EP20K1000EFC672-3

The EP20K1000EFC672-3 is an APEX-20KE family FPGA offering a MultiCore architecture that integrates lookup-table (LUT) logic, product-term logic, and embedded memory blocks (ESBs). It provides a mid-to-high density FPGA option with 38,400 logic elements and approximately 327,680 bits of embedded memory, aimed at applications requiring on-chip integration of logic and memory, flexible I/O, and advanced clocking.

Typical use cases include embedded system integration, high-speed I/O interfaces, and designs that benefit from dense logic and on-chip RAM combined with programmable clock management. The device is supplied in a 672-BBGA package and is specified for commercial-grade operation.

Key Features

• Core Architecture: MultiCore architecture that integrates LUT logic, product-term logic, and embedded system blocks (ESBs) for register-intensive and combinatorial functions.
• Logic Capacity: 38,400 logic elements (LEs) enabling substantial on-chip logic integration for mid-to-high density designs.
• Embedded Memory: Approximately 0.328 Mbits of embedded memory (327,680 total RAM bits) for FIFO, dual-port RAM, and CAM implementations using ESBs.
• I/O Resources: 508 general-purpose I/O pins supporting MultiVolt I/O interface levels; programmable clamp and per-pin tri-state control and slew-rate control.
• Clock Management: Flexible clocking with up to four PLLs, a built-in low-skew clock tree, up to eight global clocks, and features for clock delay, multiplication/division, and phase shifting.
• High-Speed Interfaces: Documented support for high-speed external memories and advanced I/O standards including LVDS, SSTL, GTL+, and others; bidirectional I/O performance up to 250 MHz and LVDS performance up to 840 Mbits per channel.
• Power and Supply: Specified supply voltage range of 1.71 V to 1.89 V for VCCINT; designed with low-power operation options and programmable ESB power-saving modes.
• Package & Mounting: 672-BBGA package (supplier package listed as 672-FBGA (27x27)), surface-mount mounting for compact PCB implementation.
• Commercial Temperature Rating: Rated for commercial operation from 0 °C to 85 °C.
• Standards & Test: Embedded JTAG boundary-scan circuitry (per device family documentation) for board-level testability and debug.
• RoHS Compliance: Device is RoHS compliant.

Typical Applications

• Embedded Systems: Implementation of SOPC-style embedded subsystems using integrated LUTs and ESBs to combine logic and on-chip memory for control and processing tasks.
• Memory Interface Controllers: High-speed external memory support and on-chip RAM make the device suitable for DDR/SDRAM controller logic and buffering/FIFO applications.
• High-Speed I/O and Communication: LVDS and other advanced I/O standard support enable multi-channel serial or parallel data interfaces and protocol bridging.
• Prototyping and System Integration: Dense logic element count and flexible clock management facilitate prototyping of complex digital systems and integration of multiple functions on a single device.

Unique Advantages

• High logic and memory density: 38,400 logic elements combined with ~327,680 bits of embedded RAM reduce external component count and simplify board-level design.
• Flexible clocking and timing control: Up to four PLLs, ClockShift, ClockBoost, and ClockLock features provide precise clock management for multi-domain systems.
• Broad I/O capability: 508 I/O pins with MultiVolt support and programmable per-pin features enable interfacing across multiple voltage domains and standards.
• Compact package footprint: 672-BBGA / 672-FBGA (27×27) package supports dense PCB layouts while providing abundant I/O and routing resources.
• Commercial-grade and compliant: Designed for commercial temperature ranges and RoHS compliant for regulatory and manufacturing compatibility.
• Built-in testability: JTAG boundary-scan support simplifies board-level testing and in-circuit debug workflows.

Why Choose EP20K1000EFC672-3?

The EP20K1000EFC672-3 positions itself as a versatile APEX-20KE family FPGA for designs that require a balance of logic capacity, on-chip memory, and flexible I/O. Its MultiCore architecture and ESB resources enable integrated implementations of logic and memory functions, while the rich clocking and I/O capabilities support timing-critical and high-throughput designs.

This device is suitable for development teams and OEMs building embedded subsystems, memory interface controllers, and high-speed I/O applications who need a commercially rated FPGA with substantial on-chip resources and programmable system features.

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