EP1SGX40GF1020I6N
| Part Description |
Stratix® GX Field Programmable Gate Array (FPGA) IC 624 3423744 41250 1020-BBGA |
|---|---|
| Quantity | 1,294 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1020-FBGA (33x33) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1020-BBGA | Number of I/O | 624 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4125 | Number of Logic Elements/Cells | 41250 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3423744 |
Overview of EP1SGX40GF1020I6N – Stratix® GX FPGA, 1020-BBGA
The EP1SGX40GF1020I6N is an industrial-grade Stratix® GX field programmable gate array (FPGA) in a 1020-BBGA (1020-FBGA, 33×33) package. It combines a high-performance logic array with the Stratix GX family’s high-speed serial transceiver architecture to address demanding communications, backplane, and protocol-bridging applications.
With 41,250 logic elements, approximately 3.42 Mbits of embedded memory, and broad I/O and transceiver capabilities described for the Stratix GX family, this device is targeted at designs that require scalable logic capacity, high-bandwidth serial links, and industrial temperature operation.
Key Features
- Logic Capacity — 41,250 logic elements provide a large, scalable fabric for complex digital designs and subsystem integration.
- Embedded Memory — Approximately 3.42 Mbits of on-chip RAM to implement FIFOs, buffers, and memory-intensive logic without external memory for many functions.
- High-Speed Transceiver Family Features — Stratix GX transceivers support serial data rates from 500 Mbps to 3.1875 Gbps and family-level options for 4, 8, 16, or 20 channels; includes CDR, SERDES, programmable VOD, pre-emphasis, equalization, and channel power-down capability.
- I/O Density — Up to 624 I/O pins to support broad interfacing options and dense board-level connectivity.
- DSP & Clocking Resources — High-speed DSP blocks for multiplier and multiply-accumulate implementations, and up to eight general-purpose PLLs for flexible clocking (family feature).
- Packaging & Mounting — Surface-mount 1020-BBGA package (supplier device package: 1020-FBGA, 33×33) for compact board integration.
- Power & Supply — Core voltage supply range of 1.425 V to 1.575 V to match required system power rails.
- Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for deployed industrial environments.
- Standards & Protocol Support (Family) — Family-level support for protocols and interfaces such as XAUI, Gigabit Ethernet, SONET/SDH, PCI Express, Fibre Channel, and Serial RapidIO (as implemented via the Stratix GX transceivers).
- Compliance — RoHS compliant.
Typical Applications
- High-Speed Backplanes — Implements multi-gigabit serial links and dense I/O to enable backplane switching, aggregation, and protocol bridging.
- Chip-to-Chip Interfaces — Provides SERDES-based connectivity and programmable interface widths for high-throughput chip-to-chip data paths.
- Communications Protocol Bridging — Supports transceiver-based protocols (XAUI, GigE, SONET/SDH) for media conversion, protocol adaptation, and line-card logic.
- High-Performance DSP Tasks — Uses on-chip DSP blocks and abundant logic elements for signal processing, filtering, and multiply-accumulate functions.
Unique Advantages
- High Logic Density: 41,250 logic elements enable integration of large custom logic functions and multiple subsystems on a single device, reducing board-level complexity.
- Integrated High-Speed Serial Capability: Stratix GX family transceivers with programmable equalization and pre-emphasis simplify implementation of robust multi-gigabit links.
- Substantial On-Chip Memory: Approximately 3.42 Mbits of embedded RAM reduce dependency on external memory for buffering and packet processing.
- Industrial Reliability: Rated for −40 °C to 100 °C operation and RoHS compliance, supporting deployments in industrial environments.
- Flexible I/O and Packaging: 624 I/Os in a 1020-BBGA package provide high-density interfacing while maintaining a compact board footprint.
- Configurable Clocking and DSP Resources: Built-in PLLs and DSP blocks support demanding timing and signal-processing requirements without external components.
Why Choose EP1SGX40GF1020I6N?
The EP1SGX40GF1020I6N delivers a combination of high logic capacity, substantial embedded memory, and Stratix GX family high-speed serial features in an industrial-grade package. It is suited for engineers designing communications equipment, backplane systems, and high-throughput signal-processing applications that require integrated SERDES capability, flexible clocking, and dense I/O.
Choosing this Stratix GX device offers long-term design scalability via on-chip resources and family-level transceiver functionality, simplifying system architecture and reducing external component count for robust, high-bandwidth designs.
Request a quote or submit a purchase inquiry to get pricing, lead-time, and availability information for EP1SGX40GF1020I6N.

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