EP20K100TC144-1X

IC FPGA 101 I/O 144TQFP
Part Description

APEX-20K® Field Programmable Gate Array (FPGA) IC 101 53248 4160 144-LQFP

Quantity 479 Available (as of May 4, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFPNumber of I/O101Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs416Number of Logic Elements/Cells4160
Number of Gates263000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248

Overview of EP20K100TC144-1X – APEX-20K® Field Programmable Gate Array (FPGA) IC, 101 I/O, 53,248 RAM bits, 4,160 logic elements, 144-LQFP

The EP20K100TC144-1X is an Intel APEX-20K family FPGA supplied in a 144-pin LQFP surface-mount package. It implements a MultiCore architecture that integrates look-up table (LUT) logic, product-term logic, and embedded memory blocks for compact programmable logic and memory integration.

This device targets commercial embedded designs that require moderate logic capacity, on-chip RAM, flexible I/O, and programmable clock management for system integration and custom logic functions.

Key Features

  • Core architecture  MultiCore architecture combining LUT logic, product-term logic, and embedded system blocks (ESBs) for implementing both register- and memory-intensive functions.
  • Logic capacity  4,160 logic elements (LEs) and up to 263,000 system gates provide capacity for mid-range programmable logic tasks.
  • Embedded memory  Total of 53,248 on-chip RAM bits usable without reducing available logic; ESBs support FIFO, dual-port RAM, and CAM implementations.
  • I/O and interface flexibility  101 user I/O pins with MultiVolt I/O interface support for 1.8 V, 2.5 V, 3.3 V, and 5.0 V signaling and programmable clamp and slew-rate control.
  • Clock management  Flexible clocking with up to four phase-locked loops (PLLs), built-in low-skew clock tree, and features for clock phase/delay control and multiplication/division.
  • Low-power design  Designed for low-power operation with support for 1.8 V and 2.5 V supply domains and ESB programmable power-saving modes.
  • Advanced interconnect  Four-level FastTrack® interconnect architecture and dedicated carry chain for predictable, fast interconnect delays and arithmetic performance.
  • Package and mounting  144-LQFP (144-TQFP, 20×20) surface-mount package; commercial grade with operating temperature range 0 °C to 85 °C.
  • Supply voltage  Internal supply voltage VCCINT is 2.5 V; product supply range listed as 2.375 V to 2.625 V.

Typical Applications

  • Embedded system integration  Implement on-chip memory, FIFOs, and custom logic to consolidate glue logic and system functions in compact embedded platforms.
  • Memory interface controllers  Support for external high-speed memories and ESB memory primitives enables implementation of DDR SDRAM and ZBT SRAM interface logic.
  • Custom I/O bridging and protocol glue  MultiVolt I/O support and programmable I/O features make the device suitable for bridging between different voltage domains and bus standards.
  • Clocked data processing  Multiple PLLs and low-skew clocking support complex clocking requirements for synchronous logic and data-path designs.

Unique Advantages

  • Integrated memory and logic: Embedded system blocks provide on-chip RAM and product-term logic, reducing external memory needs and BOM complexity.
  • Flexible I/O voltage support: MultiVolt I/O compatibility enables direct interfacing with a range of device voltage levels without additional level-shifters.
  • Programmable clocking: Up to four PLLs and clock-shifting features let designers tailor clock domains for complex timing and performance requirements.
  • Predictable interconnect: Four-level FastTrack interconnect and dedicated carry chains simplify timing closure for arithmetic and routed logic paths.
  • Compact surface-mount package: 144-LQFP surface-mount footprint supports PCB designs where board area and package standardization matter.
  • Commercial temperature and supply support: Device is specified for commercial operating temperatures (0 °C to 85 °C) and defined supply ranges for system design planning.

Why Choose EP20K100TC144-1X?

The EP20K100TC144-1X brings APEX-20K MultiCore architecture and embedded memory into a compact 144-LQFP surface-mount package, balancing moderate logic capacity (4,160 logic elements) with 53,248 bits of on-chip RAM and 101 user I/Os. Its combination of programmable logic, ESB memory primitives, MultiVolt I/O support, and flexible clock management makes it well suited for commercial embedded designs that require integrated memory, adaptable I/O, and deterministic clocking.

For developers seeking a mid-range FPGA solution with on-chip memory and a predictable interconnect architecture, this device delivers a clear specification set for integration, board-level design, and system interfacing within commercial temperature and supply parameters.

Request a quote or submit a procurement inquiry to receive pricing and availability for the EP20K100TC144-1X and to discuss quantity, lead time, and sourcing options.

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