EP20K100TC144-3N

IC FPGA 101 I/O 144TQFP
Part Description

APEX-20K® Field Programmable Gate Array (FPGA) IC 101 53248 4160 144-LQFP

Quantity 835 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFPNumber of I/O101Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs416Number of Logic Elements/Cells4160
Number of Gates263000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248

Overview of EP20K100TC144-3N – APEX-20K® Field Programmable Gate Array, 144-LQFP

The EP20K100TC144-3N is an APEX-20K family field programmable gate array (FPGA) in a 144-LQFP surface-mount package. It implements a MultiCore architecture that integrates lookup-table (LUT) logic, product-term logic, and embedded memory blocks for system-on-a-programmable-chip (SOPC) style designs.

With 4,160 logic elements, approximately 53,248 bits of embedded RAM and 101 user I/O pins, this device targets compact system integration tasks that require flexible logic, embedded memory and multi-voltage I/O support while operating from a 2.375 V to 2.625 V supply.

Key Features

  • Core Architecture MultiCore architecture integrating LUT-based logic and product-term logic for a mix of register-intensive and combinatorial functions.
  • Logic Resources 4,160 logic elements (LEs) providing the programmable fabric needed for custom digital functions.
  • Embedded Memory Approximately 53,248 bits of on-chip RAM for FIFOs, dual-port RAM and small-buffer storage.
  • I/O Capacity & Flexibility 101 user I/O pins with MultiVolt I/O interface support (2.5 V, 3.3 V, 5.0 V) for direct interfacing to multiple logic families.
  • Clock and Timing Integrated clock management features from the APEX 20K family including multiple PLLs, a low-skew clock tree and support for multiple global clocks for predictable timing distribution.
  • Performance Metrics Device-level resource equivalence to approximately 263,000 system gates (maximum), enabling significant functional density in a compact package.
  • Power and Voltage Designed for low-power operation with an internal supply operating in the 2.375 V to 2.625 V range.
  • Package & Mounting Surface-mount 144-LQFP (144-TQFP 20×20 footprint) for compact board-level integration.
  • Commercial Temperature Range Specified for 0 °C to 85 °C operation.
  • Compliance RoHS-compliant for modern assembly and regulatory requirements.

Typical Applications

  • System Integration / SOPC: Implement custom system functions and on-chip integration of logic and memory to consolidate discrete components.
  • Memory Interface and Buffering: Use embedded RAM blocks for FIFO and buffer implementations in designs that interface with external memories.
  • Bus and I/O Bridging: Deploy the device for PCI/legacy bus interfacing and multi-voltage signal translation using its MultiVolt I/O capability.
  • High-Speed I/O Designs: Implement LVDS or other high-speed signaling and local, low-skew clocking for timing-sensitive I/O paths.

Unique Advantages

  • Compact, programmable logic in a small package: 4,160 logic elements and roughly 53kbits of embedded RAM deliver substantial functionality in a 144-LQFP footprint to reduce board area.
  • Flexible I/O interfacing: MultiVolt I/O support (2.5 V, 3.3 V, 5.0 V) enables direct connection to a wide range of peripheral voltage domains without complex level-shifting.
  • Integrated clock management: On-chip PLLs and a low-skew clock tree simplify clock distribution and reduce external components for cleaner timing design.
  • Designed for low-power operation: Internal supply centered around 2.5 V and family-level power-saving features help control board-level power budgets.
  • Surface-mount, industry-standard package: 144-LQFP (20×20) provides a familiar footprint for streamlined PCB layout and assembly processes.
  • Commercial temperature and RoHS compliance: Specified 0 °C to 85 °C operation and RoHS compliance support mainstream product development and manufacturing.

Why Choose EP20K100TC144-3N?

The EP20K100TC144-3N delivers a balanced mix of programmable logic, embedded memory and flexible I/O in a compact, RoHS-compliant 144-LQFP package. Its MultiCore architecture and family-level clock management features make it suitable for designs that require integrated logic and memory with reliable timing control and multi-voltage interfacing.

This part is well-suited to engineers and procurement teams building mid-density, integration-focused designs—where reducing BOM, supporting multiple I/O voltage domains and keeping PCB footprint small are priorities. The device’s documented resource set and commercial temperature rating provide clear, verifiable parameters for production designs.

Request a quote or submit a pricing inquiry to obtain availability and lead-time information for EP20K100TC144-3N.

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