performance — Manufactured with a 0.15‑µm all-layer copper-metal fabrication process and FastTrack interconnect to provide improved interconnect performance.
- I/O and interface support — Capable of supporting high-speed external memories and advanced I/O standards; direct I/O-to-local-interconnect improves timing for I/O-driven logic.
- Power and supply — Internal supply centered at 1.8 V (specified supply 1.71 V to 1.89 V); MultiVolt I/O options and ESB power-saving modes.
- Package and reliability — Surface-mount 652-BGA package (45×45) and commercial-grade operating range (0 °C to 85 °C). RoHS compliant.
Typical Applications
- Networking & Communications — Implement protocol bridging, packet processing and interface logic that benefit from large logic count and integrated memory.
- Memory and Storage Interfaces — Support high-speed external memories such as DDR SDRAM and ZBT SRAM using on-chip memory and dedicated clock management.
- Custom Hardware Acceleration — Offload compute- or control-intensive tasks to reconfigurable logic using the device’s ample LEs and embedded RAM.
- High-density I/O Control — Drive complex multi-I/O subsystems and LVDS channels with programmable I/O features and direct I/O-to-local-interconnect paths.
Unique Advantages
- Large logic and memory capacity: 38,400 logic elements and approximately 327,680 RAM bits allow integration of sizeable digital subsystems on a single device, reducing external component count.
- Flexible clocking: Up to four PLLs and a low-skew clock tree give designers precise clock domain control for timing-critical designs.
- MultiVolt I/O versatility: Support for multiple I/O voltage levels simplifies board-level interfacing across 1.8 V, 2.5 V and 3.3 V domains.
- High I/O density: 488 user I/O pins in a compact 652‑BGA package support complex interconnect and peripheral integration.
- Commercial-grade, RoHS compliant: Surface-mount package and commercial temperature rating (0 °C to 85 °C) with RoHS compliance for modern assembly processes.
Why Choose EP20K1000CB652C8N?
The EP20K1000CB652C8N positions itself as a high-density, commercially graded FPGA solution that balances large logic capacity, substantial embedded memory and flexible I/O in a compact 652-BGA package. Its MultiCore architecture, copper interconnect and built-in clock management make it suitable for designs requiring integrated memory, complex data paths and multiple clock domains.
This device is well suited for commercial designs in communications, memory interfacing and custom hardware acceleration where board-level integration, configurable logic and precise clocking are required. The combination of on-chip RAM, abundant LEs and versatile I/O options delivers long-term scalability and integration benefits within the APEX-20KC family ecosystem.
Request a quote or submit an inquiry to get pricing and availability information for EP20K1000CB652C8N and to discuss how this device can fit your next design.

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