EP20K100QI240-2

IC FPGA 189 I/O 240QFP
Part Description

APEX-20K® Field Programmable Gate Array (FPGA) IC 189 53248 4160 240-BFQFP

Quantity 717 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case240-BFQFPNumber of I/O189Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs416Number of Logic Elements/Cells4160
Number of Gates263000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248

Overview of EP20K100QI240-2 – APEX-20K® Field Programmable Gate Array (FPGA) IC 189 53248 4160 240-BFQFP

The EP20K100QI240-2 is an APEX-20K family FPGA offering a balance of logic capacity, embedded memory, and I/O resources for industrial embedded designs. It implements the APEX MultiCore architecture, which integrates look-up table (LUT) logic, product-term logic, and embedded memory blocks for flexible implementation of register- and memory-intensive functions.

Targeted at industrial applications, this surface-mount FPGA delivers approximately 263,000 system gates, 4,160 logic elements, and around 53 Kbits of on-chip RAM, making it suitable for control, communications, and system-integration tasks where deterministic I/O and operating temperature range matter.

Key Features

  • Core & architecture  MultiCore architecture combining LUT logic, product-term logic, and embedded system blocks (ESBs) for flexible mapping of combinatorial and memory functions.
  • Logic capacity  Approximately 263,000 gates and 4,160 logic elements to implement mid-range logic designs and state machines.
  • Embedded memory  Total on-chip RAM of 53,248 bits (approximately 53 Kbits) suitable for FIFOs, small buffers, and local data storage.
  • I/O resources  189 I/O pins provide broad external connectivity for sensors, peripherals, and external memories; family-level I/O features include support for multiple signaling standards and programmable I/O options.
  • Clock and timing  Family-level clock management includes multiple PLLs, a built-in low-skew clock tree, and features for programmable clock phase and delay control.
  • Power and supply  Specified internal voltage supply range 2.375 V to 2.625 V, with family features for low-power operation and programmable ESB power modes.
  • Package and mounting  240-BFQFP package (supplier device package: 240-PQFP, 32 × 32) in a surface-mount form factor for compact board integration.
  • Operating conditions  Industrial-grade device rated for −40 °C to 100 °C operation and RoHS compliant.

Typical Applications

  • Industrial control  Implement motor control logic, protocol translation, and deterministic I/O handling within the specified industrial temperature range.
  • Communications equipment  Use the on-chip logic and I/O resources for packet processing, interface bridging, and timing-critical tasks.
  • Embedded system integration  Combine logic, embedded memory, and configurable I/O to consolidate glue logic, buffering, and system glue into a single device.
  • Test and measurement  Leverage the device’s logic density and programmable clocks for custom timing, data capture, and signal conditioning applications.

Unique Advantages

  • Configurable mid-range logic density: 4,160 logic elements and roughly 263,000 gates provide a practical balance between capacity and board-level cost for many embedded designs.
  • On-chip memory for buffering: About 53 Kbits of embedded RAM supports FIFOs and local storage without external memory for many control and data-path functions.
  • Robust I/O count: 189 user I/Os enable broad peripheral connectivity while keeping board routing and connector options flexible.
  • Industrial temperature rating: Specified operation from −40 °C to 100 °C for reliable performance in industrial environments.
  • Compact, surface-mount packaging: 240-BFQFP (240-PQFP, 32 × 32) package simplifies PCB layout for space-constrained applications.
  • RoHS compliant: Meets RoHS requirements for lead-free assembly and regulatory alignment.

Why Choose EP20K100QI240-2?

The EP20K100QI240-2 positions itself as a versatile, industrial-grade FPGA option within the APEX-20K family, combining a mid-range logic element count, on-chip RAM, and a substantial number of I/Os in a compact surface-mount package. Its MultiCore architecture and family-level clock and I/O capabilities make it suitable for designers who need to integrate control, buffering, and interface logic without excessive external components.

This device is well suited to engineering teams developing industrial control systems, communications interfaces, and embedded platforms that require predictable thermal behavior, a defined supply voltage window (2.375 V–2.625 V), and RoHS compliance. The combination of logic capacity, embedded memory, and package options provides scalability and board-level efficiency for medium-complexity designs.

Request a quote or submit a parts inquiry today to evaluate EP20K100QI240-2 for your next design. Our team can provide pricing and availability information to support your procurement and design planning.

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