EP20K1000CB652C7N

The EP20K1000CB652C7N is an Intel APEX-20KC series Field Programmable Gate Array (FPGA) supplied in a 652‑BGA package. It implements the APEX 20KC MultiCore architecture, combining look-up table (LUT) logic and embedded memory blocks for mid-to-high density programmable logic designs.

Designed for systems that require substantial logic capacity, embedded RAM and flexible I/O, this device targets applications needing up to 38,400 logic elements, approximately 0.328 Mbits of on-chip memory, and up to 488 user I/O pins while operating within a commercial temperature range.

Key Features

• Logic Capacity — Up to 38,400 logic elements and approximately 1,772,000 maximum system gates, enabling complex logic implementations.
• Embedded Memory — Approximately 327,680 bits (≈0.328 Mbits) of RAM available for FIFOs, dual-port RAM, and other memory functions implemented via embedded system blocks (ESBs).
• I/O Flexibility — 488 user I/O pins with MultiVolt I/O support enabling 1.8 V, 2.5 V and 3.3 V interfaces; includes programmable clamp, output slew-rate control and individual tri-state control.
• Clock Management — Up to four PLLs, low-skew clock tree and features for clock phase/delay shifting, multiplication and division to support complex timing requirements.
• High‑Performance Interconnect — Copper interconnect and a four-level FastTrack hierarchical interconnect structure for predictable, lower-latency routing and dedicated carry/cascade chains for arithmetic and high-fan-in functions.
• Low-Power Design — 1.71 V to 1.89 V supply range consistent with a low-voltage internal supply and copper interconnect that helps reduce power consumption.
• Package & Mounting — 652‑BGA package (45×45) with surface-mount mounting type suitable for compact board designs.
• Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C.
• Standards & I/O Features — Series-level support for high-speed interfaces including LVDS channels and PCI-compatible operation for 3.3 V systems, and support for high-speed external memories (per series datasheet).
• RoHS Compliant — Meets RoHS environmental requirements.

Typical Applications

• High-speed data interfaces — Implements LVDS channels and PCI-compatible I/O for boards requiring fast serial/parallel connectivity and interface bridging.
• Memory controllers and buffering — Embedded system blocks and abundant on-chip RAM support FIFO buffers and dual-port RAM for DDR/SDRAM and external-memory interfacing.
• Custom compute and signal processing — Large logic capacity and dedicated arithmetic carry chains enable custom datapaths, counters, and high-throughput logic functions.
• System glue logic and protocol bridging — MultiVolt I/O and extensive programmable I/O features simplify mixed-voltage interfacing and protocol support on complex PCBs.

Unique Advantages

• High logic density: 38,400 logic elements and up to 1,772,000 gates provide headroom for complex designs without partitioning across multiple devices.
• Embedded memory without logic trade-off: Approximately 327,680 RAM bits are available for memory functions without reducing available logic element resources.
• Flexible I/O and multi-voltage support: MultiVolt I/O support for 1.8 V, 2.5 V and 3.3 V interfaces simplifies integration with a range of external components and memory devices.
• Comprehensive clock control: Up to four PLLs and built-in clock features (phase/delay shifting, multiplication/division) enable precise clock domain management.
• Efficient routing and arithmetic support: Copper interconnect and dedicated carry/cascade chains yield predictable routing performance and fast arithmetic operations.
• Proven tool ecosystem: Series-level support for established design tools and megafunction libraries streamlines development and integration.

Why Choose EP20K1000CB652C7N?

The EP20K1000CB652C7N offers a balanced combination of logic capacity, embedded memory and flexible I/O in a 652‑BGA surface-mount package. Its MultiCore APEX-20KC architecture and series-level features such as copper interconnect, dedicated arithmetic chains and multi-PLL clock management make it well suited for mid-to-high complexity FPGA applications that require reliable timing control and significant on-chip resources.

This device is appropriate for design teams building systems that need scalable logic density, integrated memory blocks and adaptable interface support, while operating within commercial temperature limits. The series-level design tools and megafunction support provide a pathway to accelerate development and integration.

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