EP20K1000CB652C7ES

The EP20K1000CB652C7ES is an APEX-20KC® programmable logic device built on a 0.15-μm all-layer copper-metal fabrication process with MultiCore™ architecture. It provides a high-density FPGA fabric with 38,400 logic elements and embedded memory, targeted at designs requiring substantial logic, on-chip RAM, flexible I/O, and advanced clock management.

With up to 1,772,000 system gates, 488 user I/O pins in a 652-BGA (45×45) package, and support for MultiVolt I/O, this commercial-grade device is suited to applications that need high integration, performance, and low-power operation within a 0 °C to 85 °C operating range.

Key Features

• Core Architecture — MultiCore™ architecture integrating look-up table (LUT) logic and embedded memory, implemented in a 0.15-μm copper-metal process for improved performance and lower power.
• Logic Capacity — 38,400 logic elements supporting up to 1,772,000 system gates for complex programmable logic implementations.
• Embedded Memory — Approximately 0.33 Mbits (327,680 bits) of on-chip RAM usable without reducing available logic resources.
• I/O and Package — 488 user I/O pins in a 652-BGA (45×45) package; MultiVolt I/O support for 1.8 V, 2.5 V, and 3.3 V interfaces (5.0-V tolerance achievable with an external resistor as noted).
• Clock Management — Up to four phase-locked loops (PLLs), a built-in low-skew clock tree, and features such as ClockLock, ClockBoost, and ClockShift for flexible clocking and timing control.
• Memory and External Interface Support — Designed to support high-speed external memories including DDR SDRAM and ZBT SRAM and compliant operation with PCI 3.3-V interfaces (33/66 MHz, 32/64 bits) as described in device documentation.
• Low-Power Operation — 1.8-V internal supply design with copper interconnects and ESBs that include programmable power-saving modes to reduce overall power consumption.
• Commercial Grade & Compliance — Commercial-grade device with RoHS compliance; specified operating temperature range 0 °C to 85 °C and supply voltage 1.71 V to 1.89 V.
• Design Tools — Supported by vendor development tools and megafunction libraries for synthesis, placement, and routing as indicated in the product documentation.

Typical Applications

• High-speed memory interfaces — Implement DDR SDRAM or ZBT SRAM controllers and associated logic using the device's on-chip RAM, abundant logic elements, and high-speed I/O support.
• High-throughput I/O bridging — Use the device for PCI-compatible interfaces and multi-voltage I/O bridging where flexible voltage domains and many user I/Os are required.
• Serial/parallel data processing — Deploy the FPGA for LVDS and other high-speed signaling channels, leveraging dedicated interconnect, carry/cascade chains, and clocking resources for low-latency processing.
• Prototyping and embedded systems — Rapidly prototype complex logic and embedded functions with the integrated LUTs, ESBs, and vendor megafunction support.

Unique Advantages

• High integration density: 38,400 logic elements and up to 1,772,000 system gates enable large, consolidated designs that reduce external component count.
• Significant embedded memory: Approximately 0.33 Mbits of on-chip RAM available without reducing logic resources, simplifying buffer and FIFO implementations.
• Flexible multi-voltage I/O: Native support for 1.8 V, 2.5 V, and 3.3 V interfaces enables seamless integration with a range of peripherals and memory devices.
• Advanced clocking: Up to four PLLs plus ClockLock/ClockBoost/ClockShift features provide precise timing control for complex, multi-clock designs.
• Low-power copper process: 1.8-V internal supply and copper interconnects contribute to reduced power consumption in dense logic designs.
• Commercial availability and compliance: RoHS-compliant, commercial-grade device with documented toolchain and megafunction support to accelerate development.

Why Choose EP20K1000CB652C7ES?

The EP20K1000CB652C7ES combines high logic density, substantial embedded RAM, and flexible I/O in a 652-BGA package, offering a compact platform for complex digital designs. Its MultiCore™ architecture, advanced clocking, and vendor tool support make it well suited for designers building memory interfaces, bridging logic, and high-throughput data paths where integration and predictable timing are priorities.

For development teams and OEMs looking to consolidate functions, reduce board-level components, and rely on a documented FPGA architecture and toolset, this APEX-20KC device provides a scalable, commercially graded option that balances performance, power, and I/O flexibility.

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