EP20K1000CF33C7ES

IC FPGA 708 I/O 1020FBGA
Part Description

APEX-20KC® Field Programmable Gate Array (FPGA) IC 708 327680 38400 1020-BBGA

Quantity 914 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1020-FBGA (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1020-BBGANumber of I/O708Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3840Number of Logic Elements/Cells38400
Number of Gates1772000ECCNOBSOLETEHTS Code0000.00.0000
QualificationN/ATotal RAM Bits327680

Overview of EP20K1000CF33C7ES – APEX-20KC® Field Programmable Gate Array (FPGA), 38,400 LEs, ~327,680-bit RAM, 708 I/O, 1020-BBGA

The EP20K1000CF33C7ES is a commercial-grade APEX-20KC® field programmable gate array (FPGA) supplied in a 1020-BBGA surface-mount package. It integrates MultiCore™ architecture with LUT-based logic and embedded memory blocks to deliver high-density programmable logic for system designs that require substantial on-chip RAM and large I/O counts.

Key attributes include 38,400 logic elements, approximately 327,680 bits of embedded RAM, up to 708 user I/O pins, and a supply operating window centered on a 1.8 V internal supply. The device is RoHS compliant and rated for commercial temperature operation from 0 °C to 85 °C.

Key Features

  • Core Architecture MultiCore™ architecture with look-up table (LUT) logic optimized for register-intensive functions and high-density programmable logic.
  • Logic Capacity 38,400 logic elements (LEs) and approximately 1,772,000 maximum system gates (device-class value), enabling complex logic implementation.
  • Embedded Memory Approximately 327,680 bits of on-chip RAM available for FIFOs, dual-port RAM, and other memory functions without reducing available logic.
  • I/O and Interfaces 708 user I/O pins with MultiVolt™ I/O support for 1.8 V, 2.5 V, and 3.3 V interfaces (5.0 V tolerance possible using an external resistor as noted in device documentation). Includes support for high-speed external memories such as DDR and ZBT SRAM and 16 LVDS input/output channels at 840 Mbps per channel (series capability).
  • Clock Management Up to four phase-locked loops (PLLs), a built-in low-skew clock tree, support for up to eight global clock signals, and programmable clock features for phase, delay, multiplication, and division.
  • Interconnect and Arithmetic Support Dedicated carry and cascade chains plus a hierarchical FastTrack® interconnect structure for predictable, high-performance routing and efficient arithmetic implementation.
  • Power and Supply Internal supply voltage centered at 1.8 V; product supply range listed as 1.71 V to 1.89 V. Copper interconnect technology and programmable ESB power-saving modes contribute to efficient operation (series characteristics).
  • Package and Environmental 1020-BBGA (supplier package: 1020-FBGA, 33 × 33 mm) surface-mount package, commercial grade, RoHS compliant, rated for 0 °C to 85 °C operation.
  • Software and Toolchain Support Device-series support in Altera® Quartus® II development software and Altera MegaCore® functions for synthesis, place-and-route, and megafunction integration (series capability).

Typical Applications

  • High-density digital systems — Implement large logic designs and custom digital functions using the device’s 38,400 logic elements and rich interconnect resources.
  • Memory-centric designs — Use the on-chip RAM and ESBs to build FIFOs, dual-port RAM, and buffering for systems that interface with external DDR or ZBT memories.
  • High-I/O connectivity — Deploy in applications requiring many GPIOs or mixed-voltage interfaces, leveraging the 708 user I/O pins and MultiVolt™ I/O support.
  • Clocking and timing-critical systems — Take advantage of up to four PLLs, low-skew clock tree, and programmable clock features for complex clock-domain management.

Unique Advantages

  • High integration density: 38,400 logic elements and ~327,680 bits of embedded RAM consolidate complex logic and memory functions on a single device, reducing BOM and board area.
  • Flexible I/O compatibility: MultiVolt™ I/O support and a large I/O count (708 pins) simplify interfacing across multiple voltage domains and external memory subsystems.
  • Configurable clocking: Multiple PLLs and programmable clock features allow precise clock management across multiple domains without external clocking complexity.
  • Deterministic routing and arithmetic: Dedicated carry and cascade chains plus hierarchical interconnect provide efficient implementation of adders, counters, and wide combinational logic.
  • Commercial-grade, RoHS-compliant package: 1020-BBGA surface-mount package with commercial temperature rating and RoHS compliance for mainstream applications.
  • Established toolchain support: Series-level support in Quartus® II and Altera MegaCore® functions streamlines development, synthesis, and deployment.

Why Choose EP20K1000CF33C7ES?

The EP20K1000CF33C7ES delivers a balanced combination of high logic capacity, embedded memory, and extensive I/O in a commercial-grade FPGA package. Its MultiCore™ LUT-based architecture, dedicated arithmetic chains, and flexible clocking resources make it well suited for designers implementing complex, memory-intensive digital systems that require substantial on-chip RAM and wide external interfacing.

Choose this device when you need a programmable solution that brings together significant logic density, configurable clock management, and multi-voltage I/O in a single 1020-BBGA footprint, with established software support to accelerate development.

Request a quote or submit an inquiry to receive pricing, lead-time, and additional ordering information for EP20K1000CF33C7ES.

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